Patents by Inventor Yasuhisa Fujii

Yasuhisa Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090174284
    Abstract: A boundary acoustic wave device includes a piezoelectric substance made of LiNbO3 having a surface obtained by rotating a Y axis by about 15°±10° as a primary surface, a dielectric substance which is made of a silicon oxide and which is laminated to the piezoelectric substance, and an electrode structure which is disposed at a boundary between the piezoelectric substance and the dielectric substance and which includes an IDT arranged to utilize a boundary acoustic wave propagating along the boundary. When the density of the IDT, the thickness thereof, the wavelength determined by the period of electrode fingers of the IDT, and the duty ratio thereof are represented by ? (kg/m3), H (?m), ?(?m), and x, respectively, x and the product of H/? and ? are set in a range that satisfies the following formula (1): (H/?)×?>70.7924(x+0.055)(?2.0884)+797.09??Formula (1).
    Type: Application
    Filed: March 24, 2009
    Publication date: July 9, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu MIMURA, Yasuhisa FUJII, Masaru YATA, Norihiko NAKAHASHI
  • Publication number: 20090121810
    Abstract: A longitudinally coupled resonator acoustic wave filter device that utilizes an inter-IDT resonance mode with a reduced insertion loss has a structure in which apodization weights are assigned in first to third IDTs having narrow pitch electrode finger portions in portions other than the narrow pitch electrode finger portions, such that the electrode finger overlap width sequentially varies in an acoustic wave propagating direction in which an acoustic wave propagates, and portions of the IDTs located at ends adjacent to the narrow pitch electrode finger portions have a maximum electrode finger overlap width.
    Type: Application
    Filed: January 26, 2009
    Publication date: May 14, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhisa FUJII, Masaru YATA
  • Publication number: 20090115547
    Abstract: A longitudinally coupled resonator boundary acoustic wave filter device includes a piezoelectric substrate made of LiNbO3 having a principal plane obtained by rotating the Y-axis through about 15 degrees +?10 degrees, a dielectric substrate made of silicon oxide and laminated on the piezoelectric substrate, and an electrode structure arranged at a boundary between the piezoelectric substrate and the dielectric substrate. The electrode structure includes a plurality of IDTs arranged in a direction in which a boundary acoustic wave propagates, and reflectors, wherein where in each of the plurality of IDTs, the overlap width of electrode fingers is W and the interval of electrode fingers is P, W/P is in a range of about 20 to about 45.
    Type: Application
    Filed: January 15, 2009
    Publication date: May 7, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takao MUKAI, Masaru YATA, Yasuhisa FUJII
  • Patent number: 7486159
    Abstract: A surface acoustic wave device includes a substrate, a plurality of terminals including at least an unbalanced terminal and balanced terminals, and at least one of surface acoustic wave element disposed between the unbalanced terminal and the two balanced terminals. Different signal lines connected to the same surface acoustic wave element intersect through insulating films.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: February 3, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhisa Fujii, Yuichi Takamine
  • Publication number: 20090021322
    Abstract: An elastic wave filter device includes first and second elastic wave filter units connected to an unbalanced terminal. The first and second elastic wave filter units include first to third IDTs and fourth to sixth IDTs, respectively. One end of the first IDT, one end of the second IDT, one end of the fourth IDT, and one end of the sixth IDT are commonly connected together and are connected to the unbalanced terminal. The second IDT and the fifth IDT are each divided into first to third sub-IDT portions in the elastic wave propagation direction, respectively. The second sub-IDT portions of the second and fifth IDTs are connected to first and second balanced terminals, respectively.
    Type: Application
    Filed: October 1, 2008
    Publication date: January 22, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuichi TAKAMINE, Masaru YATA, Yasuhisa FUJII
  • Patent number: 7201969
    Abstract: A surface protecting adhesive film for a semiconductor wafer in which an adhesive layer is formed on one surface of a base film, wherein the adhesive layer comprises 100 weight parts of a polymer (A) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from ?50° C. to 5° C. at which tan ? of a dynamic viscoelasticity is maximized, from 10 weight parts to 100 weight parts of a polymer (B) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from more than 5° C. to 50° C. at which tan ? of a dynamic viscoelasticity is maximized, and from 0.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: April 10, 2007
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masafumi Miyakawa, Makoto Kataoka, Jun Nakashima, Yoshihisa Saimoto, Shinichi Hayakawa, Yasuhisa Fujii
  • Publication number: 20070077902
    Abstract: An oscillation control device for controlling a frequency of an oscillator located at the remote site from a standard laboratory having a standard oscillator. The control device includes: a comparison section to compare a frequency of the frequency signal synchronized with a radio signal produced by a signal processing section with a frequency of a oscillation signal outputted from an oscillator to be controlled, an acquisition section to obtain, through a communication network, a comparison result which is obtained by a comparison of a frequency of the standard oscillator held by the standard laboratory and a frequency of the radio signal, a calculation section to calculate deviation between the frequency of the oscillator to be controlled and the frequency of the standard oscillator based on their comparison, and a control section to control the frequency of the oscillator to be controlled, based on the deviation calculated.
