Patents by Inventor Xiaoying (Janet) He

Xiaoying (Janet) He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12026384
    Abstract: Aspects of a storage device including a memory and a controller are provided. In certain aspects, the controller may determine that data stored on a first block satisfies a threshold data-error condition, the data comprising invalid data and valid data. For example, the first block may have a high ratio of valid data to invalid data that satisfies or exceeds a threshold value. In certain aspects, the controller may determine a close block boundary associated with the first block, wherein the close block boundary is configured to bifurcate the first block into a first portion and a second portion, wherein the first portion comprises the data. For example, the controller may determine a boundary defined by a data length, an indirection mapping unit, a physical program boundary, etc.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: July 2, 2024
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Ji-Hyun In, Yosief Ataklti, Aajna Karki, Hongmei Xie, Xiaoying Li
  • Publication number: 20240214989
    Abstract: The present disclosure describes methods, system, and devices for determining a location of paging early indication (PEI). One method includes receiving, by a user equipment (UE), configuration information of a paging early indication occasion (PEI-O), wherein the configuration information comprises a frame-level offset list and a symbol-level offset list, the frame-level offset list comprises one or more frame-level offset, and the symbol-level offset list comprises one or more symbol-level offset; and detecting, by the UE, a paging early indication (PEI) in the PEI-O, wherein the PEI-O is determined by a frame-level offset from a start of a first paging frame (PF) of at least one PF associated with the PEI-O to a reference point and a symbol-level offset from the reference point to a start of a first physical downlink control channel (PDCCH) monitor occasion of the PEI-O.
    Type: Application
    Filed: March 11, 2024
    Publication date: June 27, 2024
    Applicant: ZTE Corporation
    Inventors: Xuan MA, Mengzhu Chen, Jun Xu, Focai Peng, Xiaoying Ma
  • Publication number: 20240213169
    Abstract: An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer including a cavity formed through the glass core layer; a glass core layer active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer; a second buildup layer contacting a second surface of the glass core layer; and a mold layer contacting a surface of the first buildup layer. The mold layer includes a mold layer active component die disposed in the mold layer, and the first buildup layer includes electrically conductive interconnect providing electrical continuity between the glass core layer active component die and the mold layer active component die. The top surface active component die is attached to the top surface of the substrate and electrically connected to the mold layer active component die.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington, Jeremy D. Ecton, Brandon C. Marin
  • Publication number: 20240213116
    Abstract: Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates are disclosed. An example glass core of an integrated circuit (IC) package disclosed herein includes a fluid inlet to receive a cooling fluid, a fluid outlet, and a channel to fluidly couple the fluid inlet to the fluid outlet, the cooling fluid to flow through the channel from the fluid inlet to the fluid outlet, the channel fluidly isolated from one or more vias extending between a first surface and a second surface of the glass core.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Kyle Arrington, Bohan Shan, Haobo Chen, Ziyin Lin, Hongxia Feng, Yiqun Bai, Dingying Xu, Xiaoying Guo, Bai Nie, Srinivas Pietambaram, Gang Duan
  • Publication number: 20240213170
    Abstract: An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer having a glass core layer active component die disposed in a cavity and a discrete passive component disposed in another cavity; a mold layer including a mold layer active component die disposed in the mold layer; and a buildup layer contacting a top surface of the glass core layer and a bottom surface of the mold layer. The buildup layer includes electrically conductive interconnect connecting the glass core layer active component die, the discrete passive component, and the mold layer active component die. The top surface of the component die is electrically connected to the mold layer active component die.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Applicant: Intel Corporation
    Inventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington, Jeremy D. Ecton, Brandon C. Marin
  • Publication number: 20240215269
    Abstract: An electronic system includes a substrate that includes a glass core layer including a cavity formed through the glass core layer; at least one active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer and a first surface of the at least one active component die, wherein the first buildup layer includes electrically conductive interconnect contacting the at least one active component die and extending to a first surface of the substrate; a second buildup layer contacting a second surface of the glass core layer and a second surface of the at least one active component die; and one or more solder bumps on a second surface of the substrate and contacting the second surface of the at least one active component die.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington
  • Publication number: 20240214867
    Abstract: Embodiments of this application provide a data transmission method and an apparatus. A first access network device receives first indication information from a core network device. The first indication information indicates that a first quality of service QoS flow of a first terminal device has an association relationship with a second QoS flow of a second terminal device. The first access network device schedules, based on the first indication information, data transmission of the first terminal device and the second terminal device.
