Patents by Inventor Xiao Li

Xiao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230313151
    Abstract: The present disclosure discloses the use of gene encoding gibberellin 3?-hydroxylase of G. max, GmGA3ox1. The use of gibberellin 3?-hydroxylase gene of G. max, GmGA3ox1, set forth in SEQ ID NO:1, in genetic engineering of seed weight of Arabidopsis thaliana and Glycine max. In A. thaliana, overexpression of GmGA3ox1 can complement the low seed weight phenotype of atga3ox1 mutant. In G. max, overexpression of the excellent haplotype of the gene can significantly improve the seed weight of G. max.
    Type: Application
    Filed: July 21, 2022
    Publication date: October 5, 2023
    Applicant: Nanjing Agricultural University
    Inventors: Deyue YU, Fang HUANG, Dezhou HU, Hui WANG, Zhongyi YANG, Shaoqi LU, Xiao LI
  • Patent number: 11775758
    Abstract: A computing system obtains computer-readable text comprising an identifier for an entity and an additional word. The computing system computes relevance scores for entries for entities in a computer-implemented knowledge graph upon the text, titles for the entities in the knowledge graph, and descriptions of the entities in the knowledge graph. The computing system determines whether the identifier for the entity is an acronym or a non-acronym. The computing system identifies an entry for the entity in the knowledge graph based upon the relevance scores and whether the identifier for the entity is an acronym or a non-acronym. The computing system generates a link between the identifier for the entity in the text and the entry for the entity in the knowledge graph, where data from the entry for the entity in the knowledge graph is presented to a user upon the link being selected.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: October 3, 2023
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Yujie He, Xiao Li, Wenjin Xu
  • Patent number: 11776877
    Abstract: Method for packaging a semiconductor die assemblies. In one embodiment, a method is directed to packaging a semiconductor die assembly having a first die and a plurality of second dies arranged in a stack over the first die, wherein the first die has a peripheral region extending laterally outward from the stack of second dies. The method can comprise coupling a thermal transfer structure to the peripheral region of the first die and flowing an underfill material between the second dies. The underfill material is flowed after coupling the thermal transfer structure to the peripheral region of the first die such that the thermal transfer structure limits lateral flow of the underfill material.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: October 3, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian, David R. Hembree
  • Publication number: 20230295010
    Abstract: The present application provides a method for recycling selenium sources in a selenium-enriched yeast fermentation process, and a treatment system for selenium-containing wastewater. The method includes: step S1, performing separation and concentration treatments on selenium-containing wastewater produced in a selenium-enriched yeast fermentation process, so as to obtain a selenium-containing concentrated solution; step S2, adjusting a selenium content of the selenium-containing concentrated solution to a predetermined selenium content, so as to obtain a selenium-containing nutrient solution; and step S3, adding the selenium-containing nutrient solution into a selenium-enriched yeast fermentation reaction, so as to realize the recycling of the selenium source.
    Type: Application
    Filed: July 30, 2021
    Publication date: September 21, 2023
    Inventors: Xiuji LIU, Tao XIONG, Xiao LI, Weili DU, Ming ZHAI
  • Publication number: 20230298847
    Abstract: An electron gun for an electron microscope or similar device includes a field emitter cathode having a field emitter protrusion extending from the output surface of a monocrystalline silicon substrate, and electrodes configured to enhance the emission of electrons from a tip portion of the field emitter protrusion to generate a primary electron beam. A contiguous TiN layer is disposed directly on at least the tip portion of the field emitter protrusion using a process that minimizes oxidation and defects in the TiN layer.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 21, 2023
    Inventors: Yung-Ho Alex Chuang, Yinying Xiao-Li, Edgardo García Berríos, John Fielden, Lavinia Ghirardini, Masayoshi Nagao
  • Patent number: 11761024
    Abstract: A system that indicates the presence or absence of microorganisms in fluid food products. The system has a bottle for receiving sample to be tested. The bottle has a sensor that will monitor and detect changes in at least one sample parameter, but no additives that contain nutrients that support microbial growth. The bottle is placed in an incubator and the sensor in the bottle is monitored for changes. The incubator is programed so that, if the sensor detects that the value of the monitored parameter has reached a certain value, then the sample is determined to be positive for microbial growth.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: September 19, 2023
    Assignee: BECTON DICKINSON HOLDINGS PTE LTD.
    Inventors: Xiao Li, Yan Zhang, Jianwei Liu
  • Publication number: 20230284117
    Abstract: The application relates to a method of communication, a device, a chip and a computer readable storage medium. The present disclosure provides a method of communication and related devices, the method of communication including: acquiring address information in a first frame by a first device, wherein the first frame comprises a data field, and the data field carries the address information; determining whether the first frame is from a matched device of the first device according to the address information by the first device. The present disclosure improves signal receiving performance.
    Type: Application
    Filed: December 30, 2022
    Publication date: September 7, 2023
    Inventors: Zhen Wang, Yanzhong Dai, Xiao Li
  • Patent number: 11749666
    Abstract: A semiconductor die assembly in accordance with an embodiment of the present technology includes first and second semiconductor dies and a package substrate carrying the first and second semiconductor dies. The second semiconductor die includes a first peripheral portion extending laterally outward beyond a first edge surface of the first semiconductor die. Similarly, the package substrate includes a second peripheral portion extending laterally outward beyond a second edge surface of the second semiconductor die. The semiconductor die assembly further includes a first volume of molded underfill material between the first and second semiconductor dies, a second volume of molded underfill material between the package substrate and the second semiconductor die, a first molded peripheral structure laterally adjacent to the first edge surface of the first semiconductor die, and a second molded peripheral structure laterally adjacent to the second edge surface of the second semiconductor die.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: September 5, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Bradley R. Bitz, Xiao Li
  • Patent number: 11750708
    Abstract: The present disclosure proposes a proxy method, comprising receiving a request for a service in a first architecture from a requester network function (NF) in a second architecture, obtaining a response of the service from a serving NF on behalf of the requester NF, and sending a further response to the requester NF based on the response of the service. The proxy method may be implemented on a NF or a function entity within a NF.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 5, 2023
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Yidong Yao, Juying Gan, Xiao Li, Gang Ren, Yiming Wu, Deqin Zhan, Hanbing Zhang
  • Publication number: 20230269182
    Abstract: Embodiments of the present invention disclose a flow table processing method. The method is applied to a virtual switch, the virtual switch is connected to M virtual machines and N network interface cards. The method may include establishing a mapping relationship between N port identifiers of N logical ports corresponding to the N network interface cards and a target port identifier, to aggregate the N logical ports into a first port, where the logical port corresponding to each network interface card is a logical port formed by aggregating physical ports of each network interface card based on a link aggregation control protocol (LACP). The method may also include offloading an exact match flow table to the N network interface cards through the first port.
    Type: Application
    Filed: April 26, 2023
    Publication date: August 24, 2023
    Inventors: Lijun LI, Jingbin ZHOU, Xiao LI
  • Publication number: 20230256296
    Abstract: A wrist rehabilitation training system based on muscle coordination and variable stiffness impedance control includes the following modules: an electromyographic signal collection and preprocessing module, a muscle co-decomposition and mapping model obtaining module, a man-machine interactive control module, and a virtual reality serious game module; collects a surface electromyographic signal of a forearm of a user, obtains time-domain coordination through non-negative matrix factorization, establishes a position and stiffness estimation model, and controls motion of a target in a serious game through variable stiffness impedance control, so as to complete a training task.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 17, 2023
    Inventors: Hong ZENG, Yinxin DUAN, Xiao LI, Qingqing CHEN, Aiguo SONG
  • Patent number: 11715615
    Abstract: A light modulated electron source utilizes a photon-beam source to modulate the emission current of an electron beam emitted from a silicon-based field emitter. The field emitter's cathode includes a protrusion fabricated on a silicon substrate and having an emission tip covered by a coating layer. An extractor generates an electric field that attracts free electrons toward the emission tip for emission as part of the electron beam. The photon-beam source generates a photon beam including photons having an energy greater than the bandgap of silicon, and includes optics that direct the photon beam onto the emission tip, whereby each absorbed photon creates a photo-electron that combines with the free electrons to enhance the electron beam's emission current. A controller modulates the emission current by controlling the intensity of the photon beam applied to the emission tip. A monitor measures the electron beam and provides feedback to the controller.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: August 1, 2023
    Assignee: KLA Corporation
    Inventors: Edgardo Garcia Berrios, J. Joseph Armstrong, Yinying Xiao-Li, John Fielden, Yung-Ho Alex Chuang
  • Patent number: 11715685
    Abstract: A method of forming a microelectronic device includes forming a microelectronic device structure. The microelectronic device structure includes a stack structure comprising insulative structures and electrically conductive structures vertically alternating with the insulative structures, pillar structures extending vertically through the stack structure, an etch stop material vertically overlaying the stack structure, and a first dielectric material vertically overlying the etch stop material. The method further includes removing portions of the first dielectric material, the etch stop material, and an upper region of the stack structure to form a trench interposed between horizontally neighboring groups of the pillar structures, forming a liner material within the trench, and substantially filling a remaining portion of the trench with a second dielectric material to form a dielectric barrier structure.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: August 1, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Shuangqiang Luo, Indra V. Chary, Nancy M. Lomeli, Xiao Li
  • Publication number: 20230238746
    Abstract: An electrical connector includes: a housing; a row of first terminals retained in the housing and comprising signal terminals and grounding terminals, each first terminal comprising a plate portion and a leg portion extending out of the housing, the plate portion defining an outer face exposed upon the housing and an inner face opposite the outer face, the outer face of the plate portion of the terminal defining a mating face; a first shielding plate parallel to and located by the inner faces of the first terminals; the first shielding plate defines plural first grounding portions, each first grounding portion defines a vertical cutting face which touches a corresponding inner face of the plate portion of an associated grounding terminal.
