Abstract: The invention discloses a carbon fiber composite artificial bone and a preparation method thereof. The artificial bone includes a carbon fiber composite spring-like frame or includes a carbon fiber composite spring-like frame and a carbon fiber composite plate dowel, and the carbon fiber composite plate dowel is inserted into one end or both ends of a cavity of the spring-like frame or penetrates through the cavity of the carbon fiber composite spring-like frame. The preparation method includes: preparing a spring-like carbon fiber preform through a weaving technology by using carbon fibers as a raw material, performing densification and high-temperature purification treatment and preparing a wear-resistant coating to obtain the carbon fiber composite spring-like frame; and combining the carbon fiber composite spring-like frame with the carbon fiber composite plate bowel to obtain the artificial bone.

Abstract: The present disclosure discloses a dispatching method and device, and a non-transitory readable storage medium, and relates to the field of computer technology. The method of the present disclosure includes: obtaining path condition information within a warehouse; calculating pickup time of each candidate robot of a plurality of candidate robots according to a location of the candidate robot and the path condition information; dispatching a target robot to perform a pickup task according to the pickup time of each candidate robot.

Abstract: The invention discloses a carbon fiber composite artificial bone and a preparation method thereof. The artificial bone includes a carbon fiber composite spring-like frame or includes a carbon fiber composite spring-like frame and a carbon fiber composite plate dowel, and the carbon fiber composite plate dowel is inserted into one end or both ends of a cavity of the spring-like frame or penetrates through the cavity of the carbon fiber composite spring-like frame. The preparation method includes: preparing a spring-like carbon fiber preform through a weaving technology by using carbon fibers as a raw material, performing densification and high-temperature purification treatment and preparing a wear-resistant coating to obtain the carbon fiber composite spring-like frame; and combining the carbon fiber composite spring-like frame with the carbon fiber composite plate bowel to obtain the artificial bone.

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Abstract: The present disclosure discloses a dispatching method and device for robots, and a non-transitory readable storage medium, and relates to the field of computer technology. The method of the present disclosure includes: obtaining path condition information within a warehouse; calculating pickup time of each candidate robot of a plurality of candidate robots according to a location of the candidate robot and the path condition information; dispatching a target robot to perform a pickup task according to the pickup time of each candidate robot.

Abstract: An order re-check system, comprising: electronic tags arranged on turnover boxes; RFID readers/writers arranged on goods allocations, when the turnover boxed are located on the goods allocations, RFID readers/writers acquiring number information of the turnover boxes via the electronic tags; a first information binding module, used for binding the first number information and the second number information in a one to one manner; a second information binding module, used for binding the second number information and orders in a one to one manner; a commodity information acquisition module, used for acquiring commodity information; a commodity information processing module, used for determining an order for a commodity according to the commodity information, and determining the first number information corresponding to the commodity according to a binding relationship between the first number information and the orders; and control indication modules, used for instructing the corresponding goods allocations or

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: An order re-check system, comprising: electronic tags arranged on turnover boxes; RFID readers/writers arranged on goods allocations, when the turnover boxed are located on the goods allocations, RFID readers/writers acquiring number information of the turnover boxes via the electronic tags; a first information binding module, used for binding the first number information and the second number information in a one to one manner; a second information binding module, used for binding the second number information and orders in a one to one manner; a commodity information acquisition module, used for acquiring commodity information; a commodity information processing module, used for determining an order for a commodity according to the commodity information, and determining the first number information corresponding to the commodity according to a binding relationship between the first number information and the orders; and control indication modules, used for instructing the corresponding goods allocations or

Abstract: An electronic cigarette atomizer has a holder connected to a base. The holder is coated with a transparent tube and the upper and lower ends of the holder are connected with the upper and lower ends of the transparent tube hermetically. The air intake tube prevents the e-liquid from leaking out and covers the upper half of the holder. The internal surface of the nozzle base is connected to the outer surface of the exhaust tube. The internal surface of the holder is connected with the outer surface of the nozzle base. The internal surface of the air intake tube is connected with the outer surface of the nozzle base. There are air intake holes in the upper end of the holder. In the lower end of the nozzle base there is a groove which is connected to the air intake holes.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.