Abstract: This present disclosure provides a bulk acoustic wave resonator and a bulk acoustic wave filter, and relates to the technical field of filters. A substrate and a piezoelectric stack structure arranged on the substrate are included. The piezoelectric stack structure includes a bottom electrode, a piezoelectric material layer and a top electrode which are sequentially stacked, and an outline of an orthographic projection of the top electrode on the substrate includes at least one Bezier curve of order greater than or equal to 2.

Abstract: A device including a stack of dies. Each of the dies can have unit stair-step conductive paths of connection features which include through-die via structures and routing structures. The unit stair-step conductive paths of one of the dies can be interconnected to another one of the unit stair-step conductive paths of another one of the dies to form one of a plurality conductive stair-case structures through two or more of the dies. The unit stair-step conductive paths can be connected to reduce signal cross talk between the conductive stair-case structures whereby at least some of the conductive stair-case structures are connected to transmit a same polarity of electrical signals are spatially separated in a dimension that is perpendicular to a major surface of the dies. A method of manufacturing the device is also disclosed.

Abstract: A device including a stack of dies. Each of the dies can have unit stair-step conductive paths of connection features which include through-die via structures and routing structures. The unit stair-step conductive paths of one of the dies can be interconnected to another one of the unit stair-step conductive paths of another one of the dies to form one of a plurality conductive stair-case structures through two or more of the dies. The unit stair-step conductive paths can be connected to reduce signal cross talk between the conductive stair-case structures whereby at least some of the conductive stair-case structures are connected to transmit a same polarity of electrical signals are spatially separated in a dimension that is perpendicular to a major surface of the dies. A method of manufacturing the device is also disclosed.

Abstract: Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).

Abstract: In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.

Abstract: Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).

Abstract: In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.

Abstract: The embodiments disclose a method and apparatus of selecting a path for transmission from paths between a first LER and a second LER in the MPLS network. The method may comprise: obtaining state information of the paths between the first LER and the second LER, the state information may indicate that a path is in up state or down state; obtaining stability information of at least one of the paths between the first LER and the second LER, the stability information may indicate that a path is stable or unstable; and selecting a path for transmission based on the state information and the stability information.

Abstract: An active component of an integrated voltage regulator (IVR) circuit is deployed within an IC device for regulating an operating voltage thereof. An interposer interconnects the IC device with a power source. A passive inductive component of the IVR circuit is deployed upon a surface of the IC device or the interposer. The inductive component has a magnetic core and a winding (e.g., wire-bond), wound about the magnetic core.

Abstract: The embodiments disclose a method and apparatus of selecting a path for transmission from paths between a first LER and a second LER in the MPLS network. The method may comprise: obtaining state information of the paths between the first LER and the second LER, the state information may indicate that a path is in up state or down state; obtaining stability information of at least one of the paths between the first LER and the second LER, the stability information may indicate that a path is stable or unstable; and selecting a path for transmission based on the state information and the stability information.

Abstract: A method for filtering a data signal includes transmitting the data signal from a transmitter to a receiver across a conductor disposed in an interposer, which interconnects the receiver and the transmitter. The data signal is low-passed with a filter, which includes a passive resistive element disposed within the interposer and coupled in series electrically with a passive inductive element. In relation thereto, the interposer is disposed in a position within the interposer, or upon a surface thereof. The filter is coupled to the conductor in a shunt configuration with respect to ground.

Abstract: Embodiments of the present invention provide a method and system for reducing congestion on a communication network. The communication network includes a network node having a first port and a second port. The network node is associated with forwarding data including first port forwarding data identifying at least one node accessible via the first port, and second port forwarding data identifying at least one node accessible via the second port. A failure associated with one of the first port and the second port is determined. The forwarding data corresponding to the other of the first port and the second port not associated with the failure, is updated with the one of the first port forwarding data and second port forwarding data corresponding to the one of the first port and the second port associated with the failure.

Abstract: The present disclosure relates to a network protection scheme. In one embodiment, there provides a method for network protection, including the steps of: detecting a switch indicator in a network; setting a rate limit of storm protection, which is of a first value, as a second value, the second value being higher than the first value; and performing a flush operation of a Forwarding DataBase FDB.

Abstract: A method for filtering a data signal includes transmitting the data signal from a transmitter to a receiver across a conductor disposed in an interposer, which interconnects the receiver and the transmitter. The data signal is low-passed with a filter, which includes a passive resistive element disposed within the interposer and coupled in series electrically with a passive inductive element. In relation thereto, the interposer is disposed in a position within the interposer, or upon a surface thereof. The filter is coupled to the conductor in a shunt configuration with respect to ground.

Abstract: An active component of an integrated voltage regulator (IVR) circuit is deployed within an IC device for regulating an operating voltage thereof. An interposer interconnects the IC device with a power source. A passive inductive component of the IVR circuit is deployed upon a surface of the IC device or the interposer. The inductive component has a magnetic core and a winding (e.g., wire-bond), wound about the magnetic core.

Abstract: The present disclosure relates to a network protection scheme. In one embodiment, there provides a method for network protection, including the steps of: detecting a switch indicator in a network; setting a rate limit of storm protection, which is of a first value, as a second value, the second value being higher than the first value; and performing a flush operation of a Forwarding DataBase FDB.

Abstract: A device and/or apparatus having plated through holes (PTHs) which are coated to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

Abstract: An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns.

Abstract: A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

Abstract: An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns.