Abstract: The present invention provides a display device and an LED backlight driving circuit thereof. The LED backlight driving circuit includes a plurality of LED light strings connected in parallel; a switch module including switches; a power module, and a switching control module. The switching control module includes: a driving unit connected to the switches; a current detection unit connected to the switches; an ON time detection unit connected to the driving unit; a reference unit, the reference unit supplying a reference value; multipliers, each of which has two input terminals respectively connected to the ON time detection unit and the current detection unit to receive a ON time value of a corresponding one of the switches and a voltage signal indicating the current of the switch; and comparison units, each of which has two input terminals respectively connected to the reference unit and an output terminal of a corresponding one of the multipliers.

Abstract: Drug carriers, methods of synthesizing, and methods of use thereof are provided.

Abstract: A boost circuit for an LED (Light Emitting Diode) backlight driver circuit is disclosed; said boost circuit includes a PWM (Pulse Width Modulation) chip, a second capacitor, and a signal processing circuit. A VCC pin of the PWM chip is coupled to the input node, and the PWM chip is utilized to generate a PWM signal. One end of the second capacitor is coupled to an output pin of the PWM chip, and the second capacitor is utilized to filter out a direct current component of the PWM signal. One terminal of the signal processing circuit is coupled to the second capacitor, and another terminal thereof is coupled to a gate of the switch. The signal processing circuit is used to adjust the filtered PWM signal for generating corresponding high levels and low levels. A regulator is omitted in the present invention, therefore reducing costs.

Abstract: The present invention provides a driving circuit, a backlight module and a display apparatus using the same. The driving circuit comprises a first inductor, a second inductor, a first power switch, a second power switch, a driving circuit unit and a push-pull circuit. The first inductor and the second inductor are connected between the light-emitting diodes and a power supply. The first power switch is connected between the first inductor and the light-emitting diodes. The second power switch is connected between the second inductor and the light-emitting diodes. The push-pull circuit is connected to the first power switch and the second power switch. The driving circuit unit is connected to the push-pull circuit. An electrolytic capacitor or a capacitor having high capacitance can be omitted in this invention.

Abstract: The present invention provides a self-driven synchronous rectification boost converter having high step-up ratio. The self-driven synchronous rectification boost converter having high step-up ratio has a first switch receiving a pulse driving signal, a first winding, a second winding and a synchronous rectification circuit constructed by an auxiliary winding and a second switch. The first winding inducts a reverse voltage when the first switch is repeatedly switched on and off. The reverse voltage then is raised via the second winding, and the auxiliary winding cooperates with a switch circuit to switch on/off the second switch according to an inducted voltage, so as to achieve an object of synchronous rectification. Under a condition of outputting high current, the present invention can greatly reduce power-consumption of rectifying and enhance efficiency.

Abstract: The present invention provides a self-driven synchronous rectification boost converter. The self-driven synchronous rectification boost converter has a first switch receiving a pulse driving signal, a first winding and a synchronous rectification circuit constructed by an auxiliary winding and a second switch. The first winding stores energy when the first switch is switched on and releases energy when the first switch is switched off to achieve boosting. In the meantime, the auxiliary winding cooperates with a switch circuit to switch on/off the second switch according to a voltage inducted from the first winding, so as to achieve an object of synchronous rectification. Under a condition of outputting high current, the present invention can greatly reduce power-consumption of rectifying and enhance efficiency.

Abstract: An arc surface milling machine includes a worktable, a base and a backup plate. The worktable is assembled adjacent to the base. The backup plate is adjustably mounted on the base and positioned adjacent to the worktable. The worktable includes a work surface, an opposite bottom surface, and a mounting end. The base is assembled to the mounting end of the worktable. The work surface defines a concave wedge-shaped receiving space adjacent to the mounting end and forms a milling opening communicating with the work surface and the mounting end.

Abstract: Compositions and methods for targeting agents to hard tissue are provided comprising A method includes administering to a subject a composition comp?sing micelles, the micelles comp?sing at least one amphiphilic block copolymer linked to at least one tooth targeting moiety The composition further includes at least one encapsulated compound and is provided in a pharmaceutically acceptable carrier.

Abstract: Drug carriers, methods of synthesizing, and methods of use thereof are provided.

Abstract: Drug carriers, methods of synthesizing, and methods of use thereof are provided.

Abstract: A chip package structure including a chip, a leadframe, multiple bonding wires and an encapsulant is provided. The chip has an active surface and multiple contacts. The contacts are located on one side of the active surface. The chip is fixed under the leadframe. The leadframe has multiple first inner leads located on the active surface, and multiple second leads, wherein one end of each first inner lead and one end of each second inner lead are at near outside of one of the contacts. The bonding wires respectively connect the first inner leads and the second inner leads to the contacts. The encapsulant wraps the chip, the first inner leads, the second inner leads and the bonding wires. Because the contacts are located on one side of the active surface, the possibility of collapse of the bonding wires is reduced.

Abstract: A chip package structure including a lead frame, at least one first bonding wire, at least one second bonding wire, third bonding wires and an encapsulant is provided. The lead frame includes a die pad, inner leads and at least one bus bar, wherein the bus bar is disposed therebetween and has a down-set with a height difference from the inner leads. The inner leads are disposed around the die pad. The chip disposed on the die pad has at least one first contact and second contacts. The first bonding wire electrically connects the first contact to the bus bar. The second bonding wire electrically connects the bus bar to one of the inner leads. The third bonding wires electrically connect the other of the inner leads to the second contacts. The lead frame, the chip, the bonding wires are wrapped inside the encapsulant.

Abstract: A chip package structure including a lead frame, at least one first bonding wire, at least one second bonding wire, third bonding wires and an encapsulant is provided. The lead frame includes a die pad, inner leads and at least one bus bar, wherein the bus bar is disposed therebetween and has a down-set with a height difference from the inner leads. The inner leads are disposed around the die pad. The chip disposed on the die pad has at least one first contact and second contacts. The first bonding wire electrically connects the first contact to the bus bar. The second bonding wire electrically connects the bus bar to one of the inner leads. The third bonding wires electrically connect the other of the inner leads to the second contacts. The lead frame, the chip, the bonding wires are wrapped inside the encapsulant.

Abstract: The Mig protein gene of Streptococcus dysgalactiae, and the correspondingamino acid sequence, is described, as is the use of the Mig protein in vaccine compositions to prevent and treat bacterial infections in general, and mastitis in particular.

Abstract: The Mig protein gene of Streptococcus dysgalactiae, and the corresponding amino acid sequence, is described, as is the use of the Mig protein in vaccine compositions to prevent and treat bacterial infections in general, and mastitis in particular.

Abstract: A Si material mixed with Group-V element is melted in a crucible, and then held in a chamber filled with a rare gas at atmospheric pressure of 100 torr. or higher. A rare gas, e.g. Ar, Kr, Xe or Rn, having a large mass or the mixture of Ar with Kr, Xe or Rn may be used as atmospheric gas. The high-pressure atmosphere suppress the evaporation of oxides of Group-V elements from the Si melt, so that the Si melt can be maintained at a high oxygen concentration under a stable condition until the start of pulling operation.