Patents by Inventor Yasuhiko Ozawa
Yasuhiko Ozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8666165Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: GrantFiled: October 10, 2008Date of Patent: March 4, 2014Assignee: Hitachi, Ltd.Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Patent number: 8428336Abstract: A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.Type: GrantFiled: May 11, 2006Date of Patent: April 23, 2013Assignee: Hitachi, Ltd.Inventors: Yoko Ikeda, Junko Konishi, Hisafumi Iwata, Yuji Takagi, Kenji Obara, Ryo Nakagaki, Seiji Isogai, Yasuhiko Ozawa
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Patent number: 8263935Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.Type: GrantFiled: December 31, 2009Date of Patent: September 11, 2012Assignee: Hitachi High-Technologies CorporationInventors: Atsushi Takane, Mitsuji Ikeda, Satoru Yamaguchi, Yasuhiko Ozawa
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Patent number: 8188429Abstract: Disclosed herein is a scanning electron microscope capable of determining quality of a semiconductor pattern, deformation of contact-holes, and inclination of the sidewall of the contact-holes, respectively. To that end, the scanning electron microscope includes image pickup means for picking up images of a circuit pattern formed on a semiconductor wafer on a preset condition, calculation means for comparing each of the images picked up by the image pickup means with a prestored reference image to thereby calculate a feature of the images picked up, and a computer for executing evaluation on quality of the circuit pattern on the basis of the feature calculated by the calculation means, and calculation of the feature is executed independently with reference to a secondary electron image, and each of back-scattering electron images.Type: GrantFiled: August 1, 2008Date of Patent: May 29, 2012Assignee: Hitachi High-Technologies CorporationInventor: Yasuhiko Ozawa
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Publication number: 20100102224Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.Type: ApplicationFiled: December 31, 2009Publication date: April 29, 2010Applicant: Hitachi High-Technologies CorporationInventors: Atsushi TAKANE, Mitsuji Ikeda, Satoru Yamaguchi, Yasuhiko Ozawa
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Patent number: 7652249Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.Type: GrantFiled: January 29, 2007Date of Patent: January 26, 2010Assignee: Hitachi High-Technologies CorporationInventors: Atsushi Takane, Mitsuji Ikeda, Satoru Yamaguchi, Yasuhiko Ozawa
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Publication number: 20100006755Abstract: An object of the present invention is to provide a charged particle beam apparatus and an alignment method of the charged particle beam apparatus, which make it possible to align an optical axis of a charged particle beam easily even when a state of the charged particle beam changes. The present invention comprises calculation means for calculating a deflection amount of an alignment deflector which performs an axis alignment for an objective lens, a plurality of calculation methods for calculating the deflection amount is memorized in the calculation means, and a selection means for selecting at least one of the calculation methods is provided.Type: ApplicationFiled: September 22, 2009Publication date: January 14, 2010Inventors: Mitsugo Sato, Tadashi Otaka, Makoto Ezumi, Atsushi Takane, Shoji Yoshida, Satoru Yamaguchi, Yasuhiko Ozawa
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Patent number: 7605381Abstract: An object of the present invention is to provide a charged particle beam apparatus and an alignment method of the charged particle beam apparatus, which make it possible to align an optical axis of a charged particle beam easily even when a state of the charged particle beam changes. The present invention comprises calculation means for calculating a deflection amount of an alignment deflector which performs an axis alignment for an objective lens, a plurality of calculation methods for calculating the deflection amount is memorized in the calculation means, and a selection means for selecting at least one of the calculation methods is provided.Type: GrantFiled: December 15, 2003Date of Patent: October 20, 2009Assignee: Hitachi, Ltd.Inventors: Mitsugu Sato, Tadashi Otaka, Makoto Ezumi, Atsushi Takane, Shoji Yoshida, Satoru Yamaguchi, Yasuhiko Ozawa
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Publication number: 20090041333Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: ApplicationFiled: October 10, 2008Publication date: February 12, 2009Inventors: Satoru YAMAGUCHI, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Publication number: 20090032710Abstract: Disclosed herein is a scanning electron microscope capable of determining quality of a semiconductor pattern, deformation of contact-holes, and inclination of the sidewall of the contact-holes, respectively. To that end, the scanning electron microscope includes image pickup means for picking up images of a circuit pattern formed on a semiconductor wafer on a preset condition, calculation means for comparing each of the images picked up by the image pickup means with a prestored reference image to thereby calculate a feature of the images picked up, and a computer for executing evaluation on quality of the circuit pattern on the basis of the feature calculated by the calculation means, and calculation of the feature is executed independently with reference to a secondary electron image, and each of back-scattering electron images.Type: ApplicationFiled: August 1, 2008Publication date: February 5, 2009Inventor: Yasuhiko OZAWA
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Patent number: 7439505Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: GrantFiled: December 2, 2005Date of Patent: October 21, 2008Assignee: Hitachi, Ltd.Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Patent number: 7356177Abstract: According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object.Type: GrantFiled: August 17, 2006Date of Patent: April 8, 2008Assignee: Hitachi, Ltd.Inventors: Kenji Obara, Yuji Takagi, Ryo Nakagaki, Yasuhiko Ozawa, Toshiei Kurosaki, Seiji Isogai
