Abstract: A vehicle lower structure includes: first and second battery units that are arranged under a floor panel and on both sides in a vehicle width direction of a propeller shaft; right and left floor frames disposed on a lower surface side of the floor panel. The floor frame has a front inclined section and a width increased section. The first and second battery units are arranged between the width increased sections 52 of the right and left floor frames. A battery-related electrical component, a width of each of which in the vehicle width direction is less than a width of each of the first and second battery units, is arranged between the front inclined sections.

Abstract: A vehicle lower structure includes a battery pack arranged under a floor panel and having: first and second battery units that are separately arranged from each other on both sides in the vehicle width direction of the propeller shaft; and a battery cover. The battery cover has a first battery accommodation section, a second battery accommodation section, and a coupling section that couples the first and second battery accommodation section and extends in the vehicle width direction. The coupling section includes a fragile section between the first and second battery accommodation sections in the vehicle width direction.

Abstract: A vehicle lower structure includes: a battery pack having first and second battery units and a battery cover; and a fuel tank that is arranged on a vehicle rear side to be higher than the first and second battery units. At positions under a floor panel, the first and second battery units are arranged on both sides in a vehicle width direction of a propeller shaft. The battery cover has a coupling section that couples first and second battery accommodation sections. The coupling section couples the first and second battery accommodation sections such that a vehicle rear side thereof is higher than the first and second battery accommodation sections, extends in the vehicle width direction at a position above the propeller shaft, and is arranged next to a vehicle front side of the fuel tank.

Abstract: A vehicle lower structure includes: first and second battery units that are arranged under a floor panel and on both sides in a vehicle width direction of a propeller shaft; right and left floor frames disposed on a lower surface side of the floor panel. The floor frame has a front inclined section and a width increased section. The first and second battery units are arranged between the width increased sections 52 of the right and left floor frames. A battery-related electrical component, a width of each of which in the vehicle width direction is less than a width of each of the first and second battery units, is arranged between the front inclined sections.

Abstract: A vehicle lower structure includes a battery pack arranged under a floor panel and having: first and second battery units that are separately arranged from each other on both sides in the vehicle width direction of the propeller shaft; and a battery cover. The battery cover has a first battery accommodation section, a second battery accommodation section, and a coupling section that couples the first and second battery accommodation section and extends in the vehicle width direction. The coupling section includes a fragile section between the first and second battery accommodation sections in the vehicle width direction.

Abstract: A vehicle lower structure includes: a battery pack having first and second battery units and a battery cover; and a fuel tank that is arranged on a vehicle rear side to be higher than the first and second battery units. At positions under a floor panel, the first and second battery units are arranged on both sides in a vehicle width direction of a propeller shaft. The battery cover has a coupling section that couples first and second battery accommodation sections. The coupling section couples the first and second battery accommodation sections such that a vehicle rear side thereof is higher than the first and second battery accommodation sections, extends in the vehicle width direction at a position above the propeller shaft, and is arranged next to a vehicle front side of the fuel tank.

Abstract: An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal; a bus bar 40 which connects the external terminal of one of two adjacent cells 30 and that of the other thereof; an electrically-conductive connecting member 70 which connects the external terminal and the bus bar 40 by welding to the external terminal and the bus bar 40; a welding portion 80 welded to the bus bar 40 and the connecting member 70; and a welding portion 82 welded to the external terminal and the connecting member 70. The connecting member 70 comprises an intervening portion 70b connected to the welding portion 80, and a main body portion 70a extending from the intervening portion 70b to the welding portion 82. The intervening portion 70b has a thickness that is smaller than that of the main body portion 70a.

Abstract: This semiconductor device (100A) includes: a transparent conductive layer (3); an insulating layer (5) which is formed to cover the transparent conductive layer (3) and which has a hole (5u) that overlaps at least partially with the transparent conductive layer (3); a metal layer (7d) formed on the insulating layer (5) and inside the hole (5u); and a contact portion (90) connecting the transparent conductive layer (3) and the metal layer (7d) together. In the contact portion (90), a refractory metal nitride layer (20) is arranged between the transparent conductive layer (3) and a portion of the metal layer (7d) which is located inside the hole (5u). The refractory metal nitride layer (20) is in contact with the upper surface of the transparent conductive layer (3).

Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device.

Abstract: A touch panel includes: a substrate; first electrodes; a first light-shielding layer element; second electrodes; second light-shielding layer elements; first relay electrodes; and metal lines. The substrate includes a touch surface. The first light-shielding layer element is provided on the substrate and located outside the first electrodes measured in a predetermined direction. The second electrodes are provided on the substrate, each second electrode located between two first electrodes arranged in the predetermined direction. Each of the second light-shielding layer elements is provided between two first electrodes and covers one of the second electrodes. Each of the first relay electrodes is provided above one of the second light-shielding layer elements and electrically connects two first electrodes. The metal lines are provided on the first light-shielding layer element and connected to external circuitry.

Abstract: This semiconductor device (100A) includes: a transparent conductive layer (3); an insulating layer (5) which is formed to cover the transparent conductive layer (3) and which has a hole (5u) that overlaps at least partially with the transparent conductive layer (3); a metal layer (7d) formed on the insulating layer (5) and inside the hole (5u); and a contact portion (90) connecting the transparent conductive layer (3) and the metal layer (7d) together. In the contact portion (90), a refractory metal nitride layer (20) is arranged between the transparent conductive layer (3) and a portion of the metal layer (7d) which is located inside the hole (5u). The refractory metal nitride layer (20) is in contact with the upper surface of the transparent conductive layer (3).

Abstract: A liquid crystal display element disclosed includes: a first substrate; a second substrate; a liquid crystal layer sandwiched between the first substrate and the second substrate; a first transparent electrode provided at a display region of the first substrate; and a second transparent electrode provided at a display region of the second substrate, at least one of d1 and d2 being not larger than 60 nm, where d1 represents a thickness of the first transparent electrode and d2 represents a thickness of the second transparent electrode.

Abstract: This array substrate is provided with: a plurality of switching elements which are provided on a substrate; a plurality of source lines which are provided so as to extend parallel to each other and are connected to the source electrodes of the switching elements; a first interlayer insulating film which covers the source lines; a transparent electrode which is provided on the first interlayer insulating film; a second interlayer insulating film which covers the transparent electrode; and a plurality of pixel electrodes which are provided on the second interlayer insulating film so as to overlap the transparent electrode and constitute auxiliary capacitors, and which are connected to drain electrodes of the switching elements. The transparent electrode is provided with incisions at positions overlapping the source lines.

Abstract: Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.

Abstract: Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

Abstract: The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200° C. to 300° C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

Abstract: Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.

Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device.

Abstract: An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal; a bus bar 40 which connects the external terminal of one of two adjacent cells 30 and that of the other thereof; an electrically-conductive connecting member 70 which connects the external terminal and the bus bar 40 by welding to the external terminal and the bus bar 40; a welding portion 80 welded to the bus bar 40 and the connecting member 70; and a welding portion 82 welded to the external terminal and the connecting member 70. The connecting member 70 comprises an intervening portion 70b connected to the welding portion 80, and a main body portion 70a extending from the intervening portion 70b to the welding portion 82. The intervening portion 70b has a thickness that is smaller than that of the main body portion 70a.

Abstract: A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.