Patents by Inventor Xinrong An

Xinrong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230145234
    Abstract: Disclosed in the present application are an antenna apparatus and a terminal device. The present application, by means of adding a power attenuator to each antenna unit of an array antenna, and the power attenuators being used to load a Dolph-Chebyshev algorithm and/or a Taylor algorithm so as to attenuate power of an input signal, can effectively inhibit side lobe gain of the array antenna and ensure identical main lobe gain and width.
    Type: Application
    Filed: February 26, 2020
    Publication date: May 11, 2023
    Applicant: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD
    Inventors: Hongjuan Xing, Ke Ren, Hai Cai, Xinrong An
  • Publication number: 20230137752
    Abstract: A light emitting filament diode that includes a filament substrate; a plurality of light emitting diodes (LEDs) electrically connected and disposed along a length of the filament substrate; and a phosphorus encapsulant present in direct contact with an upper surface and sidewalk of at least one of the plurality of light emitting diodes (LEDs). No portion of phosphorus encapsulant is present overlying a portion of the filament substrate extending between the sidewalls of adjacently situated light emitting diodes having phosphorus encapsulant present thereon. The light emitting filament diode may a include a transparent encapsulant present over at least the light emitting diode chips.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 4, 2023
    Inventors: Xinrong Wang, Tianzheng Jiang, Ming Li
  • Publication number: 20230134502
    Abstract: A light emitting diode (LED) structure that includes a stent substrate; and a circuit having a plurality of contact pads arranged along a length of the stent substrate. The structure further includes a plurality of light emitting diode (LED) chips, wherein each light emitting diode chip in the plurality of chips is engaged to a set of contact pads along the length of the metal stent substrate. A continuous phosphor layer is present overlying the plurality of light emitting diode (LED) chips, the continuous phosphor layer including first portions that are in direct contact with at least a light transmission surface of the light emitting diode (LED) chips and second portions that bridge across the space separating adjacently positioned light emitting diode. An encapsulant present over the continuous phosphor layer that is covering at least the light emitting diode chips.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 4, 2023
    Inventors: Xinrong Wang, Tianzheng Jiang, Ming Li
  • Publication number: 20230109032
    Abstract: An electron-beam device includes upper-column electron optics and lower-column electron optics. The upper-column electron optics include an aperture array to divide an electron beam into a plurality of electron beamlets. The upper-column electron optics also include a lens array with a plurality of lenses to adjust the focus of the plurality of electron beamlets. Respective lenses of the plurality of lenses are to adjust the focus of respective electron beamlets of the plurality of electron beamlets. The upper-column electron optics further include a first global lens to adjust the focus of the plurality of electron beamlets in a manner opposite to the lens array.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 6, 2023
    Inventors: Xinrong Jiang, Sameet Shriyan, Luca Grella, Kevin Cummings, Christopher Sears
  • Publication number: 20230066086
    Abstract: For an electron beam system, a Wien filter is in the path of the electron beam between a transfer lens and a stage. The system includes a ground electrode between the Wien filter and the stage, a charge control plate between the ground electrode and the stage, and an acceleration electrode between the ground electrode and the charge control plate. The system can be magnetic or electrostatic.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 2, 2023
    Inventor: Xinrong Jiang
  • Publication number: 20230054287
    Abstract: The disclosure provides a preparation process of an allyl alcohol polyether with a low potassium and sodium content, comprising the following steps: reacting allyl alcohol with a mixture of epoxypropane and oxacyclopropane to prepare an allyl alcohol oligomer crude product with a molecular weight of 150-1500; reducing the total content of potassium and sodium ions in the allyl alcohol oligomer crude product prepared in step S1 to 2 ppm or less through a cation exchange resin; and reacting the allyl alcohol oligomer product treated in step S2 with the mixture of epoxypropane and oxacyclopropane to prepare allyl alcohol high-molecular-weight polyether with a molecular weight of 2000-5000. According to the present disclosure, the total content of potassium and sodium ions in the product is reduced to 2 ppm or less, and the product has a good double bond protection rate.