    Type: Application
    Filed: October 3, 2006
    Publication date: April 5, 2007
    Inventors: Michito Imae, Tomonari Suzuyama, Yasuhisa Fujii, Yoshinobu Kasumi, Eiji Ogita, Toshiaki Kawakami
  • Publication number: 20070029677
    Abstract: An interconnection structure includes a lower interconnection layer formed on a substrate and composed of a copper layer, an interlayer insulating layer formed on the lower interconnection layer and having a via reaching the lower interconnection layer, an upper interconnection layer electrically connected to the lower interconnection layer through the via, and composed of a copper layer formed in the interlayer insulating layer, and a barrier metal layer formed between the upper interconnection layer and the interlayer insulating layer. The barrier metal layer has an opening in a bottom portion of the via, and through that opening, the upper interconnection layer comes in direct contact with the lower interconnection layer in the bottom portion of the via. Thus, an interconnection structure suppressing concentration of voids in an interconnection under a via due to stress migration can be attained.
    Type: Application
    Filed: July 19, 2006
    Publication date: February 8, 2007
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Takao Kamoshima, Yasuhisa Fujii, Takeshi Masamitsu
  • Publication number: 20070018756
    Abstract: A surface acoustic wave device includes a substrate, a plurality of terminals including at least an unbalanced terminal and balanced terminals, and at least one of surface acoustic wave element disposed between the unbalanced terminal and the two balanced terminals. Different signal lines connected to the same surface acoustic wave element intersect through insulating films.
    Type: Application
    Filed: July 12, 2005
    Publication date: January 25, 2007
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhisa Fujii, Yuichi Takamine
  • Publication number: 20060204381
    Abstract: Disclosed herein is a micro fluid transferring system that comprises a micropump having a chamber, a first fluid transferring portion connected to the chamber, and a second fluid transferring portion connected to the chamber. This system is characterized in that at least one of the first and second fluid transferring portions comprises a pressure absorbing section for absorbing or alleviating a liquid vibrational pressure therein.
    Type: Application
    Filed: May 3, 2006
    Publication date: September 14, 2006
    Inventors: Kusunoki Higashino, Yasuhisa Fujii, Shunichi Hayamizu, Yasuhiro Sando
  • Patent number: 7094040
    Abstract: Disclosed herein is a micro fluid transferring system that comprises a micropump having a chamber, a first fluid transferring portion connected to the chamber, and a second fluid transferring portion connected to the chamber. This system is characterized in that at least one of the first and second fluid transferring portions comprises a pressure absorbing section for absorbing or alleviating a liquid vibrational pressure therein.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: August 22, 2006
    Assignee: Minolta Co., Ltd.
    Inventors: Kusunoki Higashino, Yasuhisa Fujii, Shunichi Hayamizu, Yasuhiro Sando
  • Publication number: 20060090539
    Abstract: A recovery phenomenon in which the concentration of a compound to be measured in soil increases again after reducing the concentration is utilized for changing the distribution state of the compound to be measured in soil, whereby the direction of the high-concentration region of the compound to be measured in soil can be detected.
    Type: Application
    Filed: October 24, 2005
    Publication date: May 4, 2006
    Applicant: Canon Kabushiki Kaisha
    Inventors: Yasuo Takahashi, Shigekazu Shimizu, Naoya Ichimura, Yasuhisa Fujii, Tokugen Yasuda
  • Publication number: 20050203250
    Abstract: A surface protecting adhesive film for a semiconductor wafer in which an adhesive layer is formed on one surface of a base film, wherein the adhesive layer comprises 100 weight parts of a polymer (A) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from ?50° C. to 5° C. at which tan ? of a dynamic viscoelasticity is maximized, from 10 weight parts to 100 weight parts of a polymer (B) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from more than 5° C. to 50° C. at which tan ? of a dynamic viscoelasticity is maximized, and from 0.
    Type: Application
    Filed: March 26, 2003
    Publication date: September 15, 2005
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Masafumi Miyakawa, Makoto Kataoka, Jun Nakashima, Yoshihisa Fujii, Shinichi Hayakawa, Yasuhisa Fujii
  • Patent number: 6851846
    Abstract: Disclosed herewith is a microchip having a micromixer therein. The mixromixer employs a mixing or extracting structure having (1) a first flow pass provided at a first level of the microchip; (2) a second flow pass provided at a second level of the microchip, which is different from the first level; (3) a third flow pass having a plurality of sub flow passes separately layered at the first level and each having a first end and second end thereof, each sub flow pass being connected to one of the first and second flow passes at the first end thereof; and (4) a fourth flow pass, provided at the first level, connected to the second ends of the sub flow passes so that, at least connecting portions between the fourth flow pass and the sub flow passes of the third flow pass, an extending direction of the fourth flow pass is substantially identical to those of the sub flow passes.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: February 8, 2005
    Assignee: Minolta Co., Ltd.
