Patents by Inventor Xiaoni Xin

Xiaoni Xin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250088110
    Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
    Type: Application
    Filed: November 26, 2024
    Publication date: March 13, 2025
    Inventors: Shouyu Hong, Qingdong Chen, Kai Lu, Pengkai Ji, Xiaoni Xin, Min Zhou, Yu Zhang, Jianhong Zeng
  • Publication number: 20250056722
    Abstract: A high-integration carrier plate and a manufacturing method thereof are disclosed. The carrier plate is configured for a power supply module, the carrier plate includes at least one hollowed-out area, an inductance element is arranged in the hollowed-out area, the inductance element comprises a magnetic core and a winding penetrating through the magnetic core, at least one part of a side wall of the hollowed-out area is provided with a side wall metal piece, the at least one side wall metal piece is used for being electrically connected with one electrostatic potential end of the power supply module, and the inductance element is fixedly connected with the side wall of the hollowed-out area through an insulating bonding medium layer.
    Type: Application
    Filed: August 6, 2024
    Publication date: February 13, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Shouyu Hong, Xiaoni Xin
  • Publication number: 20250037918
    Abstract: The application discloses an inductance assembly and an integrated power converter module. An inductance assembly is arranged on a bottom substrate, after integral plastic packaging, a signal electrical connecting piece is formed on the plastic packaging material through electroplating, and the signal electrical connector extends from the top surface of the inductance assembly to the side surface of the plastic packaging material and then extends to the bottom surface of the bottom substrate. The auxiliary winding is added to the second aspect to be coupled with the main winding to form a TLVR inductor for improving the dynamic performance of the VRM module. The VIN electrical connector is arranged between the main winding and the signal electrical connector, the middle portion of the VIN electrical connector is widened, and the transmission signal on the hopping signal interference signal electrical connector of the main winding is effectively avoided.
    Type: Application
    Filed: July 23, 2024
    Publication date: January 30, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Mingzhun ZHANG, Qingdong CHEN, Xiaoni Xin, Shouyu Hong
  • Publication number: 20250023452
    Abstract: A power chip, includes a metal region; a wafer region. The wafer region includes at least one first partition, forming a first power switch; and at least one second partition, forming a second power switch. The first power switch and the second power switch are electrically connected, a total number of the at least one first partition and the at least one second partition is not less than 3, and the at least one first partition and the at least one second partition are disposed alternatively along a curve.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Applicant: Delta Electronics (Shanghai) CO., LTD.
    Inventors: Xiaoni XIN, Le LIANG
  • Publication number: 20250007384
    Abstract: The application discloses an anti-driving interference power module which comprises at least one half-bridge power module. The half-bridge power module comprises a first switch device, a second switch device, a DC positive terminal and a DC negative terminal. The DC positive terminal, the first switch device, the second switch device and the DC negative terminal form a filtering loop which is the same as the second driving loop of the second switch device. According to the application, through the coupling design of the detour direction of the circuit, the driving crosstalk generated by the gate is inhibited for the device which does not need to be turned on, and mistaken opening of driving is avoided; and for the device needing to be opened, the turn-on level driven by the gate is enhanced, so that the reliability of the power module is higher.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Shouyu Hong, Xiaoni Xin, Dong Xu, Hong Jiang
  • Publication number: 20250007385
    Abstract: The application discloses an ANPC power module. at least one power module, wherein the power module comprises six switch assemblies, a DC end, a GND end and an SW end, the six switch assemblies comprise two outer switches, two inner switches and two clamping switches, wherein an additional capacitor lead-out terminal is arranged at an electrical connection of each of the two inner switches and the two switch bridge arms, the capacitor lead-out terminal is used for setting a high-frequency filter capacitor, and two ends of the high-frequency filter capacitor are electrically connected with the capacitor lead-out terminals corresponding to the two switch bridge arms respectively. The application can effectively improve the instantaneous dynamic voltage spike of the high-frequency switching action, improve the oscillation frequency, increase the working voltage range of the device, and prevent the EMI noise from interference the devices outside of the ANPC power module.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Shouyu Hong, Xiaoni Xin, Jiaoping Huang, Dong Xu, Hong Jiang
  • Publication number: 20240431029
    Abstract: An integrated assembly and an integrated power converter module are disclosed. The integrated assembly includes an inductor assembly and a first capacitor assembly. The top surface of the integrated assembly is provided with an upper surface pin, and the bottom surface is provided with a lower surface pin; the inductor assembly includes a magnetic core and a main winding penetrating through the magnetic core from the top surface to the bottom surface thereof, the main winding is electrically connected with the upper and the lower surface pins, the surface of the magnetic core is provided with a capacitor setting area where the first capacitor assembly is arranged; the bottom surface of the electrode of the first capacitor assembly and the pin of the lower surface of the inductor assembly are coplanar, and the top surface of the first capacitor assembly and the surface of the magnetic core are electrically isolated.