    Type: Application
    Filed: July 16, 2021
    Publication date: February 23, 2023
    Inventors: Weisong Wang, Yifeng Jin, Xinrong Wang, Majishi Wang, Jiongfeng Zhao
  • Publication number: 20230016476
    Abstract: An apparatus includes memory and processing circuitry coupled to the memory. The processing circuitry is to decode a client-to-client (C2C) enabling signal received from an access point (AP). The C2C enabling signal indicates the AP is configured for Low Power Indoor (LPI) communication at an LPI signal power level. The signal power of the C2C enabling signal received from the AP is determined. Bluetooth (BT) circuitry of the apparatus is configured for BT communication with a wireless device at the LPI signal power level when the signal power of the C2C enabling signal is above a signal power threshold. The BT circuitry is configured to perform a handshake exchange with the wireless device to initiate the BT communication at the LPI signal power level.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 19, 2023
    Inventors: Carlos Cordeiro, Xinrong Wang, Hassan Yaghoobi, Harish Balasubramaniam
  • Publication number: 20220387617
    Abstract: A use of a CD200 extracellular domain protein or a fusion protein formed from a CD200 extracellular domain protein and an Fc fragment in preparing a drug for treating psoriasis is disclosed.
    Type: Application
    Filed: October 26, 2020
    Publication date: December 8, 2022
    Inventors: Hanmei XU, Dongping LI, Xinrong JIN
  • Patent number: 11508591
    Abstract: An electron source emits an electron beam. The electron beam is received by a beam limiting assembly. The beam limiting assembly has a first beam limiting aperture with a first diameter and a second beam limiting aperture with a second diameter larger than the first diameter. The first beam limiting aperture receives the electron beam. This beam limiting assembly reduces the influence of Coulomb interactions.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 22, 2022
    Assignee: KLA Corporation
    Inventors: Xinrong Jiang, Christopher Sears, Nikolai Chubun, Luca Grella
  • Publication number: 20220367140
    Abstract: Multiple electron beamlets are split from a single electron beam. The electron beam passes through an acceleration tube, a beam-limiting aperture, an anode disposed between an electron beam source and the acceleration tube, a focusing lens downstream from the beam-limiting aperture, and a micro aperture array downstream from the acceleration tube. The micro aperture array generates beamlets from the electron beam. The electron beam can be focused from a divergent illumination beam into a telecentric illumination beam.
    Type: Application
    Filed: May 11, 2021
    Publication date: November 17, 2022
    Inventor: Xinrong Jiang
  • Patent number: 11445711
    Abstract: Disclosed are an intelligent separation and drying system for maggots and a method of operating the same. The intelligent separation and drying system includes an intelligent light control unit, an intelligent scraping unit, a separation unit, a drying unit, a travelling unit and a central control unit. The central control unit is connected to other units through signals. Multidisciplinary techniques, including spectrum analysis, machine learning algorithm and artificial neural network, are combined to automatically, systematically, intelligently and continuously separate maggots and maggot feed as well as dry the maggots with high efficiency in a clean manner.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: September 20, 2022
    Assignee: Lishui Institute of Ecology and Environment, Nanjing University
    Inventors: Zengwei Yuan, Shiwen Zhang, Zumao Qin, Xinrong Zhou, Tianming Chen
  • Patent number: 11428439
    Abstract: A tile or plate, includes: an upper plate (3) and a lower plate (4); wherein a plurality of heat conducting cavities (6) are uniformly provided between the upper plate (3) and the lower plate (4) via connecting ribs (5). A solar collection layer is provided on an upper surface of the tile or the plate. Two ends of the tile or the plate are connected with each of the plurality of the heat conducting cavities (6) via transverse connecting pipes (23, 37, 42). The transverse connecting pipes (23, 37, 42) of two neighboring tiles are connected by a ferrule (17) or a hose (36) to form an integrated circulation system. The tile or plate has a large day-lighting area and a high energy conversion rate.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: August 30, 2022
    Assignee: BEIJING WADENER TECHNOLOGY CO. LTD
    Inventors: Yunliang Qu, Jian Cui, Zhixiang Ying, Fang Shen, Bin Qu, Xinrong Wang, Chen Zhang, Xiangdong Li, Hongxing Wang
  • Publication number: 20220254667
