Patents by Inventor Yasuhiro Kohara

Yasuhiro Kohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130344378
    Abstract: An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal 60; a bus bar 40 configured to connect the external terminal of one of two adjacent cells 30 to the external terminal of the other of these two adjacent cells 30; a connecting member 70 welded to the external terminal and the bus bar 40 so as to electrically connect the external terminal and the bus bar 40; a welding portion 80 at which the external terminal and the connecting member 70 are welded; and a welding portion 82 at which the bus bar 40 and the connecting member 70 are welded. The external terminal has a region that is at a distance from an outer package as compared with a portion of the connecting member 70 that is adjacent to the welding portion 80.
    Type: Application
    Filed: February 3, 2012
    Publication date: December 26, 2013
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Yasuhiro Kohara, Mayumi Nakasato, Fusanori Watanabe, Yasuhiro Asai, Takashi Seto, Daiki Uchiyama
  • Publication number: 20130215371
    Abstract: A liquid crystal display element disclosed includes: a first substrate; a second substrate; a liquid crystal layer sandwiched between the first substrate and the second substrate; a first transparent electrode provided at a display region of the first substrate; and a second transparent electrode provided at a display region of the second substrate, at least one of d1 and d2 being not larger than 60 nm, where d1 represents a thickness of the first transparent electrode and d2 represents a thickness of the second transparent electrode.
    Type: Application
    Filed: November 24, 2011
    Publication date: August 22, 2013
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Hijiri Nakahara, Yasuhiro Kohara, Mitsunori Harada, Kohji Wakashiro, Sadao Matsushita
  • Publication number: 20130208218
    Abstract: On a color filter substrate (color filter) that displays a plurality of colors that are different from each other, a base material, first and second color filter layers that are formed on the base material and respectively colored yellow and magenta, a first overcoat layer that functions as a color filter layer colored red, and a second overcoat layer that is provided so as to cover the first and second color filter layers and colored cyan are provided.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 15, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yasuhiro Kohara, Akira Nakagawa, Hidekazu Ohshima, Tohru Sakata
  • Publication number: 20130176260
    Abstract: An objective of the present invention is to provide a touch panel mother substrate that has a novel structure and facilities the cutting of a touch panel, and a touch panel that has been cut from the touch panel mother substrate. A plurality of touch panel units (50) that are to be touch panels (10) after being cut is formed on a touch panel mother substrate (48). The touch panel mother substrate (48) includes an organic resin film (46) that is deposited on the front side of the touch panel mother substrate (48), and a cutting groove (52) that opens at the surface of the organic resin film (46) and extends in a predetermined direction. The materials of a bottom surface (54) of the cutting groove (52) and a back surface (58) of the touch panel mother substrate (46) have the same main ingredient.
    Type: Application
    Filed: September 29, 2011
    Publication date: July 11, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Hijiri Nakahara, Yasuhiro Kohara
  • Publication number: 20130176282
    Abstract: Provided are a touch panel having a novel structure that is capable of allowing lines through which electric signals contributing to the detection of a touched position to have a lower sheet resistance and that is capable of suppressing corrosion of the lines; and a display device provided with the touch panel. A touch panel includes: a substrate (18); lines (36a to 36g) formed on the substrate (18) so that electric signals that contribute to detection of a touched position flow through the lines; terminal portions (42a to 42g) formed with respect to the lines (36a to 36g) so that the terminal portions are connected to an outer circuit; and covering films (20, 48a to 48g) that cover the terminal portions (42a to 42g), wherein the lines (36a to 36g) and the terminal portions (42a to 42g) are formed with metal films, and at least a part of the covering films (20, 48a to 48g) are conductive films (48a to 48g) that have higher corrosion resistance than the terminal portions (42a to 42g).
    Type: Application
    Filed: September 29, 2011
    Publication date: July 11, 2013
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Hijiri Nakahara, Yasuhiro Kohara
  • Publication number: 20130168147
    Abstract: Provided is an electronic device having a novel structure that makes it possible to simplify a structure needed for countermeasure against static electricity, while avoiding adverse effect to the function of the electronic device.
    Type: Application
    Filed: September 29, 2011
    Publication date: July 4, 2013
    Inventors: Yasuhiro Kohara, Hijiri Nakahara
  • Publication number: 20120327020
    Abstract: A touch panel-equipped display device (1) includes: a TFT substrate (2); a CF substrate (3) facing the TFT substrate (2); a liquid crystal layer (4) provided between the TFT substrate (2) and the CF substrate (3); a touch panel conductive film (6) provided on a surface (3a) of the CF substrate (3) opposite the liquid crystal layer (4); and a display region (D) including a transmissive region (Db) through which light (L) passes, and a non-transmissive region (Da) through which the light does not pass. The conductive film (6) includes a wire (6a), and an opening (6b) surrounded by the wire (6a) is formed in the conductive film (6). The wire (6a) is arranged in the non-transmissive region (Da), and the opening (6b) is formed in the transmissive region (Db).
