Abstract: Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a plurality of microstrips and a plurality of conductive segments. Individual ones of the conductive segments may be at least partially over at least two microstrips, a dielectric material may be between the plurality of microstrips and the plurality of conductive segments, and the conductive segments are included in a tape.

Abstract: Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a plurality of microstrips and a plurality of conductive segments. Individual ones of the conductive segments may be at least partially over at least two microstrips, a dielectric material may be between the plurality of microstrips and the plurality of conductive segments, and an individual conductive segment may have a conductivity that is close to or less than a conductivity of a conductive line of an individual microstrip.

Abstract: Electronic structures including a dual-stripline with crosstalk cancellation are described. In an example, a printed circuit board (PCB), a package substrate or a semiconductor die includes a dual-stripline structure. The dual-stripline structure includes a first region including a first top line vertically over a first bottom line, and a second top line vertically over a second bottom line. The dual-stripline structure also includes a second region including the first top line vertically over the second bottom line, and the second top line vertically over the first bottom line. The dual-stripline structure also includes a transition region between the first region and the second region. The first bottom line and the second bottom line cross in the transition region.

Abstract: Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a first microstrip; a first surface dielectric region over the first microstrip, wherein the first surface dielectric region has a first thickness, and the first thickness is nonzero; a second microstrip; and a second surface dielectric region over the second microstrip, wherein the second surface dielectric region has a second thickness, the second thickness is nonzero, and the first thickness is different than the second thickness.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

Abstract: Technologies for verifying a de-embedder for interconnect measurement include a verification compute device. The verification compute device is to measure a first signal transmitted through a single device under test and measure a second signal transmitted through a duplicated set of devices under test. Each device under test in the duplicated set is substantially identical to the single device under test. Additionally, the verification compute device is to apply a de-embedder to the measured first signal to remove an effect of test fixtures on the measured first signal, apply the de-embedder to the measured second signal to remove the effect of the test fixtures on the measured second signal, concatenate the de-embedded first signal with itself to generate a concatenated de-embedded first signal, and compare the concatenated de-embedded first signal with the de-embedded second signal to determine whether the concatenated de-embedded first signal matches the de-embedded second signal.

Abstract: An apparatus may comprise a skew detection circuit to sample a common mode voltage of a differential signal, wherein the sampled common mode voltage is indicative of an amount of skew between a first signal of the differential signal and a second signal of the differential signal; and a skew compensation circuit to adjust a delay of the first signal or the second signal based on the sampled common mode voltage to reduce the amount of skew.

Abstract: Embodiments may relate to a connector. The connector may include a plurality of connector pins that are to communicatively couple an element of a printed circuit board (PCB) with an element of an electronic device when the element of the PCB and the element of the electronic device are coupled with the connector. The connector may also include an active circuit that is communicatively coupled with a pin of the plurality of pins. The active circuit may be configured to match an impedance of the element of the PCB with an impedance of the element of the electronic device. Other embodiments may be described or claimed.

Abstract: Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.

Abstract: A printed circuit board, according one embodiment, includes a reference layer; a dielectric layer disposed on the reference layer; and a conductor layer adhered to the dielectric layer with an adhesive layer disposed between the dielectric layer and the conductor layer. The conductor layer has a smooth surface facing the dielectric layer having a roughness (Rz) of less than two microns.

Abstract: Technologies for verifying a de-embedder for interconnect measurement include a verification compute device. The verification compute device is to measure a first signal transmitted through a single device under test and measure a second signal transmitted through a duplicated set of devices under test. Each device under test in the duplicated set is substantially identical to the single device under test. Additionally, the verification compute device is to apply a de-embedder to the measured first signal to remove an effect of test fixtures on the measured first signal, apply the de-embedder to the measured second signal to remove the effect of the test fixtures on the measured second signal, concatenate the de-embedded first signal with itself to generate a concatenated de-embedded first signal, and compare the concatenated de-embedded first signal with the de-embedded second signal to determine whether the concatenated de-embedded first signal matches the de-embedded second signal.

Abstract: Technologies for verifying a de-embedder for interconnect measurement include a verification compute device. The verification compute device is to measure a first signal transmitted through a single device under test and measure a second signal transmitted through a duplicated set of devices under test. Each device under test in the duplicated set is substantially identical to the single device under test. Additionally, the verification compute device is to apply a de-embedder to the measured first signal to remove an effect of test fixtures on the measured first signal, apply the de-embedder to the measured second signal to remove the effect of the test fixtures on the measured second signal, concatenate the de-embedded first signal with itself to generate a concatenated de-embedded first signal, and compare the concatenated de-embedded first signal with the de-embedded second signal to determine whether the concatenated de-embedded first signal matches the de-embedded second signal.

Abstract: Embodiments may relate to a connector. The connector may include a plurality of connector pins that are to communicatively couple an element of a printed circuit board (PCB) with an element of an electronic device when the element of the PCB and the element of the electronic device are coupled with the connector. The connector may also include an active circuit that is communicatively coupled with a pin of the plurality of pins. The active circuit may be configured to match an impedance of the element of the PCB with an impedance of the element of the electronic device. Other embodiments may be described or claimed.

Abstract: A printed circuit board, according one embodiment, includes a reference layer; a dielectric layer disposed on the reference layer; and a conductor layer adhered to the dielectric layer with an adhesive layer disposed between the dielectric layer and the conductor layer. The conductor layer has a smooth surface facing the dielectric layer having a roughness (Rz) of less than two microns.

Abstract: Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.

Abstract: Generally, this disclosure provides systems and devices for reduction of crosstalk between routed signals. A system may include a first pair of signal lines and a second pair of signal lines and each of the pairs of signal lines include a positive signal line and a negative signal line to transmit a differential signal. The system may also include an alternating current coupling capacitor (AC cap) associated with each of the positive signal lines and each of the negative signal lines. The system may further include a routing crossover of the positive signal line and the negative signal line of the second pair of signal lines, to decrease signal crosstalk between the first and second pairs of signal lines. The routing crossover may include at least one of the AC caps.

Abstract: Technologies for verifying a de-embedder for interconnect measurement include a verification compute device. The verification compute device is to measure a first signal transmitted through a single device under test and measure a second signal transmitted through a duplicated set of devices under test. Each device under test in the duplicated set is substantially identical to the single device under test. Additionally, the verification compute device is to apply a de-embedder to the measured first signal to remove an effect of test fixtures on the measured first signal, apply the de-embedder to the measured second signal to remove the effect of the test fixtures on the measured second signal, concatenate the de-embedded first signal with itself to generate a concatenated de-embedded first signal, and compare the concatenated de-embedded first signal with the de-embedded second signal to determine whether the concatenated de-embedded first signal matches the de-embedded second signal.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

Abstract: Generally discussed herein are systems, apparatuses, and methods that relate to reducing crosstalk in a differential signal pair. According to an example, a device may include a first pair of differential signal lines comprising a first signal line and a second signal line proximate the first signal line, the first signal line and the second signal line separated from each other along a first line, and a second pair of differential signal lines comprising a third signal line proximate a fourth signal, the third signal line and the fourth signal separated from each other along a second line generally perpendicular to the first line.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.