Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: The disclosure discloses a touch display panel and a touch display device. The touch display panel includes: a display panel, an encapsulation layer and a touch lead, wherein, the display panel includes a display area and a non-display area including a lead bonding area; the encapsulation layer covers the display area and extends to the lead bonding area; the touch lead extends to the lead bonding area along a side of the encapsulation layer away from the display area.

Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.

Abstract: A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Abstract: A fixture for machining wheel outer rim without trace includes a positioning and clamping portion and a flexible support portion. A base is fixed on a bottom plate, and a screw is configured to compress an expanding pressure plate during being tightened so that the outer circumference of an expanding sleeve expands a center hole of a wheel; and the positioning columns are inserted into bolt holes of the wheel. A lower pressure plate is fixed on the base, and limiting columns and an upper pressure plate are installed on the lower pressure plate, with steel balls and rubber strip being enclosed in a space formed by the lower pressure plate and the upper pressure plate. The fixture meets the requirement for machining the wheel outer rim without trace, has the characteristics of simple structure, convenient manufacture, stable performance and precision, and meets the requirements of automatic production.

Abstract: A fixture for suppressing tool vibration on an outer rim, wherein a pressure claw base, an end face block and a base are installed on the chuck, and the pressure claw is installed on the chuck; a lower pressure plate is fixed on the base, limiting columns and an upper pressure plate are installed on the lower pressure plate, with steel balls and a rubber strip being enclosed in a space formed by the lower pressure plate and the upper pressure plate; and a rubber strip is enclosed in an annular groove formed by a jaw A and a jaw B, and can move radially in the groove. The fixture in the present invention is configured to counteract the vibration of the wheel rim during machining, and thus can effectively eliminate the problem of tool vibration on the outer rim.

Abstract: Provided are a chip bonding apparatus and bonding method.

Abstract: Provided are a chip bonding apparatus and bonding method.

Abstract: The invention discloses a precision fixture for improving the balance precision of a wheel, comprising a chuck, a base, a servo motor, a lower pressure plate, a rubber strip, steel balls, an upper pressure plate, a mounting plate, a connecting shaft, a shaft sleeve, a hydraulic cylinder, a bearing end cover, bearings, a guard, an expanding core, expanding flaps, a flange plate, springs, pins, a flange, a connecting shaft and limiting columns. The fixture can meet the requirement for improving the balance precision of a wheel, at the same time, has the characteristics of simple structure, convenient manufacture, stable performance and precision that can meet the machining requirement, and can meet the requirements of automatic production.

Abstract: A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: The invention discloses a precision fixture for improving the balance precision of a wheel, comprising a chuck, a base, a servo motor, a lower pressure plate, a rubber strip, steel balls, an upper pressure plate, a mounting plate, a connecting shaft, a shaft sleeve, a hydraulic cylinder, a bearing end cover, bearings, a guard, an expanding core, expanding flaps, a flange plate, springs, pins, a flange, a connecting shaft and limiting columns. The fixture can meet the requirement for improving the balance precision of a wheel, at the same time, has the characteristics of simple structure, convenient manufacture, stable performance and precision that can meet the machining requirement, and can meet the requirements of automatic production.

Abstract: A fixture for suppressing tool vibration on an outer rim, wherein a pressure claw base, an end face block and a base are installed on the chuck, and the pressure claw is installed on the chuck; a lower pressure plate is fixed on the base, limiting columns and an upper pressure plate are installed on the lower pressure plate, with steel balls and a rubber strip being enclosed in a space formed by the lower pressure plate and the upper pressure plate; and a rubber strip is enclosed in an annular groove formed by a jaw A and a jaw B, and can move radially in the groove. The fixture in the present invention is configured to counteract the vibration of the wheel rim during machining, and thus can effectively eliminate the problem of tool vibration on the outer rim.

Abstract: A fixture for machining wheel outer rim without trace includes a positioning and clamping portion and a flexible support portion. A base is fixed on a bottom plate, and a screw is configured to compress an expanding pressure plate during being tightened so that the outer circumference of an expanding sleeve expands a center hole of a wheel; and the positioning columns are inserted into bolt holes of the wheel. A lower pressure plate is fixed on the base, and limiting columns and an upper pressure plate are installed on the lower pressure plate, with steel balls and rubber strip being enclosed in a space formed by the lower pressure plate and the upper pressure plate. The fixture meets the requirement for machining the wheel outer rim without trace, has the characteristics of simple structure, convenient manufacture, stable performance and precision, and meets the requirements of automatic production.

Abstract: A reticle transfer apparatus includes a reticle, a reticle stage (4) and a robot (2). The robot (2) is configured to support, transport and transfer the reticle onto the reticle stage (4).

Abstract: A reticle transfer apparatus includes a reticle, a reticle stage (4) and a robot (2). The robot (2) is configured to support, transport and transfer the reticle onto the reticle stage (4).

Abstract: A dual display phage system for the identification of protein interaction networks and therapeutic targets.

Abstract: A device includes an incident arm, a detection arm, a sample stage, and an image processing computer. The incident arm includes a light source and a first polarizing element, and is disposed on one side of the sample stage. The detection arm includes a second polarizing element and a photoelectric detector, and is disposed on a light-detection path. The photoelectric detector is connected to the computer. The device further includes a device for adjusting polarization angles of the first and second polarizing elements. A method includes: illuminating a sample surface using linearly polarized light with a certain polarization angle; detecting outgoing polarized light by a photoelectric detector; adjusting polarization angles of the incident and detected polarized light, and repeating the above two steps to obtain a series of polarized images, each image corresponding to incident and detected polarization angles; and computer processing the obtained images to obtain sample information.