Patents by Inventor Yang Yu

Yang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11553506
    Abstract: A mobile computing device is configured to dynamically aggregate wireless communications on a common antenna. The device determines that a WiFi communication in a first frequency band is associated with an antenna, the WiFi communication having a number of assigned transmission time slots. The device determines that a second wireless communication in a second frequency band also is associated with the antenna, and determines a periodicity and/or a media quality of the second wireless communication. Based on the periodicity and/or media quality of the second wireless communication, the device aggregates the WiFi communication and the second wireless communication, the aggregation comprising assigning a number of packets of the second wireless communication to an aggregation frame of a plurality of frames associated with the transmission time slots assigned to the WiFi communication.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: January 10, 2023
    Assignee: APPLE INC.
    Inventors: Camille Chen, Nohee Ko, Sanjay Mani, Sudhanshu John, William F. Healey, Yang Yu
  • Patent number: 11549169
    Abstract: A method for preparing a thermal barrier coating (TBC) material includes: spraying a metal mixture onto a surface of an alloy using supersonic flame spraying or explosive spraying to form a bottom layer; spraying an yttria-stabilized zirconia (YSZ) precursor sol onto the bottom layer using liquid plasma spraying to form an intermediate layer; and spraying a ceramic composite including SiO2 and La—Ce—Zr—O using plasma spraying or explosive spraying to form a surface layer.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: January 10, 2023
    Assignee: AECC BEIJING INSTITUTE OF AERONAUTICAL MATERIALS
    Inventors: Mengqiu Guo, Haoliang Tian, Changliang Wang, Zhihui Tang, Yang Yu, Yongjing Cui, Junguo Gao, Zimin Zhou, Tianying Wang, Ang Zhang
  • Publication number: 20220415982
    Abstract: A display device, a display panel, and a manufacturing method therefor are provided. The display panel includes a flexible substrate, a display layer on one side of the flexible substrate, and an encapsulation layer covering a surface of the display layer away from the flexible substrate. The display layer has a stretching area provided with a plurality of pixel islands spaced apart and a through-hole. A blocking dam is in an area corresponding to the pixel island and surrounds a plurality of light-emitting units. The encapsulation layer includes an organic layer that is in the stretching area and confined within an annular area surrounded by the blocking dam.
    Type: Application
    Filed: May 20, 2021
    Publication date: December 29, 2022
    Inventors: Yang YU, Fangxu CAO, Pinfan WANG, Wenqiang LI, Bo WANG, Jingquan WANG
  • Patent number: 11539823
    Abstract: A muffling device includes an acquisition circuit, configured to obtain reference sound wave information of a user. The muffling device includes a modulation circuit, configured to analyze an acoustic wave characteristic of the reference sound wave information to obtain a characteristic parameter of the reference sound wave information. The muffling device includes a muffling circuit, configured to generate compensated sound wave information according to the characteristic parameter of the reference sound wave information. The muffling device includes a correction circuit, configured to compare muffed sound wave information superimposed by the compensated sound wave information and the reference sound wave information with the reference sound wave information, and feed back a comparison result to the muffling circuit. The muffling circuit can adjust the compensated sound wave information according to a fed back comparison result.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: December 27, 2022
    Assignees: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yang Yu, Jiamin Liao, Shijian Luo, Tao Luo, Heyuan Qiu, Xiaowei Liu, Haiguang Li, Fan Chen
  • Patent number: 11536655
    Abstract: Diffraction-based imaging systems are described. Aspects of the technology relate to imaging systems having one or more sensors inclined at angles with respect to a sample plane. In some cases, multiple sensors may be used that are, or are not, inclined at angles. The imaging systems may have no optical lenses and are capable of reconstructing microscopic images of large sample areas from diffraction patterns recorded by the one or more sensors. Some embodiments may reduce mechanical complexity of a diffraction-based imaging system. A diffractive imaging system comprises a light source, a sample support configured to hold a sample along a first plane, and a first sensor comprising a plurality of pixels disposed in a second plane that is tilted at an inclined angle relative to the first plane. The first sensor is arranged to record diffraction images of the light source from the sample.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: December 27, 2022
    Assignee: Path AI, Inc.
