Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.

Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

Abstract: A testing method for a LED module and its associated elements includes the steps of: providing a LED module on which a plurality of light-emitting diodes is arranged; providing an integration detector, and mounting it above the LED module; providing an electrically conducting means having a plurality of conductive terminals and an electronic signal connector electrically connected to the conductive terminals; electrically connecting the light-emitting diodes with the conductive terminals; using the electronic signal connector to change the ON/OFF states of the electrical signals of the light-emitting diodes and the conductive terminals; and detecting the photo-electrical properties of each light-emitting diode via the integration detector.

Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines the position of a MEMS part to be placed on the application platform. The method further comprises placing the MEMS part into the opening of the guiding mask on the application platform, and removing the guiding mask from the application platform after the MEMS part is bonded to the application platform.

Abstract: An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks.

Abstract: A data card for a computer system capable of providing a loudspeaker mode for a mobile phone call is disclosed. The data card includes an antenna, an RF module, a first signal processing unit for processing a baseband signal for generating a first analog audio output signal corresponding to audio data played by a speaker when the computer system operates in the loudspeaker mode, a second signal processing unit, a transmission interface for outputting a first digital audio output signal corresponding to the audio data to the computer system, wherein the first digital audio output signal is generated according to the first analog audio output signal through an encoding process, a microphone device, and an audio codec for performing the encoding process on the first analog audio output signal in order to generate the first digital audio output signal.

Abstract: A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects.

Abstract: A probe array is assembled on a probe card platform. Each of the probes in the probe array has a probe base that includes a gripping handle. The probe bases have two or more different shapes. The probe bases of different shapes are interleaved such that any two adjacent probes on the platform have probe bases of different shapes. The arrangement of the probes increases effective spacing between the probes to facilitate the maneuvering of a handling tool.

Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.

Abstract: A probe array is assembled on a probe card platform. Each of the probes in the probe array has a probe base that includes a gripping handle. The probe bases have two or more different shapes. The probe bases of different shapes are interleaved such that any two adjacent probes on the platform have probe bases of different shapes. The arrangement of the probes increases effective spacing between the probes to facilitate the maneuvering of a handling tool.

Abstract: A picture-in-picture display apparatus having stereoscopic display functionality includes a receiving unit for receiving first and second data sets, an image processing unit for performing computational processing to convert two-dimensional data to three-dimensional data or to convert three-dimensional data to two-dimensional data with respect to the first data set and/or the second data set, and a display unit. The display unit has a main picture display zone and a sub-picture display zone. The first and second data sets are respectively displayed in the main picture display zone and the sub-picture display zone.

Abstract: An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board.

Abstract: A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.

Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

Abstract: A system for splitting a display zone of a screen is installed in an electronic device having a screen, and includes a detecting module for detecting screen pixels. A splitting processor receives a splitting instruction containing a splitting number n, and splits the display zone into a main display region and a number (n-i) of extension display regions. A total number of width pixels of adjacent ones of the main and extension display regions from left to right of the display zone equals the number of width pixels of the screen. A total number of height pixels of adjacent ones of the main and extension display regions from top to bottom of the display zone equals the number of height pixels of the screen. A display module displays two or more operating interfaces, files, and/or pages of at least one application in the main and extension display regions, respectively.

Abstract: A light-guiding element cooperates with a light source and includes a light-guiding frame and a scattering material. The light-guiding frame has a light incident surface, a light output surface, and an inclined surface. Light emitted by the light source enters into the light-guiding frame through the light incident surface, and the light is reflected by the inclined surface to be outputted through the light output surface. The scattering material is disposed at the inclined surface. A light-emitting module having the light-guiding element and an electronic device are also disclosed.

Abstract: A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing an annular dam on a substrate; b) mounting an image sensing module, having a light-receiving region exposed, inside the annular dam on the substrate; c) connecting the image sensing module and the substrate via a plurality of bonding wires; d) forming a barrier around the light-receiving region on the image sensing module; e) filling an adhesive between the barrier and the annular dam with the plurality of bonding wires being encapsulated; f) forming a transparent lid above the light-receiving region; and g) cutting off the annular dam.

Abstract: A color filter including a substrate and a color filter layer is disclosed. The color filter layer is disposed on the substrate and includes a red photonic crystal structures, a green photonic crystal structure and a blue photonic crystal structure. The red photonic crystal structure includes a first defect resonance cavity and has multiple first holes surrounding the first defect resonance cavity. The green photonic crystal structure includes a second defect resonance cavity and has multiple second holes surrounding the second defect resonance cavity. The blue photonic crystal structure includes a third defect resonance cavity and has multiple third holes surrounding the third defect resonance cavity. Wherein, the hole diameter of the first holes is less than the hole diameter of the second holes, and the hole diameter of the second holes is less than the hole diameter of the third holes.

Abstract: A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing a wafer having at least an image sensing module with a light-receiving region exposed; b) forming a barrier around the light-receiving region on the image sensing module; c) dicing the wafer for forming an individual device with the image sensing module; and d) forming a transparent lid supported by the barrier above the light-receiving region of the image sensing module.