Abstract: Disclosed are a test signal access board and a lighting jig, including: a substrate layer; and a data signal access part arranged on the substrate layer and including at least two rows of conductive contacts, where the conductive contacts are configured to be electrically connected with data signal test leads of a display panel; the conductive contacts in adjacent rows are arranged in a staggered manner; and a staggered pitch between the conductive contacts in adjacent rows is less than a pitch between the data signal test leads of the display panel.

Abstract: A method and apparatus of a device that manages a video telephony call is described. In an exemplary embodiment, the device receives a network event from a network service of a device. The device further determines that the network event that is due to a local disruption of a network component of the device. In addition, and in response to the determination, the device restricts a local dynamic control of the video telephony call.

Abstract: Some aspects of this disclosure relate to apparatuses and methods for implementing techniques for a first wireless device to select a channel to a second wireless device among a set of channels to the second wireless device shared by a set of wireless devices of the wireless network, and further transmit data to the second wireless device over the selected channel. The first wireless device can perform a measurement to determine a channel occupancy during a measurement period for a channel, wherein the measurement period includes a plurality of periodic transmission durations. The first wireless device can select a channel that is less occupied indicated by the channel occupancy of the channel. The first wireless device can further transmit data to the second wireless device over the selected channel in a transmission period after the measurement period.

Abstract: Methods and apparatuses are presented to facilitate coexistence between multiple wireless communication protocols implemented by a wireless communication device, using a shared antenna, e.g., due to limitations resulting from a small form factor of the wireless communication device. The wireless communication device may determine whether communications according to a second protocol are causing performance of communications according to a first protocol to fall below a threshold level. If so, the wireless communication device may operate in a mode that favors communications according to the first protocol. If not, the wireless communication device may operate in a mode that favors communications according to the second protocol. For example, the mode that favors communications according to the first protocol may include temporarily implementing operations to remedy the poor performance of the communications according to the first, e.g.

Abstract: The present disclosure provides a tidal simulation test device and a method of use thereof. The tidal simulation test device includes a water supply pool, a water level adjustment pool, a subtidal zone simulation pool, an intertidal zone simulation pool, a supratidal zone simulation pool and a two-way water flow adjustment control box. The two-way water flow adjustment control box is provided therein with an electromagnetic flow control meter, a forward frequency conversion self-priming pump, a reverse frequency conversion self-priming pump and an intelligent time-controlled three-way controller. In the method, the start and stop of the forward frequency conversion self-priming pump and the reverse frequency conversion self-priming pump are controlled through an intelligent switch, and a water flow is adjusted through the electromagnetic flow control meter, thereby realizing periodic changes in a water level to simulate different types of tides and coastal wetlands.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: A font rendering method, apparatus and a computer-readable storage medium. The font rendering method includes: receiving a character string that needs to be rendered and reading a font file; parsing the font file to obtain text character pattern information and template information corresponding to the character string; generating an animation unit according to the text character pattern information and the template information; rendering the animation unit. Through the above font rendering method, corresponding template effects can be customized according to different font effects and different rows and columns, and mixed arrangement of text size, customized text position, customized text color and special effects are supported, which are more suitable for scene matching and picture-text combining, fully expressing semantic priority, enhancing text visual impact, highlighting the focus of the language and the text artistic conception.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: A medicament filling system (30) provides medicament to a delivery device (20). The medicament filling system (30) comprises a main housing (40) having an air pump (42), a vial adapter (44) that is configured to engage a vial (10) containing medicament, the vial adapter (44) being in communication with the air pump (42), a syringe housing (46) that carries a syringe (70), the syringe housing (46) being in selective communication with the vial adapter (44) and the delivery device (20), and a valve (60) that locks and unlocks movement of a plunger (72) in the syringe (70).

Abstract: A method of manufacturing a semiconductor structure includes the following operations. A substrate is provided. A first conductive pillar, a second conductive pillar arid a third conductive pillar are disposed over the substrate. The first conductive pillar comprises a first height, the second conductive pillar comprises a second height, and the third conductive pillar comprises a third height. A first die is disposed over the first conductive pillar. A second die is disposed over the second conductive pillar. A first surface of the first die and a second surface of the second die are at substantially same level.

Abstract: The present disclosure relates to methods and devices for graphics processing including an apparatus, e.g., a GPU. The apparatus may receive a plurality of workloads based on a workload order, each of the plurality of workloads being received in the workload order including at least a first workload and a second workload. The apparatus may also allocate one or more workloads of the plurality of workloads to one or more wave slots. Additionally, the apparatus may execute the one or more allocated workloads at the one or more wave slots, such that at least the first workload is executed at the first wave slot and the second workload is executed at the second wave slot. The apparatus may also allocate at least one other workload of the plurality of workloads to at least one previously-allocated wave slot of the one or more wave slots.