    Inventors: Justin Lee, Hsiou-Yuan Liu, Bikram Yonjan, Bo Yang Yu, Yibo Zhang
  • Patent number: 11531535
    Abstract: Embodiments disclose a firmware upgrade method and apparatus, and a terminal. The method includes: sequentially obtaining first upgrade data and operation instructions in all data blocks in a block differential upgrade package; converting first data into a second upgrade data in an image of an old firmware version according to the operation instruction; and controlling the first upgrade data and the second upgrade data to overwrite a to-be-upgraded data area in the image of the old firmware version. An operation of upgrading to an image of a new firmware version is completed in the image of the old firmware version based on the first upgrade data and the second upgrade data. In addition, in comparison with a conventional differential upgrade package, in the block differential upgrade package, a part or all of data in the conventional differential upgrade package is replaced with an operation instruction.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: December 20, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yang Yu, Yuhao Xi, Cong Zhu
  • Patent number: 11532252
    Abstract: Disclosed are a test signal access board and a lighting jig, including: a substrate layer; and a data signal access part arranged on the substrate layer and including at least two rows of conductive contacts, where the conductive contacts are configured to be electrically connected with data signal test leads of a display panel; the conductive contacts in adjacent rows are arranged in a staggered manner; and a staggered pitch between the conductive contacts in adjacent rows is less than a pitch between the data signal test leads of the display panel.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: December 20, 2022
    Assignees: Fuzhou BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Wenjin Cheng, Yang Yu, Zongtian Xie, Huoying Fu, Huailiang Wu
  • Publication number: 20220394515
    Abstract: A method and apparatus of a device that manages a video telephony call is described. In an exemplary embodiment, the device receives a network event from a network service of a device. The device further determines that the network event that is due to a local disruption of a network component of the device. In addition, and in response to the determination, the device restricts a local dynamic control of the video telephony call.
    Type: Application
    Filed: June 3, 2022
    Publication date: December 8, 2022
    Inventors: Erik Vladimir Ortega Gonzales, Karthick Santhanam, Luciano M. Verger, Christopher M. Garrido, Ming Jin, Ashwin Ramesh, Hsien-Po Shiang, Brajesh K. Dave, Yang Yu, Cahya Masputra, Santosh Vamaraju, David L. Biderman, Suryaprakash Bangalore Rajeevalochana, Gurtej Singh G. Chandok
  • Publication number: 20220386306
    Abstract: Some aspects of this disclosure relate to apparatuses and methods for implementing techniques for a first wireless device to select a channel to a second wireless device among a set of channels to the second wireless device shared by a set of wireless devices of the wireless network, and further transmit data to the second wireless device over the selected channel. The first wireless device can perform a measurement to determine a channel occupancy during a measurement period for a channel, wherein the measurement period includes a plurality of periodic transmission durations. The first wireless device can select a channel that is less occupied indicated by the channel occupancy of the channel. The first wireless device can further transmit data to the second wireless device over the selected channel in a transmission period after the measurement period.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: Apple Inc.
    Inventors: Shehla S. RANA, Oren Shani, Rajneesh Kumar, Yang Yu
  • Patent number: 11516822
    Abstract: Methods and apparatuses are presented to facilitate coexistence between multiple wireless communication protocols implemented by a wireless communication device, using a shared antenna, e.g., due to limitations resulting from a small form factor of the wireless communication device. The wireless communication device may determine whether communications according to a second protocol are causing performance of communications according to a first protocol to fall below a threshold level. If so, the wireless communication device may operate in a mode that favors communications according to the first protocol. If not, the wireless communication device may operate in a mode that favors communications according to the second protocol. For example, the mode that favors communications according to the first protocol may include temporarily implementing operations to remedy the poor performance of the communications according to the first, e.g.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: November 29, 2022
    Assignee: Apple Inc.
    Inventors: Camille Chen, Akshay Tumkur Rajshekhar, Arjun Dheer, Gordon Kin, Sanjay Mani, Yang Yu, Tahir Shamim
  • Patent number: 11513030
    Abstract: The present disclosure provides a tidal simulation test device and a method of use thereof. The tidal simulation test device includes a water supply pool, a water level adjustment pool, a subtidal zone simulation pool, an intertidal zone simulation pool, a supratidal zone simulation pool and a two-way water flow adjustment control box. The two-way water flow adjustment control box is provided therein with an electromagnetic flow control meter, a forward frequency conversion self-priming pump, a reverse frequency conversion self-priming pump and an intelligent time-controlled three-way controller. In the method, the start and stop of the forward frequency conversion self-priming pump and the reverse frequency conversion self-priming pump are controlled through an intelligent switch, and a water flow is adjusted through the electromagnetic flow control meter, thereby realizing periodic changes in a water level to simulate different types of tides and coastal wetlands.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: November 29, 2022
    Assignee: Ludong University
    Inventors: Junbao Yu, Miao Yu, Debin Sun, Kai Ning, Hongfang Dong, Xuehong Wang, Yunzhao Li, Di Zhou, Jisong Yang, Chao Zhan, Zhikang Wang, Zhenbo Lv, Jianbai Zhang, Yang Yu
  • Patent number: 11507727