    Abstract: An electron source emits an electron beam. The electron beam is received by a beam limiting assembly. The beam limiting assembly has a first beam limiting aperture with a first diameter and a second beam limiting aperture with a second diameter larger than the first diameter. The first beam limiting aperture receives the electron beam. This beam limiting assembly reduces the influence of Coulomb interactions.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 11, 2022
    Inventors: Xinrong Jiang, Christopher Sears, Nikolai Chubun, Luca Grella
  • Patent number: 11407698
    Abstract: The present invention relates to a synthesis method and synthesis reactor of high-selectivity 2-methylallyl chloride by taking isobutylene and chlorine gas as raw materials and performing a gas-phase chlorination reaction in a microchannel reactor with a cooling surface. The isobutylene and the chlorine gas are reacted in a T-shaped microchannel reactor, and the mixing speed is extremely fast. Meanwhile, the huge heat exchange area per unit volume can ensure that the reaction proceeds stably at a substantially constant temperature and has good controllability. Therefore, side reactions caused by excessive local temperature can be effectively suppressed, the reaction selectivity is high, and no coking phenomenon occurs.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: August 9, 2022
    Assignees: ZHEJIANG UNIVERSITY, ZHEJIANG HUANGMA TECHNOLOGY CO., LTD.
    Inventors: Hong Yin, Zhirong Chen, Xinrong Wang, Weisong Wang, Yuanrong Yu, Shengli Wang, Yuefen Wang, Zhenqiang Ma, Xingjun Zhao, Jianfang Qian
  • Publication number: 20220246488
    Abstract: Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure including a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure including a rewiring portion having two opposing main surfaces, and a plurality of bumps; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, and thereby connecting the sealing structure and the rewiring structure.
    Type: Application
    Filed: May 21, 2020
    Publication date: August 4, 2022
    Inventors: Tomoaki SHIBATA, Tsuyoshi OGAWA, Xinrong LI
  • Publication number: 20220246597
    Abstract: Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure having a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure having a rewiring portion having two opposing main surfaces, and a plurality of bumps; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating layer intervening.
    Type: Application
    Filed: May 21, 2020
    Publication date: August 4, 2022
    Inventors: Tomoaki SHIBATA, Tsuyoshi OGAWA, Satoshi YONEDA, Xinrong LI
  • Patent number: 11352172
    Abstract: A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package. The flap and package include provisions for releasably engaging the flap to the package to seal the interior of the package. Provisions for grasping the tab and indicating whether tampering has occurred are also described.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: June 7, 2022
    Assignee: Avery Dennison Corporation
    Inventors: Xinrong Duan, Martin Daffner, ZhiJian Xue
  • Publication number: 20220157741
    Abstract: Disclosed is a method for producing an electronic component, the method including: disposing a plurality of electronic components on an adhesive layer of a composite substrate including a support, a temporary fixing material layer, and the adhesive layer with a connection part in contact with the adhesive layer interposed between the adhesive layer and the electronic components; fixing the plurality of electronic components to the composite substrate by curing the adhesive layer; forming a sealing layer sealing the electronic components; obtaining a sealed structure by peeling off the temporary fixing material layer from the adhesive layer; and a forming a circuit surface by grinding the sealed structure from the adhesive layer side. The plurality of electronic components include an IC chip and a chip-type passive component.
    Type: Application
    Filed: March 5, 2020
    Publication date: May 19, 2022
    Inventors: Tomoaki SHIBATA, Tsuyoshi OGAWA, Xinrong LI
  • Patent number: 11335608
    Abstract: An electron beam system for wafer inspection and review of 3D devices provides a depth of focus up to 20 microns. To inspect and review wafer surfaces or sub-micron-below surface defects with low landing energies in hundreds to thousands of electron Volts, a Wien-filter-free beam splitting optics with three magnetic deflectors can be used with an energy-boosting upper Wehnelt electrode to reduce spherical and chromatic aberration coefficients of the objective lens.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: May 17, 2022
    Assignee: KLA Corporation
    Inventors: Xinrong Jiang, Christopher Sears
  • Patent number: D983488
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: April 18, 2023
    Inventor: Xinrong Zhang