    Inventors: Yasuhisa Fujii, Shigeo Yamashita, Yasuhiro Sando, Koji Yamamoto, Shunichi Hayamizu
  • Patent number: 6838055
    Abstract: Disclosed herein is a microchip provided with a specimen flow pass, a reagent flow pass, a confluence flow pass all of which are fine flow passes. The specimen flow pass allows specimen to flow toward one end thereof. The reagent flow pass is connected to that end of the specimen flow pass and allows at least one reagent to flow for reaction with the specimen. The confluence flow pass extends from that end of the specimen flow pass and allows the confluent specimen and reagent to flow. A sensing portion is assigned near or at the confluence flow pass, and the reaction of the specimen and the reagent is capable of being detected or observed there. Further to this, the microchip comprises a force applying means for reciprocally moving the specimen and the reagent at the sensing portion.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: January 4, 2005
    Assignee: Minolta Co., Ltd.
    Inventors: Yasuhiro Sando, Yasuhisa Fujii
  • Patent number: 6835313
    Abstract: Disclosed herewith is an extracting structure for incorporating a substance contained in a first liquid into a second liquid. The extracting structure comprises: a channel for allowing the first liquid and the second liquid to flow therein in a form of a layered flow in which first laminar flows of the first liquid and second laminar flows of the second liquid alternately come in contact with each other, wherein the substance in the first laminar flow of the first liquid moves to the second laminar flow of the second liquid through the boundaries between the first laminar flows and the second laminar flows; and a separating section, connected to a lower stream side of the channel, for separating the second liquid from the first liquid. Further, disclosed also herewith is a separating structure for separating a second liquid from the mixture of a first liquid and the second liquid.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: December 28, 2004
    Assignee: Minolta Co., Ltd.
    Inventors: Yasuhiro Sando, Yasuhisa Fujii, Shunichi Hayamizu, Koji Yamamoto
  • Patent number: 6822180
    Abstract: A microchip comprises a flow pass in which a solution containing particles can flow, and a deflection mechanism for deflecting a portion of the particles as the particles flow through the flow pass.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: November 23, 2004
    Assignee: Minolta Co., Ltd.
    Inventors: Yasuhisa Fujii, Yusuhiro Sando
  • Patent number: 6809614
    Abstract: A surface acoustic wave device includes a first surface acoustic wave filter including at least two interdigital transducer IDTs arranged along a surface acoustic wave propagation direction on a piezoelectric substrate, and a second surface acoustic wave filter including at least two interdigital transducer IDTs arranged along the surface acoustic wave propagation direction on a piezoelectric substrate. The input terminals of the first and second surface acoustic wave filters are electrically connected to each other and to an unbalanced signal terminal via a common connection point. The output terminals of the surface acoustic wave filters are connected to balanced signal terminals, respectively. A delay line is introduced between the common connection point and the first surface acoustic wave filter on the piezoelectric substrate.
    Type: Grant
    Filed: December 24, 2002
    Date of Patent: October 26, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhisa Fujii, Minefumi Ouchi, Masaru Yata
  • Publication number: 20040207085
    Abstract: A method of manufacturing a semiconductor device includes the steps of forming a copper layer by plating, forming a defect trapping film on the copper layer, moving a defect in the copper layer into the defect trapping film by annealing or the like, and removing the defect trapping film. Thereby, a semiconductor device in which concentration of micro-voids in a portion in proximity to a bottom of a via due to stress migration can be restrained and a method of manufacturing the same can be obtained.
    Type: Application
    Filed: February 27, 2004
    Publication date: October 21, 2004
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Yasuhisa Fujii, Takao Kamoshima, Takeru Matsuoka
  • Publication number: 20040200724
    Abstract: A microfluidic device is provided in which dead volume is small, response is satisfactory and a channel can be changed easily depending on application of an analysis or a synthesis. The microfluidic device includes pump units each of which has a first joint surface, a pumping mechanism and channels that connect to the pumping mechanism and opens to the first joint surface, and a channel unit having a second joint surface for being detachably joined to the first joint surface and channels that open to the second joint surface and are connectable to the channels of the pump unit. At least one of a material constituting the first joint surface and a material constituting the second joint surface is an elastic material having a self-sealing feature.
    Type: Application
    Filed: September 17, 2003
    Publication date: October 14, 2004
    Inventors: Teruo Fujii, Yasuhiro Sando, Yasuhisa Fujii, Kusunoki Higashino