Patents by Inventor Yasuhiro Kataoka

Yasuhiro Kataoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6404098
    Abstract: Disclosed herein is a drive unit using a shape memory alloy including: a shape memory alloy member made from a shape memory alloy, the shape memory alloy member exhibiting superelasticity when being energized; a drive body connected to the shape memory alloy member, the drive body being moved from a stopping position to a specific operational position when the shape memory alloy member is energized; and a locking mechanism for retaining the drive body at the specific operational position. With this configuration, the drive unit using a shape memory alloy is capable of reducing the power consumption as well as miniaturizing the drive unit.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: June 11, 2002
    Assignee: Sony Corporation
    Inventors: Shun Kayama, Yasuhiro Kataoka
  • Patent number: 6307465
    Abstract: The invention provides a thin and small input device that improves a tactile operation sensation and a luxurious appearance. An input device to which an operator enters a desired command by operating it with a finger and which has a case, switch contacts disposed in the case, rotatable operation members disposed rotatably corresponding to the switch contacts that are partially projected from the holes of the case and pressed by an operator, and support members 44 for supporting the rotatable operation members by pressing it onto the case side and for operating the switch contacts when an operator presses the rotatable operation member against the pressing force.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: October 23, 2001
    Assignee: Sony Corporation
    Inventors: Shun Kayama, Yasuhiro Kataoka, Kenji Munekata
  • Patent number: 6162580
    Abstract: The present invention provides photosensitive compositions which comprise polyimide precursors having a chemical structure selected from several specific chemical structures and/or specific amide bond density and are adjusted so that the film obtained by applying and drying the composition may exhibit a specific absorbance to light. The polyimide film obtained by heat-curing the above photosensitive composition exhibits excellent physical properties and water resistance, and has high adhesive strength to epoxy resins, inorganic materials and metals.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: December 19, 2000
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Yoshio Matsuoka, Kanichi Yokota, Yasuhiro Kataoka
  • Patent number: 6019613
    Abstract: A compact electrical connector having a reduced packaging or mounting area includes a housing in which a receptor cavity for receiving a counterpart connector is concavely formed, and contacts fixed in the housing. Each contact includes a contact body that extends in the plug-in direction in which the counterpart connector is received or plugged into the receptor cavity of the housing, and a contact leg that extends outwardly on the base side of the housing. The housing is provided with a slit or slits through side walls thereof to expose the contact bodies to the outside. Thereby the contacts are deflectable. The slits also partially or entirely separate upper and lower portions of the housing from each other, so that the upper housing portion may easily be deflected laterally or rotationally relative to the lower housing portion. Thereby a misalignment-compensating function is achieved.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: February 1, 2000
    Assignees: Sony Corporation, Japan Solderless Terminal MFG. Co.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D402273
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: December 8, 1998
    Assignees: Sony Corporation, Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D402274
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: December 8, 1998
    Assignees: Sony Corporation, Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D407383
    Type: Grant
    Filed: July 9, 1998
    Date of Patent: March 30, 1999
    Assignees: Sony Corporation, Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D411512
    Type: Grant
    Filed: July 9, 1998
    Date of Patent: June 29, 1999
    Assignees: Sony Corporation, Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto