Patents by Inventor Xiaoming Wu

Xiaoming Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8986923
    Abstract: Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imagable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: March 24, 2015
    Assignee: Promerus, LLC
    Inventors: Brian Knapp, Edmund Elce, Hendra Ng, Andrew Bell, Cheryl Burns, Sridevi Kaiti, Brian Kocher, Yogesh Patel, Masanobu Sakamoto, Xiaoming Wu, Wei Zhang
  • Publication number: 20150022100
    Abstract: The invention is provided with an LED driving device and the control method. The driving device includes power converter, microprocessor and LED circuit. Wherein the power converter includes impulse transformer and switch control circuit. Primary winding at input side of the impulse transformer connects with rectifier filter circuit by the switch control circuit. Secondary winding at output side and auxiliary winding connect with power end of the microprocessor by constant voltage control switch. Output end of the microprocessor connects with LED circuit. The LED driving device and the control method provided by this invention collects on/off signal of mechanical lamp by using switch control circuit. Light is adjusted by LED circuit driven by the microprocessor, and thus heat elimination effect is improved, power consumption is lowered and brightness is enhanced.
    Type: Application
    Filed: March 30, 2012
    Publication date: January 22, 2015
    Inventors: Hong Zhang, Xiaobin Gu, Xiaoming Wu, Laijian Chen, Wei Cheng, Hanniu Gong
  • Patent number: 8888242
    Abstract: Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: November 18, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Jiandong Fang, Xiaoming Wu
  • Publication number: 20140314967
    Abstract: The present invention relates to a water-based pore sealing agent enhancing PCB coating anti-oxidation and anti-corrosion properties, consisting of, by weight, 4-12 parts of a corrosion inhibitor, 15-25 parts of a mixed surfactants system, 10-20 parts of an ion chelating agent, 6-15 parts of a pH regulator, 20-40 parts of a builder, and the rest being purified water. When used to perform pore sealing on a PCB, the water-based pore sealing agent is diluted with purified water first to be diluted 10-100 times, preferably, 100/8-100/3 times. The pH value is 7-11, and is preferably 7.5-9.5. The surface tension is 18-28 dyn/cm. The pore sealing treatment uses a immersion process, and preferably ultrasonic waves are added at the same time to assist in cleaning the pores. For the pore sealing treatment, the temperature is 20-60° C., and the time is 60-150 seconds. After pore sealing, the temperature for drying the coated piece is 80-150° C., and the time is 60-120 seconds.
    Type: Application
    Filed: November 14, 2011
    Publication date: October 23, 2014
    Applicant: TANTZ ENVIRONMENTAL TECHNOLOGIES LTD.
    Inventors: Xiaoming Wu, Yong Lu, Hong Liu, Yinfeng Wu, Qianyuan Liu
  • Publication number: 20140297733
    Abstract: A cloud computing system and a method therein. The cloud computing system includes: a resource server cluster, where the resource server cluster includes at least two resource servers, each resource server in the resource server cluster has at least one type of resources of computing resources and storage resources, and at least one resource server in the resource server cluster has computing resources and storage resources; a computing resource management module configured to manage the computing resources in the resource server cluster, so as to provide a virtual computing service; and a storage resource management module configured to manage a shared storage resource pool established using the storage resources in the resource server cluster, so as to provide a virtual storage service, where storage resources included in each storage resource pool are from at least two resource servers in the resource server cluster.
    Type: Application
    Filed: June 18, 2014
    Publication date: October 2, 2014
    Inventors: Li Wang, Yizhen Xu, Xiaoming Wu
  • Patent number: 8844137
    Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: September 30, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Xiaorong Cai, Jiandong Fang, Xiaoming Wu, Elaine Yeap Money, Eunki Hong, Yimin Guan, Burton Joyner, II, Sean Terrance Weaver, David Graham, Zach Reitmeier
  • Publication number: 20140203114
    Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 24, 2014
    Applicant: FUNAI ELECTRIC CO., LTD.