Abstract: Some aspects of this disclosure relate to apparatuses and methods for implementing techniques for a first wireless device to select a channel to a second wireless device among a set of channels to the second wireless device shared by a set of wireless devices of the wireless network, and further transmit data to the second wireless device over the selected channel. The first wireless device can perform a measurement to determine a channel occupancy during a measurement period for a channel, wherein the measurement period includes a plurality of periodic transmission durations. The first wireless device can select a channel that is less occupied indicated by the channel occupancy of the channel. The first wireless device can further transmit data to the second wireless device over the selected channel in a transmission period after the measurement period.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a redistribution layer, a semiconductor die, conducting connectors, dummy bumps and an underfill. The semiconductor die is disposed on a top surface of the redistribution layer and electrically connected with the redistribution layer. The conducting connectors are disposed between the semiconductor die and the redistribution layer, and are physically and electrically connected with the semiconductor die and the redistribution layer. The dummy bumps are disposed on the top surface of the redistribution layer, beside the conducting connectors and under the semiconductor die. The underfill is disposed between the semiconductor die and the redistribution layer and sandwiched between the dummy bumps and the semiconductor die. The dummy bumps are electrically floating. The dummy bumps are in contact with the underfill without contacting the semiconductor die.

Abstract: Predictive rendering (also referred to herein as speculative rendering) is disclosed. The predictive rendering is performed by an endpoint browser in response to a user input made by a user. The predictive rendering is verified using a surrogate browser that is executed on a remote server. The verification can be performed asynchronously.

Abstract: A syringe assembly (2) that locks a syringe (10) to prevent backflow of medicament, the syringe assembly (2) comprising a syringe (10) including a barrel (12) configured to carry the medicament, a plunger (14) that communicates with the barrel (12), and a plunger head (16) disposed on a proximal end of the plunger (14), and a locking assembly (50) disposed around the barrel (12), wherein the locking assembly (50) prevents the plunger (14) from moving away from the barrel (12) to draw the medicament into the barrel (12).

Abstract: The present disclosure provides a pixel driving circuit, a driving method thereof, and a display device. In the pixel driving circuit, a first terminal of a first storage sub-circuit is connected to a control terminal; a power control sub-circuit is connected to a light-emitting control signal line, a first power line and a first terminal of the driving sub-circuit; a compensation sub-circuit is connected to a first gate line, a control terminal and a first terminal of the driving sub-circuit; a data writing-in sub-circuit is connected to a second terminal of the first storage sub-circuit; a first reset sub-circuit is connected to a reset signal line, a first power line and the control terminal of the driving sub-circuit; a first control sub-circuit is connected to the first gate line, an initialization signal line and the second terminal of the driving sub-circuit.

Abstract: The present application relates to a touch display screen and a mobile terminal. The touch display screen comprises a flat display area, a curved display area and a circuit area which are connected in sequence; the curved display area is bent to be arc-shaped; and the circuit area is located below the flat display area, wherein the touch display screen further comprises a plurality of touch lines, and signal input ends of the plurality of touch lines are all located in the circuit area.

Abstract: Methods and systems for training and/or using a language selection model for use in determining a particular language of a spoken utterance captured in audio data. Features of the audio data can be processed using the trained language selection model to generate a predicted probability for each of N different languages, and a particular language selected based on the generated probabilities. Speech recognition results for the particular language can be utilized responsive to selecting the particular language of the spoken utterance. Many implementations are directed to training the language selection model utilizing tuple losses in lieu of traditional cross-entropy losses. Training the language selection model utilizing the tuple losses can result in more efficient training and/or can result in a more accurate and/or robust model—thereby mitigating erroneous language selections for spoken utterances.

Abstract: This disclosure provides an array substrate and a display device. In the array substrate, the pixel driving circuit includes a driving transistor, a first transistor and a second transistor. The driving transistor and the first transistor are P-type transistors, and the second transistor is N-type transistor. The array substrate also includes a base substrate, and a first conductive layer arranged at a side of the base substrate and including: a first conductive portion forming a gate electrode of the driving transistor; a first gate line at a side of the first conductive portion, a part of the first gate line being configured to form a gate electrode of the first transistor; and a second gate line at a side of the first gate line away from the first conductive portion, a part of the second gate line being configured to form a first gate electrode of the second transistor.

Abstract: A display substrate, a display panel, and a display device are provided. The display substrate includes: a base substrate; and a first transistor on the base substrate. The first transistor includes a first active layer, a first bottom gate electrode between the base substrate and the first active layer, and a first top gate electrode on a side of the first active layer away from the base substrate. A third gate insulating layer is provided between the first bottom gate electrode and the first active layer. The first active layer contains an oxide semiconductor material, and the third gate insulating layer contains a silicon oxide material. A surface of the first bottom gate electrode away from the base substrate is in direct contact with the silicon oxide material, and a surface of the first active layer close to the base substrate is in direct contact with the silicon oxide material.