    Type: Application
    Filed: March 1, 2011
    Publication date: December 27, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yasuhiro Kohara, Akira Nakagawa, Hidekazu Ohshima, Tohru Sakata
  • Patent number: 8310628
    Abstract: The present invention provides a production method of a color filter substrate that can efficiently produce a color filter substrate including a multi-layer spacer. The production method of the color filter of the present invention is a production method of a color filter substrate including a colored layer, an electrode, a light-shielding layer, and a multi-layer spacer on a substrate, the production method including the steps of: forming the colored layer and a base colored layer of the multi-layer spacer, forming the electrode, and forming the light-shielding layer and a top layer of the multi-layer spacer.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: November 13, 2012
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Tohru Sakata, Yasuhiro Kohara, Masaharu Akitomo
  • Patent number: 8258409
    Abstract: Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: September 4, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Yasuhiro Kohara, Kiyoshi Shibata, Masayuki Nagamatsu, Ryosuke Usui, Toshiya Shimizu
  • Publication number: 20120098137
    Abstract: Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.
    Type: Application
    Filed: June 30, 2010
    Publication date: April 26, 2012
    Inventors: Ryosuke Usui, Yusuke Igarashi, Yasunori Inoue, Mayumi Nakasato, Masayuki Nagamatsu, Yasuhiro Kohara
  • Publication number: 20120086901
    Abstract: A liquid crystal display device includes a plurality of columnar spacers configured to maintain a constant gap between substrates on a color filter substrate of the liquid crystal display device. At a tip end of each of the columnar spacers contacting an array substrate, a height adjusting portion which is easily deformed as compared to a portion of the columnar spacer other than the tip end portion when the pair of substrates are bonded together is provided.
    Type: Application
    Filed: January 25, 2010
    Publication date: April 12, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Akira Nakagawa, Yasuhiro Kohara
  • Patent number: 8115316
    Abstract: A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: February 14, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Yasuhiro Kohara, Ryosuke Usui, Takeshi Nakamura, Yusuke Igarashi
  • Patent number: 8093699
    Abstract: A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: January 10, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Yasuhiro Kohara, Ryosuke Usui, Hideki Mizuhara, Yasunori Inoue
  • Publication number: 20110080543
    Abstract: The present invention provides a color filter substrate and a liquid crystal display device that allow suppressing the occurrence of liquid crystal alignment disorder in the vicinity of stack spacers without increasing the number of processes, even in a case where a colored layer is used as a base of the stack spacers.
    Type: Application
    Filed: April 9, 2009
    Publication date: April 7, 2011
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yasuhiro Kohara, Tohru Sakata, Makoto Nishiuchi
  • Publication number: 20100193937
    Abstract: A wiring layer including external connection regions is provided on a main surface of an insulating resin layer on a side opposite to that of a semiconductor device mounting face. The wiring layer is coated with a protection layer. An opening is provided to the protection layer such that each external connection region is exposed. Each external connection region has a curved surface recessed toward the insulating resin layer side. The entire area of each opening is filled with a solder ball for mounting a substrate, and the recess of each external connection region is filled with the solder ball, thereby connecting each solder ball to the intermediate layer.
    Type: Application
    Filed: February 1, 2010
    Publication date: August 5, 2010
    Inventors: Masayuki Nagamatsu, Yasuhiro Kohara, Ryosuke Usui
  • Publication number: 20100165266
    Abstract: The present invention provides a production method of a color filter substrate that can efficiently produce a color filter substrate including a multi-layer spacer. The production method of the color filter of the present invention is a production method of a color filter substrate including a colored layer, an electrode, a light-shielding layer, and a multi-layer spacer on a substrate, the production method including the steps of: forming the colored layer and a base colored layer of the multi-layer spacer, forming the electrode, and forming the light-shielding layer and a top layer of the multi-layer spacer.
    Type: Application
    Filed: April 24, 2008
    Publication date: July 1, 2010
    Inventors: Tohru Sakata, Yasuhiro Kohara, Masaharu Akitomo
  • Patent number: 7737368
    Abstract: A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: June 15, 2010
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Yasuhiro Kohara, Ryosuke Usui, Noriaki Kojima
  • Patent number: 7649739
    Abstract: A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: January 19, 2010
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Makoto Murai, Ryosuke Usui, Yasuhiro Kohara
  • Publication number: 20100005653
    Abstract: The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
    Type: Application
    Filed: September 21, 2009
    Publication date: January 14, 2010
    Applicant: Sanyo Electric Co., Ltd.
    Inventors: Makoto Murai, Yasuhiro Kohara, Ryosuke Usui
  • Patent number: 7643141
    Abstract: A method for inspecting a color filter includes a first step of disposing the color filter so that the color filter is opposed to a light source, a second step of outputting, from the light source, monochromatic light of a color corresponding to one of the colors of color layers of the color filter and entering the light into the plurality of color layers, and a third step of inspecting for display unevenness in each of the color layers with light transmitted through the color layers.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: January 5, 2010
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toru Shirai, Yasuhiro Kohara, Morihide Ohsaki, Kenji Takii