Patents by Inventor Xiaoying (Janet) He

Xiaoying (Janet) He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GLASS SUBSTRATE FABRICATION USING HYBRID BONDING
    Publication number: 20240222210
    Abstract: An integrated circuit device substrate includes a first glass layer, a second glass layer, and a dielectric interface layer between the first glass layer and the second glass layer. A plurality of conductive pillars extend through the first glass layer, the dielectric layer and the second glass layer, wherein the conductive pillars taper from a first diameter in the dielectric layer to a second diameter in the first glass layer and the second glass layer, and wherein the first diameter is greater than the second diameter.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Intel Corporation
    Inventors: Bohan Shan, Haobo Chen, Bai Nie, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Kyle Jordan Arrington, Ziyin Lin, Hongxia Feng, Yiqun Bai, Xiaoying Guo, Dingying Xu, Kristof Darmawikarta
  • SYNTHETIC TESTING
    Publication number: 20240223489
    Abstract: The disclosure describes one or more techniques for performing automated scheduling and/or orchestration of synthetic tests for network sites. For example, a network management system comprises a memory and one or more processors in communication with the memory and configured to: determine, based on data received from a plurality of network devices of a network, a network condition to perform a test, wherein the network condition comprises one or more of a time window to perform the test or one or more network devices of the plurality of network devices to perform the test; instruct, based on the network condition, the one or more network devices to perform the test; identify, based on data obtained from the one or more network devices that performed the test, an issue of the network; and perform an action based on the identified issue.
    Type: Application
    Filed: December 22, 2023
    Publication date: July 4, 2024
    Inventors: Xiaoying Wu, Jacob Thomas, Wesley Purvis, Gorakhanath Kathare, Gurpreet Singh, Rinoob Babu, Prathamesh Dnyanesh Kumkar, Huan Thien Vu, Aftab Ahmed Shaikh
  • METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES
    Publication number: 20240222301
    Abstract: Methods and apparatus for optical thermal treatment in semiconductor packages are disclosed. A disclosed example integrated circuit (IC) package includes a dielectric substrate, an interconnect associated with the dielectric substrate, and light absorption material proximate or surrounding the interconnect, the light absorption material to increase in temperature in response to being exposed to a pulsed light for thermal treatment corresponding to the IC package.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Inventors: Bohan Shan, Hongxia Feng, Haobo Chen, Srinivas Pietambaram, Bai Nie, Gang Duan, Kyle Arrington, Ziyin Lin, Yiqun Bai, Xiaoying Guo, Dingying Xu, Sairam Agraharam, Ashay Dani, Eric J. M. Moret, Tarek Ibrahim
  • ROTATING CONSTRUCTION PLATFORM BASED ON MONOPILE
    Publication number: 20240218625
    Abstract: The present disclosure relates to a rotating construction platform based on a monopile, including a rotary connecting mechanism set on the top of the monopile and a working platform set on the rotary connecting mechanism. The rotary connecting mechanism includes an upper connecting tube, a lower connecting tube and a rotary support structure located between the upper connecting tube and the lower connecting tube. The working platform is fixedly connected to the upper connecting tube, and the lower connecting tube is detachably fixed to the top of the monopile. At least one side of the working platform sticks out of the side of the monopile. The rotating construction platform of the present disclosure can improve the continuity of construction operations, save construction time and costs, avoid vessel machinery from hitting monopile, improve construction positioning accuracy and ensure construction quality.
    Type: Application
    Filed: August 20, 2021
    Publication date: July 4, 2024
    Applicants: Shanghai Investigation, Design & Research Institute Co., Ltd., HuaNeng Jiangsu Clean Energy Branch
    Inventors: Zeyang LYU, Dongzhen WANG, Juan JIANG, Zhenghua YANG, Xiaolu CHEN, Zhaofeng HANG, Chunyu GUAN, Lihua YANG, Zhongyuan YAO, Yang HUA, Xiaoying CAI, Mingjiang LIU, Yu ZHANG, Qihui YAN
  • GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
    Publication number: 20240222257
    Abstract: A substrate for an electronic system includes a glass core layer. The glass core layer includes a first surface and a second surface opposite the first surface; and at least one through-glass via (TGV) extending through the glass core layer from the first surface to the second surface. The TGV includes an opening filled with an electrically conductive material; and a via liner including a sidewall material disposed on a sidewall of the opening between the glass of the glass core layer and the electrically conductive material, wherein the sidewall material includes carbon.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Inventors: Bohan Shan, Haobo Chen, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Yiqun Bai, Dingying Xu, Bai Nie, Kyle Jordan Arrington, Ziyin Lin, Rahul N. Manepalli, Brandon C. Marin, Jeremy D. Ecton
  • THIRD-PARTY SERVICE AND APPLICATION DATA FOR QUALITY OF SERVICE
    Publication number: 20240220389