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Patent number: 7352890Abstract: A system for analyzing defects in electronic circuit patterns, including: comparing position information of structural defects with position information of electrical faults and extracting corroborated defects having common position information between the structural defects and electrical faults; classifying images of extracted corroborated defects into critical defect images and non-critical defect images based on a pre-stored classification rule which defines critical and non-critical defects by referring to images of defects, position information of defects, and results of performing an electronic test; modifying the pre-stored classification rule by correcting classification of classified defect images displayed on the screen; and repeating the operations for each subsequent object, wherein for each present object under inspection, using a modified pre-stored classification rule with respect to a previous object, as the pre-stored classification rule for the operations with respect to the present object.Type: GrantFiled: February 17, 2006Date of Patent: April 1, 2008Assignee: Hitachi, Ltd.Inventors: Atsushi Shimoda, Ichirou Ishimaru, Yuji Takagi, Takuo Tamura, Yuichi Hamamura, Kenji Watanabe, Yasuhiko Ozawa, Seiji Isogai
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Publication number: 20080073526Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.Type: ApplicationFiled: January 29, 2007Publication date: March 27, 2008Inventors: Atsushi Takane, Mitsuji Ikeda, Satoru Yamaguchi, Yasuhiko Ozawa
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Publication number: 20070194236Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.Type: ApplicationFiled: April 24, 2007Publication date: August 23, 2007Inventors: Atsushi Takane, Haruo Yoda, Shoji Yoshida, Mitsuji Ikeda, Yasuhiko Ozawa
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Patent number: 7235782Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.Type: GrantFiled: February 26, 2002Date of Patent: June 26, 2007Assignee: Hitachi, Ltd.Inventors: Atsushi Takane, Haruo Yoda, Shoji Yoshida, Mitsuji Ikeda, Yasuhiko Ozawa
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Patent number: 7181060Abstract: An image picked up by a detection system capable of actualizing a three-dimensional inclination is usually poor in the signal-to-noise ratio, and it is difficult to stably detect minute defects. Images that actualize a three-dimensional inclination are picked up from opposed directions. The images are subject to subtraction and addition. The images improved in signal-to-noise ratio as compared with original images are calculated. The images calculated and improved in signal-to-noise ratio respectively of a defect portion and a reference portion are compared with each other. Regions differing in comparison results are detected as defects. As a result, minute defects can be inspected stably.Type: GrantFiled: February 20, 2002Date of Patent: February 20, 2007Assignee: Hitachi, Ltd.Inventors: Toshifumi Honda, Hirohito Okuda, Yasuhiko Ozawa, Katsuhiro Kitahashi
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Patent number: 7166840Abstract: A method for determining a depression/protrusion, especially of a line and space pattern formed on a sample, and an apparatus therefor. A charged particle beam is scanned with its direction being inclined to the original optical axis of the charged particle beam or a sample stage is inclined, broadening of a detected signal in a line scanning direction of the charged particle beam is measured, the broadening is compared with that when the charged particle beam is scanned with its direction being parallel to the original optical axis of the charged particle beam, and a depression/protrusion of the scanned portion is determined on the basis of increase/decrease of the broadening.Type: GrantFiled: February 14, 2005Date of Patent: January 23, 2007Assignee: Hitachi, Ltd.Inventors: Atsushi Takane, Satoru Yamaguchi, Osamu Komuro, Yasuhiko Ozawa, Hideo Todokoro
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Publication number: 20060274932Abstract: A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.Type: ApplicationFiled: May 11, 2006Publication date: December 7, 2006Inventors: Yoko Ikeda, Junko Konishi, Hisafumi Iwata, Yuji Takagi, Kenji Obara, Ryo Nakagaki, Seiji Isogai, Yasuhiko Ozawa
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Publication number: 20060140472Abstract: A system for analyzing defects in electronic circuit patterns, including: comparing position information of structural defects with position information of electrical faults and extracting corroborated defects having common position information between the structural defects and electrical faults; classifying images of extracted corroborated defects into critical defect images and non-critical defect images based on a pre-stored classification rule which defines critical and non-critical defects by referring to images of defects, position information of defects, and results of performing an electronic test; modifying the pre-stored classification rule by correcting classification of classified defect images displayed on the screen; and repeating the operations for each subsequent object, wherein for each present object under inspection, using a modified pre-stored classification rule with respect to a previous object, as the pre-stored classification rule for the operations with respect to the present object.Type: ApplicationFiled: February 17, 2006Publication date: June 29, 2006Inventors: Atsushi Shimoda, Ichirou Ishimaru, Yuji Takagi, Takuo Tamura, Yuichi Hamamura, Kenji Watanabe, Yasuhiko Ozawa, Seiji Isogai