    Inventors: David BERNARD, Paul DRYER, Bart MANSDORF, Xiaoming WU
  • Patent number: 8785524
    Abstract: A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: July 22, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Xiaoming Wu, Paul Dryer, David Rhine, Anna Pearson, Jeanne Marie Saldanha Singh, Richard Wells, Joel Provence
  • Patent number: 8728715
    Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: May 20, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: David Bernard, Paul Dryer, Bart Mansdorf, Xiaoming Wu
  • Patent number: 8678555
    Abstract: A method for preparing an integrated circuit or micro-electro-mechanical system chip sample for ion cross-section polishing is provided. The method includes preparing a polymer coating formulation. The polymer coating formulation includes a novolac epoxy resin, a bisphenol-A/epichlorhydrin epoxy resin, a photoacid generator, an adhesion promoter, and a mixture of acetophenone, cyclohexanone and butyrolactone organic solvents. The integrated circuit or micro-electro-mechanical system chip sample is encapsulated by the polymer coating formulation, wherein the chip sample is then ready for ion beam cross-section polishing. A cross-section sample of integrated circuit or micro-electro-mechanical system chip is prepared by polishing the obtained polymer encapsulated integrated circuit or micro-electro-mechanical system chip with ion beam cross-section polisher. The disclosed method allows the cross-section sample to be obtained at a reduced polishing time.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: March 25, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Qing Zhang, Xiaoming Wu
  • Publication number: 20140038112
    Abstract: Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imagable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.
    Type: Application
    Filed: October 10, 2013
    Publication date: February 6, 2014
    Applicant: Promerus, LLC
    Inventors: Brian Knapp, Edmund Elce, Hendra Ng, Andrew Bell, Cheryl Burns, Sridevi Kaiti, Brian Kocher, Yogesh Patel, Masanobu Sakamoto, Xiaoming Wu, Wei Zhang
  • Patent number: 8636340
    Abstract: Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: January 28, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Michael J. Dixon, Jiandong Fang, Richard Earl Corley, Jr., Jeanne Marie Saldanha Singh, Frank E. Anderson, Xiaoming Wu
  • Publication number: 20130315346
    Abstract: A dynamic and flexible architecture and methods for demodulation of high data-rate streams with high symbol-rates, such as in satellite communications systems or computer network communications systems, is provided. A data stream of a data transmission is received, the data stream corresponding to a plurality of data symbols. A plurality of data samples corresponding to each of the data symbols is generated. Further, one or more representative data samples, corresponding each of the data symbols, are generated based at least in part on timing control signals and the generated data samples for the respective data symbol. The generated data samples corresponding to each of the data symbols other than the representative data samples are dropped. The timing control signals are then adjusted based at least in part on the generated representative data samples.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 28, 2013
    Applicant: HUGHES NETWORK SYSTEMS, LLC
    Inventors: Krishnaraj Varma, Tony Huang, Xiaoming Wu
  • Patent number: 8580477
    Abstract: Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: November 12, 2013
    Assignee: Promerus LLC
    Inventors: Brian Knapp, Edmund Elce, Andrew Bell, Cheryl Burns, Sridevi Kaiti, Brian Kocher, Hendra Ng, Yogesh Patel, Masanobu Sakamoto, Xiaoming Wu, Linda Zhang
  • Publication number: 20130284694
    Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.
    Type: Application
    Filed: June 24, 2013
    Publication date: October 31, 2013
    Inventors: Xiaorong CAI, Jiandong FANG, Xiaoming WU, Elaine Yeap MONEY, Eunki HONG, Yimin GUAN, Burton JOYNER, II, Sean Terrance WEAVER, David GRAHAM, Zach REITMEIER
  • Publication number: 20130183450
    Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Inventors: David BERNARD, Paul DRYER, Bart MANSDORF, Xiaoming WU
  • Patent number: 8394575
    Abstract: Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: March 12, 2013
    Assignee: Lexmark International, Inc.
    Inventors: Xiaoming Wu, David Graham, Sean Weaver, Bart Mansdorf, Rich Wells, Joel Provence
  • Publication number: 20130048601
    Abstract: A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Inventors: Paul Dryer, David Bernard, David Rhine, Xiaoming Wu, Jing X. Sun, Gary Williams
  • Publication number: 20120293584
    Abstract: Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature to layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
    Type: Application
    Filed: May 20, 2011
    Publication date: November 22, 2012
    Inventors: Jiandong Fang, Xiaoming Wu
  • Publication number: 20120274707
    Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Inventors: Xiaorong Cai, Jiandong Fang, Xiaoming Wu, Elaine Yeap Money, Eunki Hong, Yimin Guan, Burton Joyner, II, Sean Terrance Weaver, David Graham, Zach Reitmeier