    Abstract: Techniques are disclosed for a network management system (NMS) that performs quality of service (QOS) monitoring and troubleshooting of user experience issues occurring outside of a network managed by the NMS using data obtained from third-party sources. For example, an NMS obtains third-party data of a third-party application server or third-party service provider server from a third-party monitoring vendor. The NMS identifies a user experience issue indicated by the third-party data and stitches the third-party data to network data received from network devices. The NMS determines a root cause or a remedial action of the user experience issue based at least on the network data received from the one or more network devices. The NMS generates a notification for presentation to an administrator device which identifies the root cause or the remedial action of the user experience issue.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Inventors: Xiaoying Wu, Jisheng Wang, Prashant Kumar, Pawan Gandhi
  • METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES
    Publication number: 20240222304
    Abstract: Methods and apparatus to reduce solder bump bridging between two substrates. An apparatus includes a first substrate including a first bump and a second bump spaced apart from the first bump, the first bump including a first base, the second bump including a second base; and a second substrate including a third bump and a fourth bump spaced apart from the third bump, the third bump including a third base, the fourth bump including a fourth base, the first base electrically coupled to the third base by first solder, the second base electrically coupled to the fourth base by second solder, the first solder having a first volume, the second solder having a second volume, the first volume less than the second volume.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 4, 2024
    Inventors: Bohan Shan, Jiaqi Wu, Haobo Chen, Srinivas Pietambaram, Bai Nie, Gang Duan, Kyle Arrington, Ziyin Lin, Hongxia Feng, Yiqun Bai, Xiaoying Guo, Dingying Xu
  • OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
    Publication number: 20240219660
    Abstract: A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Applicant: Intel Corporation
    Inventors: Bohan Shan, Hongxia Feng, Haobo Chen, Yiqun Bai, Dingying Xu, Eric J.M. Moret, Robert Alan May, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington, Bin Mu
  • APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING
    Publication number: 20240222243
    Abstract: An integrated circuit device substrate includes a first glass layer with a redistribution layer mounting region and an integrated circuit device mounting region, wherein a first major surface of the first glass layer is overlain by a first dielectric layer, and wherein the first glass layer includes a first plurality of conductive pillars. A second glass layer is on the redistribution layer mounting region on the first glass layer, wherein the second glass layer includes a second dielectric layer on a second major surface thereof, and wherein the second dielectric layer is bonded to the first dielectric layer on the first major surface of the first glass layer, the second glass layer including a second plurality of conductive pillars electrically interconnected with the first plurality of conductive pillars in the first glass layer.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Intel Corporation
    Inventors: Bohan Shan, Haobo Chen, Bai Nie, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Kyle Jordan Arrington, Ziyin Lin, Hongxia Feng, Yiqun Bai, Xiaoying Guo, Dingying Xu, Kristof Darmawikarta
  • METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
    Publication number: 20240222283
    Abstract: Methods and apparatus to prevent over-etch in semiconductor packages are disclosed. A disclosed example semiconductor package includes at least one dielectric layer, an interconnect extending at least partially through or from the at least one dielectric layer, and a material on at least a portion of the interconnect, wherein the material comprises at least one of silicon or titanium.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Inventors: Hongxia Feng, Bohan Shan, Bai Nie, Xiaoxuan Sun, Holly Sawyer, Tarek Ibrahim, Adwait Telang, Dingying Xu, Leonel Arana, Xiaoying Guo, Ashay Dani, Sairam Agraharam, Haobo Chen, Srinivas Pietambaram, Gang Duan
  • Open block relocation
    Patent number: 12026384
    Abstract: Aspects of a storage device including a memory and a controller are provided. In certain aspects, the controller may determine that data stored on a first block satisfies a threshold data-error condition, the data comprising invalid data and valid data. For example, the first block may have a high ratio of valid data to invalid data that satisfies or exceeds a threshold value. In certain aspects, the controller may determine a close block boundary associated with the first block, wherein the close block boundary is configured to bifurcate the first block into a first portion and a second portion, wherein the first portion comprises the data. For example, the controller may determine a boundary defined by a data length, an indirection mapping unit, a physical program boundary, etc.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: July 2, 2024
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Ji-Hyun In, Yosief Ataklti, Aajna Karki, Hongmei Xie, Xiaoying Li
  • METHODS, DEVICES, AND SYSTEMS FOR DETERMINING LOCATION OF PAGING EARLY INDICATION
    Publication number: 20240214989
    Abstract: The present disclosure describes methods, system, and devices for determining a location of paging early indication (PEI). One method includes receiving, by a user equipment (UE), configuration information of a paging early indication occasion (PEI-O), wherein the configuration information comprises a frame-level offset list and a symbol-level offset list, the frame-level offset list comprises one or more frame-level offset, and the symbol-level offset list comprises one or more symbol-level offset; and detecting, by the UE, a paging early indication (PEI) in the PEI-O, wherein the PEI-O is determined by a frame-level offset from a start of a first paging frame (PF) of at least one PF associated with the PEI-O to a reference point and a symbol-level offset from the reference point to a start of a first physical downlink control channel (PDCCH) monitor occasion of the PEI-O.
