Patents by Inventor Xiaoning Ye

Xiaoning Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reducing signal crosstalk of edge-card connector
    Publication number: 20070149060
    Abstract: In some embodiments an edge-card connector includes a signal layer, a ground layer, an edge finger, a ground plane on the ground layer that is recessed a portion of the edge finger, and a ground section on the signal layer that is coupled to the ground plane. Other embodiments are described and claimed.
    Type: Application
    Filed: December 27, 2005
    Publication date: June 28, 2007
    Inventor: Xiaoning Ye
  • System and method to control signal line capacitance
    Publication number: 20070075405
    Abstract: A system may include a conductive plane defining a non-conductive antipad area and a second non-conductive area extending from the antipad area in at least a first direction, a dielectric plane coupled to the conductive plane, a conductive via passing through the dielectric plane and the antipad area, a conductive pad connected to an end of the conductive via, and a conductive trace coupled to the dielectric plane and connected to the conductive pad, the conductive trace extending from the conductive pad in the first direction.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventor: Xiaoning Ye
  • Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby
    Patent number: 7034544
    Abstract: Methods and apparatus that minimize the impedance discontinuity between a component and a signal trace is described. The methods and apparatus generally comprise at least one signal trace disposed on a dielectric layer, wherein the signal trace comprises a first width which is wider than a second width, a via connected to the first width of the signal trace, and a component electrically attached to the via, wherein an impedance discontinuity between the signal trace and the component is lowered.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: April 25, 2006
    Assignee: Intel Corporation
    Inventors: Xiaoning Ye, Dennis Miller, Jerry D. Bolen
  • Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby
    Publication number: 20040263181
    Abstract: Methods and apparatus that minimize the impedance discontinuity between a component and a signal trace is described. The methods and apparatus generally comprise at least one signal trace disposed on a dielectric layer, wherein the signal trace comprises a first width which is wider than a second width, a via connected to the first width of the signal trace, and a component electrically attached to the via, wherein an impedance discontinuity between the signal trace and the component is lowered.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Xiaoning Ye, Dennis Miller, Jerry D. Bolen