Patents by Inventor Yasuhiko Ozawa
Yasuhiko Ozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7068834Abstract: The present invention has an analyzing unit including an image detection device for producing a plurality of images of a workpiece, a storage for storing detected images produced by the image detection device, and a display having a screen with a first area for displaying a plurality of detected images stored in the storage and a plurality of second areas for classifying the detected images according to features of the detected images, whereby the plurality of detected images are moved on the screen from the first area to selected second areas to classify the plurality of detected images in the second areas.Type: GrantFiled: December 1, 1999Date of Patent: June 27, 2006Assignee: Hitachi, Ltd.Inventors: Yoko Ikeda, Junko Konishi, Hisafumi Iwata, Yuji Takagi, Kenji Obara, Ryo Nakagaki, Seiji Isogai, Yasuhiko Ozawa
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Patent number: 7062081Abstract: In order to allow critical flaws in an inspected item to be determined early during a production process, the present invention includes the following steps: a step of detecting defects in a production process for the inspected item and storing defect positions; a step of collecting detailed defect information and storing the detailed information in association with defect positions; a step of storing positions at which flaws were generated based on a final inspection of the inspected item; a step of comparing defect positions with positions at which flaws were generated; and a step of classifying and displaying detailed information based on the comparison results.Type: GrantFiled: February 15, 2001Date of Patent: June 13, 2006Assignee: Hitachi, Ltd.Inventors: Atsushi Shimoda, Ichirou Ishimaru, Yuji Takagi, Takuo Tamura, Yuichi Hamamura, Kenji Watanabe, Yasuhiko Ozawa, Seiji Isogai
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Publication number: 20060097158Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: ApplicationFiled: December 2, 2005Publication date: May 11, 2006Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Patent number: 7026615Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.Type: GrantFiled: February 13, 2003Date of Patent: April 11, 2006Assignee: Hitachi, Ltd.Inventors: Atsushi Takane, Haruo Yoda, Shoji Yoshida, Mitsuji Ikeda, Yasuhiko Ozawa
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Patent number: 7002151Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: GrantFiled: September 3, 2004Date of Patent: February 21, 2006Assignee: Hitachi, Ltd.Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Publication number: 20050151078Abstract: A method for determining a depression/protrusion, especially of a line and space pattern formed on a sample, and an apparatus therefor. A charged particle beam is scanned with its direction being inclined to the original optical axis of the charged particle beam or a sample stage is inclined, broadening of a detected signal in a line scanning direction of the charged particle beam is measured, the broadening is compared with that when the charged particle beam is scanned with its direction being parallel to the original optical axis of the charged particle beam, and a depression/protrusion of the scanned portion is determined on the basis of increase/decrease of the broadening.Type: ApplicationFiled: February 14, 2005Publication date: July 14, 2005Inventors: Atsushi Takane, Satoru Yamaguchi, Osamu Komuro, Yasuhiko Ozawa, Hideo Todokoro
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Publication number: 20050109937Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: ApplicationFiled: September 3, 2004Publication date: May 26, 2005Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Patent number: 6872943Abstract: A method for determining a depression/protrusion, especially of a line and space pattern formed on a sample, and an apparatus therefor. A charged particle beam is scanned with its direction being inclined to the original optical axis of the charged particle beam or a sample stage is inclined, broadening of a detected signal in a line scanning direction of the charged particle beam is measured, the broadening is compared with that when the charged particle beam is scanned with its direction being parallel to the original optical axis of the charged particle beam, and a depression/protrusion of the scanned portion is determined on the basis of increase/decrease of the broadening.Type: GrantFiled: July 11, 2002Date of Patent: March 29, 2005Assignee: Hitachi, Ltd.Inventors: Atsushi Takane, Satoru Yamaguchi, Osamu Komuro, Yasuhiko Ozawa, Hideo Todokoro
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Patent number: 6864493Abstract: An object of the present invention is to provide a charged particle beam apparatus and an alignment method of the charged particle beam apparatus, which make it possible to align an optical axis of a charged particle beam easily even when a state of the charged particle beam changes. The present invention comprises calculation means for calculating a deflection amount of an alignment deflector which performs an axis alignment for an objective lens, a plurality of calculation methods for calculating the deflection amount is memorized in the calculation means, and a selection means for selecting at least one of the calculation methods is provided.Type: GrantFiled: February 26, 2002Date of Patent: March 8, 2005Assignee: Hitachi, Ltd.Inventors: Mitsugu Sato, Tadashi Otaka, Makoto Ezumi, Atsushi Takane, Shoji Yoshida, Satoru Yamaguchi, Yasuhiko Ozawa
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Patent number: 6803573Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: GrantFiled: July 10, 2003Date of Patent: October 12, 2004Assignee: Hitachi, Ltd.Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Publication number: 20040124364Abstract: An object of the present invention is to provide a charged particle beam apparatus and an alignment method of the charged particle beam apparatus, which make it possible to align an optical axis of a charged particle beam easily even when a state of the charged particle beam changes. The present invention comprises calculation means for calculating a deflection amount of an alignment deflector which performs an axis alignment for an objective lens, a plurality of calculation methods for calculating the deflection amount is memorized in the calculation means, and a selection means for selecting at least one of the calculation methods is provided.Type: ApplicationFiled: December 15, 2003Publication date: July 1, 2004Inventors: Mitsugu Sato, Tadashi Otaka, Makoto Ezumi, Atsushi Takane, Shoji Yoshida, Satoru Yamaguchi, Yasuhiko Ozawa