    Type: Application
    Filed: March 11, 2024
    Publication date: June 27, 2024
    Applicant: ZTE Corporation
    Inventors: Xuan MA, Mengzhu Chen, Jun Xu, Focai Peng, Xiaoying Ma
  • METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES
    Publication number: 20240213116
    Abstract: Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates are disclosed. An example glass core of an integrated circuit (IC) package disclosed herein includes a fluid inlet to receive a cooling fluid, a fluid outlet, and a channel to fluidly couple the fluid inlet to the fluid outlet, the cooling fluid to flow through the channel from the fluid inlet to the fluid outlet, the channel fluidly isolated from one or more vias extending between a first surface and a second surface of the glass core.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Kyle Arrington, Bohan Shan, Haobo Chen, Ziyin Lin, Hongxia Feng, Yiqun Bai, Dingying Xu, Xiaoying Guo, Bai Nie, Srinivas Pietambaram, Gang Duan
  • GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS
    Publication number: 20240213170
    Abstract: An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer having a glass core layer active component die disposed in a cavity and a discrete passive component disposed in another cavity; a mold layer including a mold layer active component die disposed in the mold layer; and a buildup layer contacting a top surface of the glass core layer and a bottom surface of the mold layer. The buildup layer includes electrically conductive interconnect connecting the glass core layer active component die, the discrete passive component, and the mold layer active component die. The top surface of the component die is electrically connected to the mold layer active component die.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Applicant: Intel Corporation
    Inventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington, Jeremy D. Ecton, Brandon C. Marin
  • GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
    Publication number: 20240215269
    Abstract: An electronic system includes a substrate that includes a glass core layer including a cavity formed through the glass core layer; at least one active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer and a first surface of the at least one active component die, wherein the first buildup layer includes electrically conductive interconnect contacting the at least one active component die and extending to a first surface of the substrate; a second buildup layer contacting a second surface of the glass core layer and a second surface of the at least one active component die; and one or more solder bumps on a second surface of the substrate and contacting the second surface of the at least one active component die.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington
  • DATA TRANSMISSION METHOD AND APPARATUS
    Publication number: 20240214867
    Abstract: Embodiments of this application provide a data transmission method and an apparatus. A first access network device receives first indication information from a core network device. The first indication information indicates that a first quality of service QoS flow of a first terminal device has an association relationship with a second QoS flow of a second terminal device. The first access network device schedules, based on the first indication information, data transmission of the first terminal device and the second terminal device.
    Type: Application
    Filed: March 6, 2024
    Publication date: June 27, 2024
    Inventors: Qiang FAN, Xiaoying XU
  • LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
    Publication number: 20240213169
    Abstract: An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer including a cavity formed through the glass core layer; a glass core layer active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer; a second buildup layer contacting a second surface of the glass core layer; and a mold layer contacting a surface of the first buildup layer. The mold layer includes a mold layer active component die disposed in the mold layer, and the first buildup layer includes electrically conductive interconnect providing electrical continuity between the glass core layer active component die and the mold layer active component die. The top surface active component die is attached to the top surface of the substrate and electrically connected to the mold layer active component die.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington, Jeremy D. Ecton, Brandon C. Marin
  • Systems and methods for a tone mapper solution for an autonomous driving system
    Patent number: 12020412
    Abstract: A system is provided that includes an image sensor coupled to a vehicle, and control circuitry configured to perform operations including receiving, from the image sensor, an input stream comprising high dynamic range (HDR) image data associated with an environment of the vehicle, and processing the input stream at the vehicle by applying a global tone mapping, followed by offline image processing that can include applying a local tone mapping to the globally tone mapped images of the same input stream.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: June 25, 2024
    Assignee: Waymo LLC
    Inventors: Xiaoying He, Ryan Geiss, Pieter Kapsenberg, Carl Warren Craddock, Zhinan Xu, Lucian Ion, Ajay Chandra Venkata Gummalla
  • Non-scheduling resource based data sending method and apparatus thereof
    Patent number: 12022517
    Abstract: A data sending method includes: receiving, by a terminal device, configuration information sent by a network device, where the configuration information is used to configure a non-scheduling resource; and starting, by the terminal device when a condition is met, a first timer, where the non-scheduling resource is not used for sending uplink data within duration of the first timer. According to the method, a timer is set on the terminal device, and the timer is used to instruct the terminal device whether to send data on a non-scheduling resource. Therefore, a data sending success rate and a communication latency of the terminal device can be effectively balanced.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: June 25, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiaoying Xu, Qufang Huang, Qinghai Zeng
  • DRY FILM PHOTORESIST WET LAMINATION AND METHOD
    Publication number: 20240203853
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include a substrate, a via, a build-up layer, a top layer, and one or more dies. The substrate can include a conductor coating. The via can be connected to the conductor coating. The build-up layer can be on the substrate. The build-up layer can define a channel that the via is formed within and insulate the via during operation of the electronic device. The top layer can be interproximal to the substrate and the via. The one or more dies can be connected to the via.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 20, 2024
    Inventors: Bohan Shan, Haobo Chen, Hongxia Feng, Julianne Troiano, Dingying Xu, Matthew Tingey, Xiaoying Guo, Srinivas Venkata Ramanuja Pietambaram, Bai Nie, Gang Duan, Bin Mu, Kyle Mcelhinny, Ashay A. Dani, Leonel R. Arana