Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A method includes accessing a first object in a virtual environment, the first object representing a first asset at a first level of detail (LoD). A second object is generated to represent the first asset at a second LoD having decreased complexity. The method further includes determining a first importance value for the first asset and, based on the first importance value, selecting the first object to represent the first asset. Additionally, the method includes accessing a third object representing the second asset at the first LoD and generating a fourth object representing the second asset at the second LoD. The method further includes determining a second importance value, lower than the first importance value, for the second asset and selecting the fourth object to represent the second asset. The method further includes causing a client device to update a display of the virtual environment by transmitting the selected objects.

Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second substrate. A first trench capacitor and a second trench capacitor extend respectively into the front sides of the first and second substrates. A plurality of wires and a plurality of vias are stacked between and electrically coupled to the first and second trench capacitors. A first through substrate via (TSV) extends through the first substrate from a back side of the first substrate, and the wires and the vias electrically couple the first TSV to the first and second trench capacitors. The first and second trench capacitors and the electrical coupling therebetween collectively define the 3D trench capacitor.

Abstract: A large-load unmanned aerial vehicle (UAV) for plant protection with adjustable spraying swath and pesticide application amount is provided, relating to the technical field of pesticide application of unmanned aerial vehicles. The large-load unmanned aerial vehicle for plant protection comprises a large-load unmanned aerial vehicle, a pesticide box, a variable pesticide application system, and adjustable spraying swath mechanisms, wherein the pesticide box is fixed to landing gears of the unmanned aerial vehicle and is positioned below a control platform of the unmanned aerial vehicle; the adjustable spraying swath mechanisms are arranged on the landing gears, the variable pesticide application system is connected with the pesticide box and the adjustable spraying swath mechanisms, the variable pesticide application system and the adjustable spraying swath mechanisms are electrically connected with the control platform, and the control platform is in communication connection with a remote control handle.

Abstract: A wood-plastic/lumber composite co-extrusion feeder includes a frame, wherein at least one group of toothed conveying units, a tooth mark milling unit for milling tooth marks on an outer surface of a lumber, and a lumber co-extrusion mold are arranged on the frame in sequence, each toothed conveying unit includes a lower toothed pressure roller installed on a first fixed bearing seat and an upper toothed pressure roller installed on a first movable bearing seat, and after the first fixed bearing seat and the first movable bearing seat are connected by an adjustment unit, a first conveying channel having an adjustable height is formed between the upper toothed pressure roller and the lower-toothed pressure roller.

Abstract: Systems, apparatuses, and methods for placing cells in an integrated circuit are described. In various embodiments, an integrated circuit is divided into many partitions. In a first set of partitions susceptible to transistor latch-up, the many transistor gate stripes are connected to one of the power rails rather than left floating. The lengths of the transistor gate stripes are shortened for well tap cells in the first partition, but increased in a second partition susceptible for poor signal integrity. One or more implant layers are formed underneath the transistor gate stripes in each of the first and second partitions to adjust an amount of protection against transistor latch-up and poor signal integrity. An electrostatic discharge transistor is included with at least one source region of multiple source regions formed in a well with a same doping polarity as the at least one source region.

Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

Abstract: Disclosed are a low-mold deposit halogen-free flame-retardant thermoplastic polyamide composition, and a preparation method and use thereof. The composition includes the following components in parts by weight: 20 to 82 parts of a thermoplastic polyamide resin; 13 to 25 parts of a flame retardant; 1 to 5 parts of a flame-retardant synergist; 5 to 50 parts of a reinforcement material; and 0.5 to 5 parts of an adsorbent, where the flame retardant includes a phosphinate-based flame retardant and the adsorbent is an ethylene copolymer. In the present disclosure, an ethylene copolymer is added as an adsorbent and an addition amount of the ethylene copolymer is controlled, so that the prepared composition exhibits excellent flame resistance and electrical properties, and can effectively reduce the release of small molecules during the injection molding and greatly reduce an amount of the mold deposit generated during the injection molding.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: Systems, apparatuses, and methods for placing cells in an integrated circuit are described. In various embodiments, an integrated circuit is divided into many partitions. In a first set of partitions susceptible to transistor latch-up, the many transistor gate stripes are connected to one of the power rails rather than left floating. The lengths of the transistor gate stripes are shortened for well tap cells in the first partition, but increased in a second partition susceptible for poor signal integrity. One or more implant layers are formed underneath the transistor gate stripes in each of the first and second partitions to adjust an amount of protection against transistor latch-up and poor signal integrity. An electrostatic discharge transistor is included with at least one source region of multiple source regions formed in a well with a same doping polarity as the at least one source region.

Abstract: The disclosure provides a semiconductor package substrate made from non-metallic material having a first top surface, a second bottom surface opposite from the first surface, and at least one side surface, the substrate includes at least two pads positioned on the first surface and suitable for receiving an electronic element, an encapsulant material layer covering the first surface, at least two terminals positioned on the second surface and electrically connected to the pads, and a portion of at least one of the two terminals is exposed at the at least one side surface and structured as a wettable flank.

Abstract: A display device and a driving method therefor and a manufacturing method thereof. The display device includes: a liquid crystal cell (1); a first polarizer (2) positioned at a light incident side of the liquid crystal cell (1); and a reflective polarization structure (3) positioned at one side of the liquid crystal cell (1) away from the first polarizer (2). The reflective polarization structure (3) is configured to absorb light having a polarization direction parallel to a transmission axis direction of the first polarizer (2), and to reflect light having a polarization direction perpendicular to the transmission axis direction of the first polarizer (2).

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: Early vascular cells (EVCs), including endothelial cells and pericytes, are generated from hiPSCs. Unlike the isolated endothelial progenitor cells, the differentiated ECs mature and are functional. When encapsulated in synthetic hydrogel, EVCs respond to matrix cues and self-assembled to form three-dimensional EVCs. Moreover, these EVCs respond to hypoxic microenvironment and undergo vasculogenesis to form complex 3D networks.

Abstract: A control method is provided, including: obtaining input information, where the input information includes a capacitance signal and report point coordinates generated when a user performs an operation on a terminal screen; using report point coordinates in a previous frame as report point coordinates in a current frame if it is determined that a capacitance signal in the current frame and a capacitance signal in the previous frame that are in the input information meet a preset condition; or using report point coordinates in a previous frame as report point coordinates in a current frame if it is determined that the report point coordinates in the current frame and report point coordinates in a first frame that are in the input information meet a preset condition.