    Abstract: A font rendering method, apparatus and a computer-readable storage medium. The font rendering method includes: receiving a character string that needs to be rendered and reading a font file; parsing the font file to obtain text character pattern information and template information corresponding to the character string; generating an animation unit according to the text character pattern information and the template information; rendering the animation unit. Through the above font rendering method, corresponding template effects can be customized according to different font effects and different rows and columns, and mixed arrangement of text size, customized text position, customized text color and special effects are supported, which are more suitable for scene matching and picture-text combining, fully expressing semantic priority, enhancing text visual impact, highlighting the focus of the language and the text artistic conception.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: November 22, 2022
    Assignee: BEIJING FOUNDER HANDWRITING DIGITAL TECHNOLOGY CO., LTD
    Inventors: Jianbin Jiang, Huijun Wan, Guangcan Dong, Yang Yu
  • Patent number: 11508640
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Publication number: 20220367315
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Publication number: 20220367414
    Abstract: A method of manufacturing a semiconductor structure includes the following operations. A substrate is provided. A first conductive pillar, a second conductive pillar arid a third conductive pillar are disposed over the substrate. The first conductive pillar comprises a first height, the second conductive pillar comprises a second height, and the third conductive pillar comprises a third height. A first die is disposed over the first conductive pillar. A second die is disposed over the second conductive pillar. A first surface of the first die and a second surface of the second die are at substantially same level.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Inventors: CHI-YANG YU, KUAN-LIN HO, CHIN-LIANG CHEN, YU-MIN LIANG
  • Publication number: 20220362106
    Abstract: A medicament filling system (30) provides medicament to a delivery device (20). The medicament filling system (30) comprises a main housing (40) having an air pump (42), a vial adapter (44) that is configured to engage a vial (10) containing medicament, the vial adapter (44) being in communication with the air pump (42), a syringe housing (46) that carries a syringe (70), the syringe housing (46) being in selective communication with the vial adapter (44) and the delivery device (20), and a valve (60) that locks and unlocks movement of a plunger (72) in the syringe (70).
    Type: Application
    Filed: September 25, 2020
    Publication date: November 17, 2022
    Applicant: Becton, Dickinson and Company
    Inventors: J. Richard GYORY, Mark NEWBY, Bradley WILKINSON, Bart PETERSON, Alessandro PIZZOCHERO, Sergey GRIGORYANTS, Bo Yang YU, Heena DANI
  • Publication number: 20220357983
    Abstract: The present disclosure relates to methods and devices for graphics processing including an apparatus, e.g., a GPU. The apparatus may receive a plurality of workloads based on a workload order, each of the plurality of workloads being received in the workload order including at least a first workload and a second workload. The apparatus may also allocate one or more workloads of the plurality of workloads to one or more wave slots. Additionally, the apparatus may execute the one or more allocated workloads at the one or more wave slots, such that at least the first workload is executed at the first wave slot and the second workload is executed at the second wave slot. The apparatus may also allocate at least one other workload of the plurality of workloads to at least one previously-allocated wave slot of the one or more wave slots.
    Type: Application
    Filed: May 7, 2021
    Publication date: November 10, 2022
    Inventors: Yun DU, Andrew Evan GRUBER, Zilin YING, Gang ZHONG, Baoguang YANG, Yang YU, Yang XIA, Ravindra KUMAR, Chun YU, Eric DEMERS
  • Patent number: 11497020
    Abstract: Some aspects of this disclosure relate to apparatuses and methods for implementing techniques for a first wireless device to select a channel to a second wireless device among a set of channels to the second wireless device shared by a set of wireless devices of the wireless network, and further transmit data to the second wireless device over the selected channel. The first wireless device can perform a measurement to determine a channel occupancy during a measurement period for a channel, wherein the measurement period includes a plurality of periodic transmission durations. The first wireless device can select a channel that is less occupied indicated by the channel occupancy of the channel. The first wireless device can further transmit data to the second wireless device over the selected channel in a transmission period after the measurement period.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: November 8, 2022
    Assignee: Apple Inc.
    Inventors: Shehla S. Rana, Oren Shani, Rajneesh Kumar, Yang Yu
  • Publication number: 20220352109
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a redistribution layer, a semiconductor die, conducting connectors, dummy bumps and an underfill. The semiconductor die is disposed on a top surface of the redistribution layer and electrically connected with the redistribution layer. The conducting connectors are disposed between the semiconductor die and the redistribution layer, and are physically and electrically connected with the semiconductor die and the redistribution layer. The dummy bumps are disposed on the top surface of the redistribution layer, beside the conducting connectors and under the semiconductor die. The underfill is disposed between the semiconductor die and the redistribution layer and sandwiched between the dummy bumps and the semiconductor die. The dummy bumps are electrically floating. The dummy bumps are in contact with the underfill without contacting the semiconductor die.
    Type: Application
    Filed: August 29, 2021
    Publication date: November 3, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Nien-Fang Wu, Hai-Ming Chen, Yu-Min Liang, Jiun-Yi Wu
  • Patent number: 11489845
    Abstract: Predictive rendering (also referred to herein as speculative rendering) is disclosed. The predictive rendering is performed by an endpoint browser in response to a user input made by a user. The predictive rendering is verified using a surrogate browser that is executed on a remote server. The verification can be performed asynchronously.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: November 1, 2022
    Assignee: Menlo Security, Inc.
    Inventors: Ji Feng, Gautam Altekar, Yang Yu