Patents by Inventor YANG MING
YANG MING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250226339Abstract: An advanced semiconductor packaging structure includes a circuit board, a first chip disposed on the circuit board, and a second chip disposed on the first chip. The first chip has solder balls arranged at intervals and bonded to the circuit board, and first pads arranged at intervals. The second chip has second pads arranged at intervals. Each of the second pads is correspondingly bonded to each of the first pads. Each of the first and second pads comprises a graphene-copper composite material composed of graphene and copper. The graphene has a plurality of graphene microfilms. The graphene microfilms are dispersed and arranged in the gaps between adjacent copper atoms. The graphene microfilms have covalent bonds. Based on the total weight of the graphene-copper composite material, the graphene content is less than 3 wt %, and the oxygen content in the graphene-copper composite material is not greater than 10 ppm.Type: ApplicationFiled: November 13, 2024Publication date: July 10, 2025Applicant: AMAZING COOL TECHNOLOGY CORPORATIONInventors: Hsien-Tsung Tsai, Yang-Ming Shih, Hung-Yun Hsu
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Publication number: 20250218948Abstract: A semiconductor device includes a substrate, an ILD layer on the substrate, a contact electrode unit with a gate wiring layer and contacts in the ILD layer, a lower IMD layer on the ILD layer, a wiring unit with lower and upper wiring layers disposed on the lower IMD layer and connected to the contacts, interconnect units stacked along a height direction on the wiring unit, including an upper IMD layer, lower and upper wiring layers and interconnects in the upper IMD layer and connected to each other; and a bonding pad unit including an insulating layer, interconnects and an upper wiring layer in the insulating layer connected to each other. The lower wiring layer is made of a graphene-copper composite material having graphene flakes covalently bonded and dispersed between copper atoms. The graphene content is less than 3 wt % and the oxygen content is no more than 10 ppm.Type: ApplicationFiled: September 29, 2024Publication date: July 3, 2025Applicant: AMAZING COOL TECHNOLOGY CORPORATIONInventors: Hsien-Tsung Tsai, Yang-Ming Shih, Hung-Yun Hsu
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Publication number: 20250168840Abstract: The present disclosure provides an electronic device for wireless communication, comprising a processing circuit configured to set, according to report information of the channel quality between a user equipment and the electronic device and between the user equipment and a neighboring electronic device adjacent to the electronic device reported by the user equipment within the service range thereof, the following indication information comprised in information corresponding to a resource block in relative narrowband transmission power (RNTP) signaling to be sent to neighboring electronic devices, wherein the indication information is used for indicating the degree that the user equipment of the electronic device scheduled on the resource block is interfered by the neighboring electronic device.Type: ApplicationFiled: March 22, 2023Publication date: May 22, 2025Applicant: Sony Group CorporationInventors: Yang MING, Zhaocheng WANG, Jianfei CAO
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Patent number: 12266620Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.Type: GrantFiled: February 29, 2024Date of Patent: April 1, 2025Assignee: AMAZING COOL TECHNOLOGY CORP.Inventors: Shiann-Tsong Tsai, Yang-Ming Shih, Hung-Yun Hsu
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Publication number: 20250099031Abstract: There is provided a wearable device including at least one light source, a light sensor and a processor. The processor generates a peak interval plot according to one of at least two light detection signals detected by the light sensor when the at least one light source emits light, and generates an oxygen saturation plot according to two of the one of at least two light detection signals detected by the light sensor when the at least one emits light. The processor further determines an Apnea Hypopnea Index (AHI) score according to the peak interval plot, determines an Oxygen Desaturation Index (ODI) score according to the oxygen saturation plot and fits an obstructive sleep apnea level index corresponding to the AHI score and the ODI score.Type: ApplicationFiled: January 16, 2024Publication date: March 27, 2025Inventors: Chih-Hao WANG, Shih-Jen LU, Chien-Yi KAO, Yang-Ming CHOU, Hsin-Yi LIN
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Patent number: 12251722Abstract: A sprayer includes: a container; a passage including a transparent window, a first opening, a second opening and a resonator, wherein when liquid in the container is passed through the resonator via the first opening, the liquid is emitted as a gas via the second opening; and a removable detection unit disposed outside of the passage. The removable detection unit includes: a light source for illuminating the gas in the passage; an optical sensor disposed to detect a parameter of light reflected by the gas; and a processor coupled to the optical sensor for stopping the resonator from generating the gas when the parameter is below a threshold. The passage further includes a cavity disposed on a bottom surface of the passage in front of the optical sensor, wherein when the gas in the passage contacts the bottom surface, resultant water vapour will enter the cavity.Type: GrantFiled: June 14, 2022Date of Patent: March 18, 2025Assignee: PixArt Imaging Inc.Inventors: Chih-Hao Wang, Yang-Ming Chou, Chien-Yi Kao, Shih-Jen Lu, Chih-Ming Sun, Hsin-Yi Lin