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Patent number: 6756589Abstract: During closer inspection with a local defect area being magnified, it is desirable to reduce image acquisition time by making the number of stage moves as few as possible so that a defect can be observed efficiently.Type: GrantFiled: January 9, 2001Date of Patent: June 29, 2004Assignee: Hitachi, Ltd.Inventors: Kenji Obara, Yuji Takagi, Atsushi Shimoda, Ryou Nakagaki, Seiji Isogai, Yasuhiko Ozawa, Hideka Banba, Kenji Watanabe, Chie Shishido
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Publication number: 20040016882Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a finction for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: ApplicationFiled: July 10, 2003Publication date: January 29, 2004Applicant: Hitachi, Ltd,Inventors: Satoru Yamaguchi, Takashi Ilzumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Patent number: 6627888Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.Type: GrantFiled: February 23, 2001Date of Patent: September 30, 2003Assignee: Hitachi, Ltd.Inventors: Satoru Yamaguchi, Takashi Iizumi, Osamu Komuro, Hidetoshi Morokuma, Tatsuya Maeda, Juntaro Arima, Yasuhiko Ozawa
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Publication number: 20030173516Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.Type: ApplicationFiled: February 13, 2003Publication date: September 18, 2003Inventors: Atsushi Takane, Haruo Yoda, Shoji Yoshida, Mitsuji Ikeda, Yasuhiko Ozawa
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Patent number: 6553323Abstract: The present invention improves inspection efficiency in detailed inspections of defects performed based on inspection information from a defect inspection. Particles and defects are detected by a defect inspection device 1. If the cause of the particles and defects are to be determined by performing a detailed inspection with a details inspection device 3 using an SEM or the like, attributes are determined on the particles and defects detected by the defects inspection device 1 before the detailed inspection is performed. The attributes are determined with an attribute inspection device using an optical microscope or the like. Based on these attributes, the defects and particles are separated into those that require detailed inspection and those that do not require detailed inspection or that cannot be inspected in detail. A details inspection device 3 is used to inspect the particles and defects requiring detailed inspection.Type: GrantFiled: September 13, 2000Date of Patent: April 22, 2003Assignee: Hitachi, Ltd.Inventors: Kenji Obara, Yuji Takagi, Toshifumi Honda, Ryo Nakagaki, Toshiei Kurosaki, Yasuhiko Ozawa
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Publication number: 20030015659Abstract: An image picked up by a detection system capable of actualizing a three-dimensional inclination is usually poor in the signal-to-noise ratio, and it is difficult to stably detect minute defects. Images that actualize a three-dimensional inclination are picked up from opposed directions. The images are subject to subtraction and addition. The images improved in signal-to-noise ratio as compared with original images are calculated. The images calculated and improved in signal-to-noise ratio respectively of a defect portion and a reference portion are compared with each other. Regions differing in comparison results are detected as defects. As a result, minute defects can be inspected stably.Type: ApplicationFiled: February 20, 2002Publication date: January 23, 2003Applicant: Hitachi, Ltd.Inventors: Toshifumi Honda, Hirohito Okuda, Yasuhiko Ozawa, Katsuhiro Kitahashi
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Publication number: 20030010914Abstract: A method for determining a depression/protrusion, especially of a line and space pattern formed on a sample, and an apparatus therefor. A charged particle beam is scanned with its direction being inclined to the original optical axis of the charged particle beam or a sample stage is inclined, broadening of a detected signal in a line scanning direction of the charged particle beam is measured, the broadening is compared with that when the charged particle beam is scanned with its direction being parallel to the original optical axis of the charged particle beam, and a depression/protrusion of the scanned portion is determined on the basis of increase/decrease of the broadening.Type: ApplicationFiled: July 11, 2002Publication date: January 16, 2003Inventors: Atsushi Takane, Satoru Yamaguchi, Osamu Komuro, Yasuhiko Ozawa, Hideo Todokoro
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Publication number: 20020179851Abstract: An object of the present invention is to provide a charged particle beam apparatus and an alignment method of the charged particle beam apparatus, which make it possible to align an optical axis of a charged particle beam easily even when a state of the charged particle beam changes. The present invention comprises calculation means for calculating a deflection amount of an alignment deflector which performs an axis alignment for an objective lens, a plurality of calculation methods for calculating the deflection amount is memorized in the calculation means, and a selection means for selecting at least one of the calculation methods is provided.Type: ApplicationFiled: February 26, 2002Publication date: December 5, 2002Inventors: Mitsugu Sato, Tadashi Otaka, Makoto Ezumi, Atsushi Takane, Shoji Yoshida, Satoru Yamaguchi, Yasuhiko Ozawa
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Patent number: 6476388Abstract: The invention is a scanning electron microscope including a switching control unit for controlling to switch at least scanning unit to switch a digital image signal of a low magnification based on a wide image taking field of view to and from a digital image signal of a high magnification based on a narrow image taking field of view from an A/D conversion unit and a beam spot diameter control unit for controlling to switch a spot diameter of electron beam on a surface of an object substrate in controlling to switch the signals by the switching control unit and a defect portion analyzing method using the scanning electron microscope.Type: GrantFiled: October 19, 1999Date of Patent: November 5, 2002Assignee: Hitachi, Ltd.Inventors: Ryo Nakagaki, Yuji Takagi, Atsushi Shimoda, Kenji Obara, Yasuhiko Ozawa, Hideka Bamba, Seiji Isogai, Kenji Watanabe, Chie Shishido, Toshiei Kurosaki