Patents by Inventor Xu Yi

Xu Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11061255
    Abstract: Contact lenses incorporating an array of non-coaxial lenslets with add power that create non-coaxial myopic defocus within the optic zone of the lens may be utilized to prevent and/or slow myopia progression. The positive, non-coaxial lenslets cover about twenty to eighty percent of the central pupil area to deliver positive foci of light in front of the retina to slow the rate of myopia progression.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 13, 2021
    Assignee: Johnson & Johnson Vision Care, Inc.
    Inventors: Manwai Charis Lau, Noel Brennan, Khaled Chehab, Xu Cheng, Michael Collins, Brett Davis, Eric R. Ritchey, Fan Yi
  • Publication number: 20200188117
    Abstract: The invention discloses a carbon fiber composite artificial bone and a preparation method thereof. The artificial bone includes a carbon fiber composite spring-like frame or includes a carbon fiber composite spring-like frame and a carbon fiber composite plate dowel, and the carbon fiber composite plate dowel is inserted into one end or both ends of a cavity of the spring-like frame or penetrates through the cavity of the carbon fiber composite spring-like frame. The preparation method includes: preparing a spring-like carbon fiber preform through a weaving technology by using carbon fibers as a raw material, performing densification and high-temperature purification treatment and preparing a wear-resistant coating to obtain the carbon fiber composite spring-like frame; and combining the carbon fiber composite spring-like frame with the carbon fiber composite plate bowel to obtain the artificial bone.
    Type: Application
    Filed: August 17, 2018
    Publication date: June 18, 2020
    Applicant: HUNAN TANKANG BIOTECH CO., LTD.
    Inventors: Zhoujian TAN, Xu YI
  • Patent number: 10510932
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: December 17, 2019
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Publication number: 20190240834
    Abstract: The present disclosure discloses a dispatching method and device for robots, and a non-transitory readable storage medium, and relates to the field of computer technology. The method of the present disclosure includes: obtaining path condition information within a warehouse; calculating pickup time of each candidate robot of a plurality of candidate robots according to a location of the candidate robot and the path condition information; dispatching a target robot to perform a pickup task according to the pickup time of each candidate robot.
    Type: Application
    Filed: October 12, 2017
    Publication date: August 8, 2019
    Applicants: BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO, LTD., BEIJING JINGDONG CENTURY TRADING CO., LTD.
    Inventor: Xu YI
  • Patent number: 10360770
    Abstract: An order re-check system, comprising: electronic tags arranged on turnover boxes; RFID readers/writers arranged on goods allocations, when the turnover boxed are located on the goods allocations, RFID readers/writers acquiring number information of the turnover boxes via the electronic tags; a first information binding module, used for binding the first number information and the second number information in a one to one manner; a second information binding module, used for binding the second number information and orders in a one to one manner; a commodity information acquisition module, used for acquiring commodity information; a commodity information processing module, used for determining an order for a commodity according to the commodity information, and determining the first number information corresponding to the commodity according to a binding relationship between the first number information and the orders; and control indication modules, used for instructing the corresponding goods allocations or
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: July 23, 2019
    Assignees: BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO., LTD., BEIJING JINGDONG CENTURY TRADING CO., LTD.
    Inventors: Runsu Ning, Jingren Tang, Zanyuan Wang, Haifeng Han, Xuejing Cheng, Xu Yi, Zhen Cui, Jinxing Hu, Jian Dong, Dan Li
  • Publication number: 20190214533
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: February 14, 2019
    Publication date: July 11, 2019
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 10199426
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 5, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 10186540
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: January 22, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 10009103
    Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 26, 2018
    Assignees: CALIFORNIA INSTITUTE OF TECHNOLOGY, THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Kerry Vahala, Scott Diddams, Jiang Li, Xu Yi, Hansuek Lee
  • Publication number: 20180102394
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Application
    Filed: December 1, 2017
    Publication date: April 12, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20180006192
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 4, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 9859327
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: January 2, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20170270754
    Abstract: An order re-check system, comprising: electronic tags arranged on turnover boxes; RFID readers/writers arranged on goods allocations, when the turnover boxed are located on the goods allocations, RFID readers/writers acquiring number information of the turnover boxes via the electronic tags; a first information binding module, used for binding the first number information and the second number information in a one to one manner; a second information binding module, used for binding the second number information and orders in a one to one manner; a commodity information acquisition module, used for acquiring commodity information; a commodity information processing module, used for determining an order for a commodity according to the commodity information, and determining the first number information corresponding to the commodity according to a binding relationship between the first number information and the orders; and control indication modules, used for instructing the corresponding goods allocations or
    Type: Application
    Filed: November 3, 2015
    Publication date: September 21, 2017
    Inventors: Runsu NING, Jingren TANG, Zanyuan WANG, Haifeng HAN, Xuejing CHENG, Xu YI, Zhen CUI, Jinxing HU, Jian DONG, Dan LI
  • Publication number: 20170112192
    Abstract: An electronic cigarette atomizer has a holder connected to a base. The holder is coated with a transparent tube and the upper and lower ends of the holder are connected with the upper and lower ends of the transparent tube hermetically. The air intake tube prevents the e-liquid from leaking out and covers the upper half of the holder. The internal surface of the nozzle base is connected to the outer surface of the exhaust tube. The internal surface of the holder is connected with the outer surface of the nozzle base. The internal surface of the air intake tube is connected with the outer surface of the nozzle base. There are air intake holes in the upper end of the holder. In the lower end of the nozzle base there is a groove which is connected to the air intake holes.
    Type: Application
    Filed: October 26, 2015
    Publication date: April 27, 2017
    Inventor: Xu Yi Shan
  • Publication number: 20170084663
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Application
    Filed: December 2, 2016
    Publication date: March 23, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20170012705
    Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.
    Type: Application
    Filed: August 11, 2016
    Publication date: January 12, 2017
    Inventors: Kerry VAHALA, Scott DIDDAMS, Jiang LI, Xu YI, Hansuek LEE
  • Patent number: 9543354
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: January 10, 2017
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 9450673
    Abstract: A microwave-frequency source at frequency fM comprises: a dual optical-frequency reference source, an electro-optic sideband generator, an optical bandpass filter, an optical detector, a reference oscillator, an electrical circuit, and a voltage-controlled oscillator (VCO). The sideband generator modulates dual optical reference signals at v2 and v1 to generate sideband signals at v1±n1fM and v2±n2fM. The bandpass filter transmits sideband signals at v1+N1fM and v2?N2fM. The optical detector generates a beat note at (v2?N2fM)?(v1+N1fM). The beat note and a reference oscillator signal are processed by the circuit to generate a loop-filtered error signal to input to the VCO. Output of the VCO at fM drives the sideband generator and forms the microwave-frequency output signal. The resultant frequency division results in reduced phase noise on the microwave-frequency signal.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: September 20, 2016
    Assignees: CALIFORNIA INSTITUTE OF TECHNOLOGY, THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
    Inventors: Kerry Vahala, Scott Diddams, Jiang Li, Xu Yi, Hansuek Lee
  • Publication number: 20150325613
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Application
    Filed: June 18, 2015
    Publication date: November 12, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong