Abstract: A method of depositing a material on one of two, but not both, sidewalls of a raised structure formed on a substrate includes tilting a normal of the substrate away from a source of the deposition material or tilting the source of the deposition material away from the normal of the substrate. The method may be implemented by a plasma-enhanced chemical vapor deposition (PECVD) technique.

Abstract: In a material verification method, information of newly loaded materials in a production line is obtained. It is determined whether the information has been verified. If the information has not been verified, it is determined whether a tray supporting the newly loaded materials has been switched from use in producing a first product to use in producing a second product. If the tray supporting the newly loaded materials is not switched to use in producing the second product, the information of the newly loaded materials is presented to a user for material verification. A system for administering such method and a device applying the method are also disclosed.

Abstract: A method for semiconductor manufacturing includes providing a substrate, forming a patterning layer over the substrate, and patterning the patterning layer to form a hole in the patterning layer. The method also includes applying a first directional etching to two inner sidewalls of the hole to expand the hole along a first direction and applying a second directional etching to another two inner sidewalls of the hole to expand the hole along a second direction that is different from the first direction.

Abstract: A portable electronic device including a first body, a second body, a hinge mechanism, a control unit, a sensor unit, a sterilization module, and a shielding module, is provided. The first body has a first inner surface. The second body has a second inner surface. The hinge mechanism is connected between the first body and the second body. The control unit is disposed in the first body or the second body. The sensor unit is disposed in the first body or the second body and coupled to the control unit. The sterilization module is disposed at the hinge mechanism and coupled to the control unit, the sterilization module is configured to generate light for sterilization and disinfection. The shielding module is disposed on the hinge mechanism and the shielding module can move relative to the hinge mechanism.

Abstract: A grounding sheet having a body and elastic conduction sheets is provided. The elastic conduction sheet has a first elastic sheet and a second elastic sheet, each of the first elastic sheet and the second elastic sheet a closed terminal, a floating arm, a connection arm, at least one free terminal and at least one end terminal, wherein the closed terminal is connected to the body of the grounding sheet, the connection arm is connected to the closed terminal and the floating arm, the free terminal is connected to the floating arm, and the end terminal is connected to the free terminal and corresponds to the floating arm. The first elastic sheet has the merely one free terminal, and the second elastic sheet has the two free terminals and the two end terminals. The connector using the same can quickly conduct noise outside.

Abstract: A method of depositing a material on one of two, but not both, sidewalls of a raised structure formed on a substrate includes tilting a normal of the substrate away from a source of the deposition material or tilting the source of the deposition material away from the normal of the substrate. The method may be implemented by a plasma-enhanced chemical vapor deposition (PECVD) technique.

Abstract: A grounding sheet having a body and elastic conduction sheets is provided. The elastic conduction sheet has a first elastic sheet and a second elastic sheet, each of the first elastic sheet and the second elastic sheet a closed terminal, a floating arm, a connection arm, at least one free terminal and at least one end terminal, wherein the closed terminal is connected to the body of the grounding sheet, the connection arm is connected to the closed terminal and the floating arm, the free terminal is connected to the floating arm, and the end terminal is connected to the free terminal and corresponds to the floating arm. The first elastic sheet has the merely one free terminal, and the second elastic sheet has the two free terminals and the two end terminals. The connector using the same can quickly conduct noise outside.

Abstract: A backlight module includes a housing including a bottom plate and side plates, forming a receiving cavity; a backlight source received in the receiving cavity, and including a plurality of LED lights each having a light-emitting center portion for projecting light in a first direction; and a light guide plate received in the receiving cavity, and including a light receiving edge surface facing the backlight source and extending in a second direction, a light-exiting top surface, and a bottom surface. First regions are included on a portion of the bottom surface of the light guide plate close to the light receiving edge surface in one-to-one correspondence to the light-emitting center portion of each LED light of the plurality of LED lights, each of the plurality of first regions having at least one first groove arranged in the first direction and extending in the second direction.

Abstract: In a method of forming a pattern, a photo resist layer is formed over an underlying layer, the photo resist layer is exposed to an actinic radiation carrying pattern information, the exposed photo resist layer is developed to form a developed resist pattern, a directional etching operation is applied to the developed resist pattern to form a trimmed resist pattern, and the underlying layer is patterned using the trimmed resist pattern as an etching mask.

Abstract: A backlight module and a display device are provided. The backlight module includes a housing, a backlight source and a light guide plate. The housing includes a bottom plate and side plates, and the side plates and the bottom plate form a receiving cavity for accommodating the backlight source and the light guide plate. The backlight source includes a plurality of LED lights, and each LED light includes a light-opening portion at center. The light-opening portion has a light-existing side that is opposite to the light guide plate. A plurality of first regions is included on a side of the light guide plate close to the backlight source. The plurality of first regions is in one-to-one correspondence with the light-opening portions. At least one first groove is included on a side of each first region close to the bottom plate.

