Abstract: A system of providing power to a chip on a mainboard includes: a first power supply, located on the mainboard, and being configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard and disposed at different sides of the chip, each of the second power supply and the third power supply is electrically connected to the first power supply to receive the second voltage, the second power supply provides a third voltage to the chip, the third power supply provides a fourth voltage to the chip, and ZBUS_2?5*(ZPS2_2+ZPDN_2), ZBUS_2 is bus impedance between the first power supply and the third power supply, ZPS2_2 is equivalent output impedance of the third power supply, and ZPDN_2 is transmission impedance between the third power supply and the chip.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first wiring layer, a first insulating layer and a second wiring layer, where the first wiring layer, the first insulating layer and the second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer, where at least part of the first metal winding is wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; a second metal winding, formed in the second wiring layer and wound around the magnetic core, where the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.

Abstract: The present disclosure provides a manufacturing process of a metal winding, where the manufacturing process includes: cutting a first metal copper foil to form a connector and a pin; performing insulation processing on a surface of at least one of the first metal copper foil and a second metal copper foil; bending the first metal copper foil to form a first metal winding to cover on a magnetic core; and covering the second metal copper foil at least partially on a surface of the first metal copper foil to form a second metal winding, and a pin of the first metal winding passes through the second metal winding.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core in a foil structure, and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core in a foil structure, comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring.

Abstract: A system of providing power to a chip on a mainboard includes: a first power supply, located on the mainboard, and being configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard and disposed at different sides of the chip, each of the second power supply and the third power supply is electrically connected to the first power supply to receive the second voltage, the second power supply provides a third voltage to the chip, the third power supply provides a fourth voltage to the chip, and ZBUS_2 ?5*(ZPS2_2+ZPDN_2), ZBUS_2 is bus impedance between the first power supply and the third power supply, ZPS2_2 is equivalent output impedance of the third power supply, and ZPDN_2 is transmission impedance between the third power supply and the chip.

Abstract: A power chip includes: a first power switch, formed in a wafer region and having a first and a second metal electrodes; a second power switch, formed in the wafer region and having a third and a fourth metal electrodes, wherein the first and second power switches respectively constitute an upper bridge arm and a lower bridge arm of a bridge circuit, and the first and second power switches are alternately arranged; and a metal region, at least including a first metal layer and a second metal layer that are stacked, each metal layer including a first to a third electrodes, and electrodes with the same voltage potential in the metal layers are electrically coupled.

Abstract: The disclosure provides a system of providing power to a chip on a mainboard, including: a first power supply, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard, wherein the second power supply and the third power supply are electrically connected to the first power supply; so as to receive the second voltage, the second power supply is disposed at a first side of the chip, the third power supply is disposed at a second side of the chip, the second power supply provides a third voltage to the chip, and the third power supply provides a fourth voltage to the chip.

Abstract: The invention provides a conversion circuit for converting input voltage into output voltage, including: a full-wave rectifier circuit including first and second branches connected in parallel, and each including a secondary winding and a rectifier switch; a first switch branch connected to midpoint of the first branch, and including first to fourth switches connected in series; a first resonant unit connected between connection node of the first and second switches and midpoint of the second branch; a second resonant unit connected between connection node of the third and fourth switches and midpoint of the second branch; a first primary winding connected in series to the first resonant unit; and a capacitor connected between connection node of the second and third switches and midpoint of the second branch. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core in a foil structure, and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core in a foil structure, comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring.

Abstract: The invention provides a conversion circuit for converting input voltage into output voltage, including: a full-bridge rectifier circuit including first and second bridge arms connected in parallel and electrically connected between first and second ends of the output voltage; a first switch branch electrically connected between the first end of the input voltage and the first end of the output voltage, and including first and second switches connected in series to form a first connection node; a first resonant unit electrically connected between the first connection point and midpoint of the first bridge arm; and a first transformer including a first primary winding connected in series with the first resonant unit; and a first secondary winding connected between midpoint of the first bridge arm and midpoint of the second bridge arm. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

Abstract: The invention provides a conversion circuit for converting an input voltage into an output voltage, including: a first full-wave rectifier circuit including a first branch and a second branch connected in parallel, each including a winding and a rectifier switch connected in series to form a midpoint; a first switch branch including a first switch and a second switch connected in series to form a first connection node; and a first resonant unit connected between the first connection node and a midpoint of the second branch, wherein the first resonant unit is not connected in series to the windings of the transformer. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first metal winding and a second metal winding. A first wiring layer, a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from the outside to the inside; the first metal winding is formed on the first wiring layer and winded around the magnetic core in a foil structure; the first insulating layer is at least partially covered by the first metal winding; a second metal winding is formed on the second wiring layer and winded around the magnetic core in a foil structure, wherein the second metal winding is at least partially covered by the first insulating layer, and is at least partially covered by the first metal winding.

Abstract: The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

Abstract: The present disclosure provides a power supply module. The power supply module is applied to an integrated circuit chip assembly which includes a first carrier board and an integrated circuit chip located at a first side of the first carrier board; the power supply module includes: a second carrier board; a first-stage power supply unit; and a second-stage power supply unit, power input terminals of the second-stage power supply unit are electrically connected with corresponding power output terminals of the first-stage power supply unit through the second carrier board; power output terminals of the second-stage power supply unit are electrically connected with corresponding power terminals of the integrated circuit chip, a projection of the second-stage power supply unit on a first plane is at least partially located within a projection range of the integrated circuit chip on the first plane, the first plane is parallel to the first carrier board.

Abstract: The present disclosure provides a power supply module and a manufacture method thereof, belonging to the technical field of power electronics. According to the present disclosure, a unibody conductive member is employed to connect a conductive part in a passive element to a conductive layer in a substrate. This is advantageous in simplifying the structure of the passive element, and enabling a structurally compact power supply module at a reduced cost. Additionally, stacking the passive element with the substrate may allow for a further compact structure for the power supply module, improving the space utilization rate for the power supply module, while enhancing the external appearance of the power supply module with tidiness, simplicity and aesthetics.

Abstract: A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

Abstract: The disclosure provides a system of providing power to a chip on a mainboard. The system comprises at least one preceding-stage power supply module located on a surface of a mainboard, being DC-DC converters, and configured to receive a first DC voltage and to provide a second DC voltage; and at least one post-stage power supply module located on the same surface of the preceding-stage power supply module of the mainboard. Wherein the post-stage power supply module is electrically connected to the preceding-stage power supply module to receive the second DC voltage, the preceding-stage power supply module and the post-stage power supply module are disposed at same side of the chip, the post-stage power supply module provides a third DC voltage to the chip. A profile projection of the preceding-stage power supply module and the corresponding post-stage power supply module are overlapped with each other over 50%.