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Patent number: 12218004Abstract: A method for forming a semiconductor structure is provided. In one form, a method includes: providing a base; forming a pattern memory layer on the base, where at least a first trench and a second trench are provided on the pattern memory layer, where an extending direction of the first trench is parallel to an extending direction of the second trench, and the first trench and the second trench are formed using different masks; and forming mandrel lines separated on the base at positions of the base that correspond to the first trench and the second trench. By using the method, a problem that a photoresist peels off during etching due to an elongated shape when separated mandrel lines are directly formed can be avoided. Further, a problem of a relatively high requirement on a filling material when the mandrel lines are formed directly by using a plurality of photolithography processes can be avoided, to lower the requirement on the filling material.Type: GrantFiled: April 13, 2021Date of Patent: February 4, 2025Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATIONInventors: He Zuopeng, Yang Ming, Bei Duohui
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Publication number: 20240267570Abstract: The present application provides techniques for virtual live streaming. The techniques comprise loading at least two virtual images in a current live streaming room in response to a request for adding the at least two virtual images; generating a unique identifier corresponding to each of the at least two virtual images while loading each of the at least two virtual images; obtaining motion capture data indicative of motions to be applied in the current live streaming room; and performing virtual live streaming in the current live streaming room based on the at least two virtual images and the motion capture data.Type: ApplicationFiled: December 29, 2023Publication date: August 8, 2024Inventors: Huaizhou ZHANG, Shaoxiong GUO, Yang MING
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Publication number: 20240203914Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.Type: ApplicationFiled: February 29, 2024Publication date: June 20, 2024Inventors: Shiann-Tsong TSAI, Yang-Ming SHIH, Hung-Yun HSU
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Patent number: 11986336Abstract: A non-spectral computed tomography scanner includes a radiation source configured to emit x-ray radiation, a detector array configured to detect x-ray radiation and generate non-spectral data, and a memory configured to store a spectral image module that includes computer executable instructions including a neural network trained to produce spectral volumetric image data. The neural network is trained with training spectral volumetric image data and training non-spectral data. The non-spectral computed tomography scanner further includes a processor configured to process the non-spectral data with the trained neural network to produce spectral volumetric image data.Type: GrantFiled: November 2, 2022Date of Patent: May 21, 2024Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Chuanyong Bai, Yang-Ming Zhu, Sheng Lu, Shiyu Xu, Hao Dang, Hao Lai, Douglas McKnight, Hui Wang
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Patent number: 11955443Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.Type: GrantFiled: February 17, 2022Date of Patent: April 9, 2024Assignee: AMAZING COOL TECHNOLOGY CORP.Inventors: Shiann-Tsong Tsai, Yang-Ming Shih, Hung-Yun Hsu
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Publication number: 20240100553Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.Type: ApplicationFiled: December 5, 2023Publication date: March 28, 2024Applicant: PixArt Imaging Inc.Inventors: Shih-Jen Lu, Yang-Ming Chou, Chih-Hao Wang, Chien-Yi Kao, Hsin-Yi Lin
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Patent number: 11918329Abstract: A physiological detection device includes system including a first array PPG detector, a second array PPG detector, a display and a processing unit. The first array PPG detector is configured to generate a plurality of first PPG signals. The second array PPG detector is configured to generate a plurality of second PPG signals. The display is configured to show a detected result of the physiological detection system. The processing unit is configured to convert the plurality of first PPG signals and the plurality of second PPG signals to a first 3D energy distribution and a second 3D energy distribution, respectively, and control the display to show an alert message.Type: GrantFiled: April 23, 2021Date of Patent: March 5, 2024Assignee: PIXART IMAGING INC.Inventors: Chiung-Wen Lin, Wei-Ru Han, Yang-Ming Chou, Cheng-Nan Tsai, Ren-Hau Gu, Chih-Yuan Chuang
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Patent number: 11867498Abstract: A sprayer includes: a container arranged to contain liquid; a passage including a transparent window, a first opening, a second opening and a resonator, wherein when the liquid in the container is passed through the resonator via the first opening, the liquid is emitted as a gas via the second opening; and a detection unit disposed outside of the passage. The detection unit includes: a light source disposed to emit light through the light transparent window for illuminating the gas in the passage such that the gas will reflect the emitted light; an optical sensor disposed to detect a parameter of the reflected light through the transparent window; and a processor coupled to the optical sensor for stopping the resonator from generating the gas when the parameter of the reflected light is below a first threshold corresponding to a specific level of liquid within the container.Type: GrantFiled: January 7, 2021Date of Patent: January 9, 2024Assignee: PixArt Imaging Inc.Inventors: Chih-Hao Wang, Yang-Ming Chou, Chien-Yi Kao, Shih-Jen Lu, Chih-Ming Sun, Hsin-Yi Lin