    Type: Application
    Filed: June 25, 2024
    Publication date: December 26, 2024
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Jianhong ZENG, Mingzhun ZHANG, Qingdong CHEN, Xiaoni Xin
  • Patent number: 12159749
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first wiring layer, a first insulating layer and a second wiring layer, where the first wiring layer, the first insulating layer and the second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer, where at least part of the first metal winding is wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; a second metal winding, formed in the second wiring layer and wound around the magnetic core, where the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.
    Type: Grant
    Filed: October 25, 2023
    Date of Patent: December 3, 2024
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Chaofeng Cai, Xiaoni Xin, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Jinping Zhou, Zhiheng Fu, Min Zhou, Yu-Ching Kuo, Tong-Sheng Pan, Wen-Yu Lin
  • Publication number: 20240393815
    Abstract: An ultra-thin voltage regulator module with high current density and an inductor assembly are described. The ultra-thin voltage regulator module comprising at least one inductor assembly, at least one top assembly and a power electrical connection assembly, wherein the inductor assembly is a 2N-phase ultra-thin inductor; the inductor assembly comprises a magnetic core and an inductor winding; the shape of the inductor winding is specifically I-shaped; the power electrical connection assembly comprises a first power electrical connector and a second power electrical connector; the top assembly comprises a top plate and an IPM unit, and the SW end of the IPM unit is perpendicular to the position of the inductor winding.
    Type: Application
    Filed: May 22, 2024
    Publication date: November 28, 2024
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Mingzhun ZHANG, Qingdong CHEN, Xiaoni Xin, Jianhong ZENG
  • Publication number: 20240363282
    Abstract: A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 31, 2024
    Inventors: Chaofeng CAI, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Xiaoni XIN
  • Patent number: 12106895
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: October 1, 2024
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Chaofeng Cai, Xiaoni Xin, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Jinping Zhou, Zhiheng Fu, Min Zhou, Yu-Ching Kuo, Tong-Sheng Pan, Wen-Yu Lin
  • Patent number: 12080465
    Abstract: A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 3, 2024
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Chaofeng Cai, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Xiaoni Xin
  • Publication number: 20240274345
    Abstract: The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a metal wiring layer on an outer side of the insulation layer through a metallization process; and dividing at least part of the metal wiring layer into a multi-turn metal winding through a mechanically dividing process.
