Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: The present disclosure provides a preparation method of manganese hydroxide, including subjecting a coarse manganese metal powder and water to a reaction under temperature-rising condition to obtain a manganese hydroxide slurry; oxidizing the manganese hydroxide slurry to obtain high-purity trimanganese tetraoxide; reducing the high-purity trimanganese tetraoxide to obtain high-purity manganese monoxide, allowing the manganese hydroxide slurry and carbon dioxide to have a reaction to obtain high-purity manganese carbonate; roasting the high-purity manganese carbonate to obtain the high-purity manganese monoxide. In the present disclosure, the preparation method maintains a purity advantage of electrolytic manganese metal products, can reduce energy consumption, achieve safe and clean production, and avoid environmental problems.

Abstract: A motorized covering for a window, including a selectively positionable plurality of slats; a flexible material layer connected to the plurality of slats, the flexible material layer extending generally parallel to the window when the plurality of slats is in the extended position, a plurality of temporary air cells being formed between the plurality of slats, the flexible material layer, and the window when the slats are in the extended position; and a motor system operatively connected to the plurality of slats and the flexible material layer to selectively lower and raise the slats and the flexible material layer, the motor system being configured to lower and raise the plurality of slats and the flexible material layer in response to at least one control signal, the at least one control signal being based on a determination to change an insulation factor for the window.

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Abstract: An energy efficiency calculation method includes calculating an hourly cooling load of a cooling area, determining an hourly power consumption of a chiller unit, an hourly power consumption of a water pump, and an hourly power consumption of a cooling tower of a refrigeration machine room, and calculating an energy efficiency of a water system of the refrigeration machine room based on the hourly cooling load, the hourly power consumption of the chiller unit, the hourly power consumption of the water pump, and the hourly power consumption of the cooling tower.

Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.

Abstract: Systems and methods are disclosed herein for enforcing digital signature on a token useable by a network-addressable device to invoke service calls on services of a service provider. A device platform service of the service provider may receive service calls from the network-addressable device and cause one or more operations to be performed by other services of the service provider in response to receiving a notification that the request is authentic. An authentication service analyses a fingerprint associated with a request submitted by the device and determines whether it is a match to a fingerprint generated from cryptographic authentication information provided by the user in connection with registering the network-addressable device.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A wood-plastic/lumber composite co-extrusion feeder includes a frame, wherein at least one group of toothed conveying units, a tooth mark milling unit for milling tooth marks on an outer surface of a lumber, and a lumber co-extrusion mold are arranged on the frame in sequence, each toothed conveying unit includes a lower toothed pressure roller installed on a first fixed bearing seat and an upper toothed pressure roller installed on a first movable bearing seat, and after the first fixed bearing seat and the first movable bearing seat are connected by an adjustment unit, a first conveying channel having an adjustable height is formed between the upper toothed pressure roller and the lower-toothed pressure roller.

Abstract: Systems, apparatuses, and methods for placing cells in an integrated circuit are described. In various embodiments, an integrated circuit is divided into many partitions. In a first set of partitions susceptible to transistor latch-up, the many transistor gate stripes are connected to one of the power rails rather than left floating. The lengths of the transistor gate stripes are shortened for well tap cells in the first partition, but increased in a second partition susceptible for poor signal integrity. One or more implant layers are formed underneath the transistor gate stripes in each of the first and second partitions to adjust an amount of protection against transistor latch-up and poor signal integrity. An electrostatic discharge transistor is included with at least one source region of multiple source regions formed in a well with a same doping polarity as the at least one source region.

Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

Abstract: Disclosed are a low-mold deposit halogen-free flame-retardant thermoplastic polyamide composition, and a preparation method and use thereof. The composition includes the following components in parts by weight: 20 to 82 parts of a thermoplastic polyamide resin; 13 to 25 parts of a flame retardant; 1 to 5 parts of a flame-retardant synergist; 5 to 50 parts of a reinforcement material; and 0.5 to 5 parts of an adsorbent, where the flame retardant includes a phosphinate-based flame retardant and the adsorbent is an ethylene copolymer. In the present disclosure, an ethylene copolymer is added as an adsorbent and an addition amount of the ethylene copolymer is controlled, so that the prepared composition exhibits excellent flame resistance and electrical properties, and can effectively reduce the release of small molecules during the injection molding and greatly reduce an amount of the mold deposit generated during the injection molding.