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Patent number: 11845172Abstract: A multi-tool (100) includes a power head (120) including a power head housing (122) having a handle (124) operably coupled thereto, a tool attachment (106, 108, 110) configured to perform a work function, the tool attachment (106, 108, 110) being alternately separable from and operably coupled to the power head (120), a motor (140) disposed in the power head housing (122), a battery (130) configured to be operably coupled to the motor (140) to selectively power the motor (140), a drive provider portion (300) disposed at the power head (120), and a drive receiver portion (320) disposed at the tool attachment (106, 108, 110). The drive provider portion (300) includes a driving portion (302) of a shaft (150) operably coupled to the motor (140), and the drive receiver portion (320) includes a driven portion (322) of the shaft (150). The driving portion (302), the drive receiver portion (320), and the motor (140) share a common axis (148).Type: GrantFiled: December 6, 2017Date of Patent: December 19, 2023Assignee: HUSQVARNA ABInventors: Ni Zugen, Yang Ming, Li Li, Chad Jones, Garrett Sherman, Jeffrey C. Hickman, David Lawrence Estey
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Patent number: 11829698Abstract: A method and system for guided power grid augmentation determines a minimum resistance path for cells within an integrated circuit (IC) design. The minimum resistance path traces a conducting wire connecting a pin of a cell to an IC tap within the IC design. A voltage drop value for each of the cells is determined so as to identify target cells having a voltage drop value that satisfies a voltage drop criteria. Polygons have defined size characteristics are defined around the minimum resistance paths of the target cells, and conductors, such as additional conductors, are generated within the defined polygons.Type: GrantFiled: August 13, 2021Date of Patent: November 28, 2023Assignee: Synopsys, Inc.Inventors: Hsiang-Wen Chang, Yang-Ming Chen
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Publication number: 20230371187Abstract: A package substrate structure includes a substrate, a metal base layer, a build-up film, a bonding layer, and a wiring unit. The metal base layer is disposed on the substrate. The build-up film is disposed on the metal base layer and is formed with trenches to expose the metal base layer. The build-up film includes an insulating material. The bonding layer is disposed on the build-up film and includes a graphene-metal composite. The graphene-metal composite includes a metal matrix, and a plurality of graphene nanostructures dispersed in the metal matrix and arranged among lattices of the metal matrix. The graphene nanostructures form covalent bonds with each other. The wiring unit is bonded to the build-up film through the bonding layer and fills the trenches so as to be electrically connected to the metal base layer. The wiring unit is formed with a wiring pattern on the build-up film.Type: ApplicationFiled: May 11, 2023Publication date: November 16, 2023Inventors: Shiann-Tsong TSAI, Yang-Ming SHIH, Hung-Yun HSU
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Patent number: 11748598Abstract: An imaging method (100) includes: acquiring first training images of one or more imaging subjects using a first image acquisition device (12); acquiring second training images of the same one or more imaging subjects as the first training images using a second image acquisition device (14) of the same imaging modality as the first imaging device; and training a neural network (NN) (16) to transform the first training images into transformed first training images having a minimized value of a difference metric comparing the transformed first training images and the second training images.Type: GrantFiled: October 16, 2018Date of Patent: September 5, 2023Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Chuanyong Bai, Yang-Ming Zhu, Andriy Andreyev, Bin Zhang, Chi-Hua Tung
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Publication number: 20230260936Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.Type: ApplicationFiled: February 17, 2022Publication date: August 17, 2023Inventors: Shiann-Tsong TSAI, Yang-Ming SHIH, Hung-Yun HSU
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CORROSION-RESISTANT COATING OF REINFORCING STELL FOR MARINE CONCRETE AND PREPARATION METHOD THEREFOR
Publication number: 20230257597Abstract: A preparation method for a corrosion-resistant coating of a reinforcing steel for marine concrete, comprising the steps: (1) pretreating the surface of a reinforcing steel; (2) preparing self-repairing corrosion microcapsules; (3) preparing a cathodic electrophoresis coating; (4) carrying out cathodic electrophoresis; and (5) curing. The electrophoresis coating of the present invention contains the self-repairing corrosion microcapsules, metal powder, and graphene oxide powder. The corrosion resistance of the coating is improved under the co-action of the self-repairing properties of the self-repairing microcapsules and cathodic protection. The corrosion-resistant coating has excellent adhesion and corrosion resistance, prolonging the service life of reinforcing steel. It is widely used for the protection of reinforcing steels for marine concrete, and also for the protection of metal structures in general environment.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Inventors: PING CHEN, YANG MING, LING LI, CHENG HU, QING LI, XUANDONG CHEN, RONGJIN LIU, SHUNKAI LI, YANRONG ZHAO, JIAZHAN WEI