    Type: Application
    Filed: April 22, 2024
    Publication date: August 15, 2024
    Inventors: Shouyu HONG, Ganyu ZHOU, Zhiheng FU, Yan TONG, Qingdong CHEN, Xiaoni XIN, Jinping ZHOU, Pengkai JI, Yiqing YE
  • Patent number: 12058814
    Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a first board, a magnetic component, a second board and a power device. The first board includes a conductive component disposed between a first side and a second side opposite to each other. The magnetic component is disposed between the first side and the second side and includes a magnetic core and a winding. A first conductive terminal and a second conductive terminal are led out on the first side and the second side, respectively. The second board is disposed on the first board and includes a third side and a fourth side opposite to each other. The fourth side faces the first side. The power device is disposed on the third side of the second board and electrically connected to the first board.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: August 6, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Shouyu Hong, Jinping Zhou, Min Zhou, Xiaoni Xin, Pengkai Ji, Kai Lu, Le Liang, Zhenqing Zhao
  • Publication number: 20240219982
    Abstract: A system of providing power to a chip on a mainboard includes a first power supply that is located on the mainboard and configured to receive a first voltage and to provide a second voltage; a second power supply and a third power supply that are located on the mainboard and disposed at different sides of the chip, where each of the second power supply and the third power supply is electrically connected to the first power supply to receive the second voltage, the second power supply provides a third voltage to the chip, the third power supply provides a fourth voltage to the chip; and at least one power supply controller that is located on the mainboard and configured to control operation of the second power supply and the third power supply.
    Type: Application
    Filed: March 13, 2024
    Publication date: July 4, 2024
    Applicant: Delta Electronics (Shanghai) CO., LTD.
    Inventors: Haoyi YE, Jianhong ZENG, Xiaoni XIN
  • Patent number: 12002615
    Abstract: The present disclosure provides a magnetic element, a manufacturing method of a magnetic element, and a power module. The magnetic element includes: a magnetic core; and a metal wiring layer, where the metal wiring layer is flat wound on a surface of at least one section of a magnetic column of the magnetic core, the metal wiring layer includes a vertical portion and a horizontal portion, and at least part of the vertical portion forms a multi-turn metal winding by mechanically dividing.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: June 4, 2024
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Shouyu Hong, Ganyu Zhou, Zhiheng Fu, Yan Tong, Qingdong Chen, Xiaoni Xin, Jinping Zhou, Pengkai Ji, Yiqing Ye
  • Patent number: 11966264
    Abstract: A system of providing power to a chip on a mainboard includes: a first power supply, located on the mainboard, and being configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard and disposed at different sides of the chip, each of the second power supply and the third power supply is electrically connected to the first power supply to receive the second voltage, the second power supply provides a third voltage to the chip, the third power supply provides a fourth voltage to the chip, and ZBUS_2?5*(ZPS2_2+ZPDN_2), ZBUS_2 is bus impedance between the first power supply and the third power supply, ZPS2_2 is equivalent output impedance of the third power supply, and ZPDN_2 is transmission impedance between the third power supply and the chip.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: April 23, 2024
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Haoyi Ye, Jianhong Zeng, Xiaoni Xin
  • Publication number: 20240055182
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first wiring layer, a first insulating layer and a second wiring layer, where the first wiring layer, the first insulating layer and the second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer, where at least part of the first metal winding is wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; a second metal winding, formed in the second wiring layer and wound around the magnetic core, where the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 15, 2024
    Inventors: Chaofeng CAI, Xiaoni XIN, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Jinping ZHOU, Zhiheng FU, Min ZHOU, YU-CHING KUO, TONG-SHENG PAN, WEN-YU LIN
  • Publication number: 20240055181
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventors: Chaofeng CAI, Xiaoni XIN, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Jinping ZHOU, Zhiheng FU, Min ZHOU, YU-CHING KUO, TONG-SHENG PAN, WEN-YU LIN
  • Publication number: 20240047135
    Abstract: The present disclosure provides a manufacturing process of a metal winding, where the manufacturing process includes: cutting a first metal copper foil to form a connector and a pin; performing insulation processing on a surface of at least one of the first metal copper foil and a second metal copper foil; bending the first metal copper foil to form a first metal winding to cover on a magnetic core; and covering the second metal copper foil at least partially on a surface of the first metal copper foil to form a second metal winding, and a pin of the first metal winding passes through the second metal winding.
    Type: Application
    Filed: October 16, 2023
    Publication date: February 8, 2024
    Inventors: Chaofeng CAI, Xiaoni XIN, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Jinping ZHOU, Zhiheng FU, Min ZHOU, YU-CHING KUO, TONG-SHENG PAN, WEN-YU LIN