Abstract: A solution for treating a contact lens and a contact lens packaging system are provided. The solution includes about 0.01 to about 1.0 parts by weight (pbw) of a polymer having phosphorylcholine groups, about 0.005 to about 0.05 pbw of a hydrophilic molecule, about 0.01 to about 1.0 pbw of an inorganic salt, and about 100 pbw of water. A number-average molecular weight of the polymer is about 4,000 to about 1,000,000 daltons. The polymer has a structure of formula (I): wherein, in formula (I), m is a positive integer, n is zero or a positive integer, and R is C2-C12 alkyl group, or C2-C12 hydroxyalkyl group. When n is a positive integer, m/n is greater than 1. Moreover, a number-average molecular weight of the hydrophilic molecule is about 10,000 to about 5,000,000 daltons. The hydrophilic molecule is hyaluronic acid (HA) or hyaluronate salt.

Abstract: A system and method for depositing a photoresist and utilizing the photoresist are provided. In an embodiment a deposition chamber is utilized along with a first precursor material comprising carbon-carbon double bonds and a second precursor material comprising repeating units to deposit the photoresist onto a substrate. The first precursor material is turned into a plasma in a remote plasma chamber prior to being introduced into the deposition chamber. The resulting photoresist comprises a carbon backbone with carbon-carbon double bonds.

Abstract: The present disclosure provides a method for semiconductor manufacturing in accordance with some embodiments. The method includes providing a substrate and a patterning layer over the substrate, wherein the substrate includes a plurality of features to receive a treatment process; forming at least one opening in the patterning layer, wherein the plurality of features is partially exposed in the at least one opening; applying a directional etching to expand the at least one opening in a first direction, thereby forming at least one expanded opening; and performing the treatment process to the plurality of features through the at least one expanded opening.

Abstract: Fast channel deployment is achieved amongst subscriber devices (SDs) having an incident scene role at an incident scene. An SD detects an incident scene arrival trigger associated with arrival at an incident scene. Responsive to detecting the incident scene arrival trigger, the SD (i) tunes to a pre-configured incident channel or (ii) scans a plurality of channels for an incident channel and tunes to the incident channel once located. The SD receives, via the incident channel, an incident scene role to traffic channel mapping that maps a particular incident scene role associated with the subscriber device to a particular assigned traffic channel on which subscriber devices associated with a same incident scene role may communicate. The SD tunes to the particular assigned traffic channel as a function of the incident scene role to traffic channel mapping.

Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.

Abstract: A hinge structure including a first screw rod, a sliding rod, and a second screw rod is provided. The first screw rod comprises a threaded shaft. The sliding rod is sleeved on the threaded shaft. The second screw rod is sleeved on the sliding rod. The threaded shaft has a first helical slot. The sliding rod has a first guiding portion and a second guiding portion, and the first guiding portion is coupled to the first helical slot. The second screw rod has a second helical slot, and the second guiding portion is coupled to the second helical slot.

Abstract: A method for semiconductor manufacturing includes providing a substrate, forming a patterning layer over the substrate, and patterning the patterning layer to form a hole in the patterning layer. The method also includes applying a first directional etching to two inner sidewalls of the hole to expand the hole along a first direction and applying a second directional etching to another two inner sidewalls of the hole to expand the hole along a second direction that is different from the first direction.

Abstract: A system and method for depositing a photoresist and utilizing the photoresist are provided. In an embodiment a deposition chamber is utilized along with a first precursor material comprising carbon-carbon double bonds and a second precursor material comprising repeating units to deposit the photoresist onto a substrate. The first precursor material is turned into a plasma in a remote plasma chamber prior to being introduced into the deposition chamber. The resulting photoresist comprises a carbon backbone with carbon-carbon double bonds.

Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.

Abstract: A method for manufacturing a semiconductor device includes depositing a hard mask layer on an upper surface of an insulating layer. The hard mask layer is etched to form an opening in the hard mask layer. A via recess is formed in the insulating layer through the opening. A first photoresist layer is formed on the hard mask layer and in the via recess. The first photoresist layer is etched to form a photoresist plug in the via recess. Two opposite sides of the opening are etched to remove portions of the hard mask layer and thereby a portion of the upper surface of the insulating layer is exposed. The photoresist plug is removed. Metal is deposited in the via recess and on the exposed surface of the insulating layer. The metal is patterned.