    Type: Application
    Filed: March 6, 2024
    Publication date: June 27, 2024
    Inventors: Qiang FAN, Xiaoying XU
  • Patent number: 12020412
    Abstract: A system is provided that includes an image sensor coupled to a vehicle, and control circuitry configured to perform operations including receiving, from the image sensor, an input stream comprising high dynamic range (HDR) image data associated with an environment of the vehicle, and processing the input stream at the vehicle by applying a global tone mapping, followed by offline image processing that can include applying a local tone mapping to the globally tone mapped images of the same input stream.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: June 25, 2024
    Assignee: Waymo LLC
    Inventors: Xiaoying He, Ryan Geiss, Pieter Kapsenberg, Carl Warren Craddock, Zhinan Xu, Lucian Ion, Ajay Chandra Venkata Gummalla
  • Patent number: 12022517
    Abstract: A data sending method includes: receiving, by a terminal device, configuration information sent by a network device, where the configuration information is used to configure a non-scheduling resource; and starting, by the terminal device when a condition is met, a first timer, where the non-scheduling resource is not used for sending uplink data within duration of the first timer. According to the method, a timer is set on the terminal device, and the timer is used to instruct the terminal device whether to send data on a non-scheduling resource. Therefore, a data sending success rate and a communication latency of the terminal device can be effectively balanced.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: June 25, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiaoying Xu, Qufang Huang, Qinghai Zeng
  • Publication number: 20240203806
    Abstract: An electronic device, including layers, formed from a material that can remain substantially constant in structure, such as glass. The layer can be preformed with through glass vias that support at least one electrically conductive interconnect. The through glass via can have an edge region that can be substantially coplanar with an exposed surface of the layer.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 20, 2024
    Inventors: Bohan Shan, Bai Nie, Leonel R. Arana, Dingying XU, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Jeremy D. Ecton, Haobo Chen, Bin Mu
  • Publication number: 20240203247
    Abstract: This technology provides an Autonomous Vehicle (AV) Intelligent Driving System (IDS) that includes a sensing module for gathering driving environment data and an onboard unit (OBU) for vehicle control. The OBU features a vehicle control module and communication modules for guidance-level interaction with Traffic Control Centers (TCC/TCU) and Roadside Units (RSUs). The system receives targeted guidance instructions and information, such as vehicle maneuvering, safety maintenance, traffic control, and special conditions, to enhance driving tasks. The IDS collaborates with TCC/TCU and RSUs, providing redundancy and a fail-safe mechanism for increased safety and reliability. The system is designed with wireless communication capabilities for efficient information exchange and is applicable to connected and automated vehicles (CAVs).
    Type: Application
    Filed: March 4, 2024
    Publication date: June 20, 2024
    Inventors: Bin Ran, Renfei Wu, Xiaoying Yi, Zhi Zhou, Junwei You, Eric Ran, Yang Cheng, Tiani Chen, Shen Li, Jing Jin, Xiaoxuan Chen, Fan Ding, Zhen Zhang
  • Publication number: 20240203248
    Abstract: This technology provides an Autonomous Vehicle (AV) Intelligent Driving System (IDS) that uses weather information or special information to provide vehicle operation or control. The Onboard Unit (OBU) uses a traffic control center/traffic control unit (TCC/TCU) communication module or a roadside unit (RSU) communication module to receive vehicle-specific targeted weather information and/or special information at the Guidance Level of vehicle driving tasks from the TCC/TCU or the RSU. The special information comprises activity, accidents, and hazards/obstacles information. The vehicle control module enhances driving safety by integrating vehicle-specific weather, pavement condition, activity, accidents, and hazards/obstacles information.
    Type: Application
    Filed: March 4, 2024
    Publication date: June 20, 2024
    Inventors: Bin Ran, Xiaoying Yi, Luyang Wang, Junwei You, Eric Ran, Yang Cheng, Tianyi Chen, Shen Li, Jing Jin, Xiaoxuan Chen, Fan Ding, Zhen Zhang
  • Publication number: 20240203853
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include a substrate, a via, a build-up layer, a top layer, and one or more dies. The substrate can include a conductor coating. The via can be connected to the conductor coating. The build-up layer can be on the substrate. The build-up layer can define a channel that the via is formed within and insulate the via during operation of the electronic device. The top layer can be interproximal to the substrate and the via. The one or more dies can be connected to the via.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 20, 2024
    Inventors: Bohan Shan, Haobo Chen, Hongxia Feng, Julianne Troiano, Dingying Xu, Matthew Tingey, Xiaoying Guo, Srinivas Venkata Ramanuja Pietambaram, Bai Nie, Gang Duan, Bin Mu, Kyle Mcelhinny, Ashay A. Dani, Leonel R. Arana
  • Patent number: 12011710
    Abstract: Bulk catalysts comprised of nickel, molybdenum, tungsten and titanium and methods for synthesizing bulk catalysts are provided. The catalysts are useful for hydroprocessing, particularly hydrodesulfurization and hydrodenitrogenation, of hydrocarbon feedstocks.
    Type: Grant
    Filed: June 29, 2023
    Date of Patent: June 18, 2024
    Assignee: CHEVRON U.S.A. INC.
    Inventors: Xiaoying Ouyang, Viorel Duma, Alexander Kuperman, Ibrahim Uckung, Theodorus Ludovicus Michael Maesen, Axel Brait, Charles Wilson
  • Publication number: 20240189801
    Abstract: Bulk catalysts comprised of nickel, molybdenum, tungsten and titanium and methods for synthesizing bulk catalysts are provided. The catalysts are useful for hydroprocessing, particularly hydrodesulfurization and hydrodenitrogenation, of hydrocarbon feedstocks.
    Type: Application
    Filed: June 29, 2023
    Publication date: June 13, 2024
    Applicant: Chevron U.S.A. Inc.
    Inventors: Xiaoying OUYANG, Viorel DUMA, Alexander KUPERMAN, Ibrahim UCKUNG, Theodorus Ludovicus Michael MAESEN, Axel BRAIT, Charles WILSON
  • Publication number: 20240191744
    Abstract: The invention proposes a kind of bending bolt type anti-loosening nut, which relates to the technical field of mechanical fastening. It comprises an upper nut and a lower nut, the upper nut and the lower nut are stacked on the outside of the bolt and used to tightly connect the bolt to the connecting piece, the lower nut is arranged close to the connecting piece, the upper nut is arranged on the outer end surface of the lower nut; the adjacent end between the upper nut and lower nut is provided with an inclined surface, the inclined surface is inclined towards the interior of the upper nut, so that an inclined plane angle with deformation space between the upper nut and lower nut is formed; the invention achieves the effect of preventing nut loosening, is low in price, easy to manufacture, and suitable for small or miniature anti-loosening nuts.
    Type: Application
    Filed: November 30, 2023
    Publication date: June 13, 2024
    Inventors: Qing Liu, Yu Liu, Quanxi Liu, Xuyang Liu, Ting Gao, Ming Liu, Junfeng Liu, Meng Fan, Xiaohong Wang, Xiaoying Wang, Peng Wang, Wei Wang, Jie Fan, Jianyi Liu
  • Publication number: 20240186228
    Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a dielectric material and a plurality of metal vias within the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus. The metal vias electrically couple a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a plurality of build-up layers on the core layer, the build-up layers comprising metal vias electrically connected to the metal vias of the core layer.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Haobo Chen, Bohan Shan, Kyle J. Arrington, Yiqun Bai, Kristof Darmawikarta, Gang Duan, Jeremy D. Ecton, Hongxia Feng, Xiaoying Guo, Ziyin Lin, Brandon Christian Marin, Bai Nie, Srinivas V. Pietambaram, Dingying Xu
  • Publication number: 20240181411
    Abstract: A dissolver capable of increasing the dissolution rate, includes a tank body, a feeding pipe, a connecting moveable rod, and a moveable disc, the feeding pipe is communicated with the tank body, and being configured to flow raw materials into the tank body. The connection movable plate is slidably mounted inside the feeding pipe, the raw materials flows into the tank body or is prevented flowing when the connection movable plate slides from an inner front side to an inner rear side of the feeding pipe. The connecting moveable rod, provided with an end inserted into the feeding pipe to connect to the connection moveable plate, and the other end exposed outside the feeding pipe. The moveable disc is connected to the other end of the connecting moveable rod, and driven to rotate and enable the connection movable plate slide inside of the feeding pipe.
    Type: Application
    Filed: October 23, 2023
    Publication date: June 6, 2024
    Applicant: Shandong Laiwei New Materials Co., Ltd
    Inventors: Yi Ren, Xiulun Wu, Xiaoying Bu
  • Publication number: 20240182276
    Abstract: The present application relates to a stopping method and apparatus for a device with a hoisting mechanism and a crane. The method includes: generating a displacement change rate according to position offset information of a hoisting handle of the device when the position offset information meets a triggering condition; comparing the displacement change rate with a preset threshold to generate a stopping control instruction; and controlling an overhead system of the device to perform deceleration stopping according to the stopping control instruction. The stopping method and apparatus for the device with the hoisting mechanism, the crane, the electronic device and the computer readable medium involved in the present application may achieve the purpose of rapid stopping control only through the hoisting handle of the device, and reduce the requirement for the driver's reaction time and increase the safety of the device when emergency stopping is required.
    Type: Application
    Filed: April 1, 2022
    Publication date: June 6, 2024
    Applicant: Zoomlion Heavy Industry Science and Technology Co., Ltd.
    Inventors: Biao OU, Ling FU, Xiaoying YU, Yanbin LIU, Wenkun LONG, Qiang HE, Li YIN
  • Publication number: 20240186227
    Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a plurality of metal vias electrically coupling a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a build-up layer on the first side of the core layer, the build-up layer comprising metal vias within a dielectric material and electrically connected to the metal vias of the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Haobo Chen, Bohan Shan, Kyle J. Arrington, Kristof Darmawikarta, Gang Duan, Jeremy D. Ecton, Hongxia Feng, Xiaoying Guo, Ziyin Lin, Brandon Christian Marin, Srinivas V. Pietambaram, Dingying Xu