    Type: Application
    Filed: January 11, 2023
    Publication date: July 27, 2023
    Inventors: MENG LIU, XIAO-LI LIU, YEN-CHIH CHANG
  • Publication number: 20230234115
    Abstract: An extrusion feedstock material is provided, the material comprising a length of one material extending from a first end to a second end; and at least one slot extending lengthwise within the one material between the first and second ends of the material. A process for extruding conductive material is also provided, the process comprising providing both rotational and axial forces between a die tool and a length of feedstock material to form an extrusion product, wherein the length of feedstock and conductive material comprise Al and NanoCrystalline Carbon Forms (NCCF). A process for extruding material is provided, the process comprising: providing both rotational and axial forces between a die tool and a length of feedstock material to form an extrusion product, wherein the length of feedstock material comprises: a length of material extending from a first end to a second end; and at least one slot extending lengthwise within the material between the first and second ends of the material.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 27, 2023
    Applicant: Battelle Memorial Institute
    Inventors: Keerti S. Kappagantula, Glenn J. Grant, Aditya K. Nittala, Xiao Li, MD. Reza-E-Rabby, WoongJo Choi, Bharat Gwalani, Joshua A. Silverstein
  • Patent number: 11703716
    Abstract: A display apparatus includes a display panel and a backlight module. The backlight module includes: a back plate, a micro light emitting diode light board, and a diffusing plate bracket. The micro light emitting diode light board includes a plurality of through holes, the diffusing plate bracket is arranged in the through holes and fixed on the back plate via the through holes.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: July 18, 2023
    Assignee: Hisense Visual Technology Co., Ltd.
    Inventors: Fulin Li, Nannan Zhang, Mingsheng Qiao, Xiaowei Liu, Xiao Li, Jinlong Li, Weidong Liu, Yushuai Zhai
  • Patent number: 11688664
    Abstract: Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die having a base region, at least one second semiconductor die at the base region, and a thermal transfer device attached to the first and second dies. The thermal transfer device includes an encapsulant at least partially surrounding the second die and a via formed in the encapsulant. The encapsulant at least partially defines a cooling channel that is adjacent to a peripheral region of the first die. The via includes a working fluid and/or a solid thermal conductor that at least partially fills the channel.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: June 27, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Bradley R. Bitz, Xiao Li, Jaspreet S. Gandhi
  • Publication number: 20230185882
    Abstract: A method, system, and computer for balance weighted voting. The method may comprise receiving, by a network interface, a scoring request. The method may further comprise, by a processing unit in response to the scoring request, generating a plurality of scores using a plurality of models. normalizing the plurality of scores, calculating an evaluation-based weighting factor from a first subset of the normalized scores, calculating a prediction-based based weighting factor from a second subset of the normalized scores, and calculating a balanced weighting predictor from the evaluation-based weighting factor and the prediction-based weighting factor. The method may further comprise returning, by the network interface, the balanced weighting predictor as an ensemble score for the scoring request.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 15, 2023
    Inventors: Lei Tian, Han Zhang, Ning Zhang, Xiao Li Zhang, Yi Shao, Jing Xu, Xue Ying Zhang
  • Publication number: 20230185158
    Abstract: A nonlinear crystal including stacked strontium tetraborate SrB4O7 (SBO) crystal plates that are cooperatively configured to create a periodic structure for quasi-phase-matching (QPM) is used in the final frequency doubling stage of a laser assembly to generate laser output light having a wavelength in the range of about 180 nm to 200 nm. One or more fundamental laser beams are frequency doubled, down-converted and/or summed using one or more frequency conversion stages to generate an intermediate frequency light with a corresponding wavelength in the range of about 360 nm to 400 nm, and then the final frequency converting stage utilizes the nonlinear crystal to double the frequency of the intermediate frequency light to generate the desired laser output light at high power. Methods, inspection systems, lithography systems and cutting systems incorporating the laser assembly are also described.
    Type: Application
    Filed: November 21, 2022
    Publication date: June 15, 2023
    Inventors: Yung-Ho Alex Chuang, Kelly Mauser, Baigang Zhang, Xuefeng Liu, John Fielden, Yinying Xiao-Li, Elena Loginova
  • Patent number: D996094
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: August 22, 2023
    Assignee: Shandong Dayijia Household Products Co., Ltd.
    Inventor: Xiao Li