Abstract: A device mounting board is provided with: a substrate structural unit including a substrate made of a composition containing amorphous silicon, a first adhesive layer provided on one of the main surfaces of the substrate, and a second adhesive layer provided on the other main surface of the substrate; a first wiring layer provided on the main surface of the first adhesive layer on the opposite side from the substrate; a second wiring layer provided on the main surface of the second adhesive layer on the opposite side from the substrate; and a via conductor, which is provided in a via hole that penetrates the substrate, the first adhesive layer, and the second adhesive layer, which electrically connects the first wiring layer and the second wiring layer.

Abstract: The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

Abstract: A method for inspecting a color filter includes a first step of disposing the color filter so that the color filter is opposed to a light source, a second step of outputting, from the light source, monochromatic light of a color corresponding to one of the colors of color layers of the color filter and entering the light into the plurality of color layers, and a third step of inspecting for display unevenness in each of the color layers with light transmitted through the color layers.

Abstract: In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring layer 18B. The first dummy pattern D1 and the second dummy pattern D2 are connected through a connection part 25 which penetrates an insulation layer 17. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.

Abstract: Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

Abstract: An automobile rear body structure capable of allowing a space created between a rear bumper reinforcing member and a line connecting respective rear ends of a pair of rear side frames to be effectively utilized. In this automobile rear body structure, a rear end cross member (30) has an expanded portion (31a) formed to expand rearward relative to respective rear ends (10a) of a pairs of rear side frames (10), and a rear floor pan (20) has a rear edge including a protruded portion (21). The protruded portion (21) is formed to protrude relative to the rear ends (10a) of the pairs of rear side frames (10) toward the expanded portion of the rear end cross member (30) and connected to the rear end cross member (30), so as to allow a luggage compartment space to be enlarged rearward relative to the rear ends (10a) of the pairs of rear side frames (10).

Abstract: A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.

Abstract: The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

Abstract: A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

Abstract: A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.

Abstract: A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.

Abstract: Disclosed is an automobile rear body structure capable of allowing a space created between a rear bumper reinforcing member and a line connecting respective rear ends of a pair of rear side frames to be effectively utilized. In this automobile rear body structure, a rear end cross member 30 has an expanded portion 31a formed to expand rearward relative to respective rear ends 10a of a pairs of rear side frames 10, and a rear floor pan 20 has a rear edge including a protruded portion 21. The protruded portion 21 is formed to protrude relative to the rear ends 10a of the pairs of rear side frames 10 toward the expanded portion of the rear end cross member 30 and connected to the rear end cross member 30, so as to allow a luggage compartment space to be enlarged rearward relative to the rear ends 10a of the pairs of rear side frames 10.

Abstract: In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring layer 18B. The first dummy pattern D1 and the second dummy pattern D2 are connected through a connection part 25 which penetrates an insulation layer 17. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.