Abstract: An interconnection structure includes a lower interconnection layer formed on a substrate and composed of a copper layer, an interlayer insulating layer formed on the lower interconnection layer and having a via reaching the lower interconnection layer, an upper interconnection layer electrically connected to the lower interconnection layer through the via, and composed of a copper layer formed in the interlayer insulating layer, and a barrier metal layer formed between the upper interconnection layer and the interlayer insulating layer. The barrier metal layer has an opening in a bottom portion of the via, and through that opening, the upper interconnection layer comes in direct contact with the lower interconnection layer in the bottom portion of the via. Thus, an interconnection structure suppressing concentration of voids in an interconnection under a via due to stress migration can be attained.

Abstract: This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.

Abstract: Disclosed herewith is a microchip having a micromixer therein. The mixromixer employs a mixing or extracting structure having (1) a first flow pass provided at a first level of the microchip; (2) a second flow pass provided at a second level of the microchip, which is different from the first level; (3) a third flow pass having a plurality of sub flow passes separately layered at the first level and each having a first end and second end thereof, each sub flow pass being connected to one of the first and second flow passes at the first end thereof; and (4) a fourth flow pass, provided at the first level, connected to the second ends of the sub flow passes so that, at least connecting portions between the fourth flow pass and the sub flow passes of the third flow pass, an extending direction of the fourth flow pass is substantially identical to those of the sub flow passes.

Abstract: Disclosed herein is a micro fluid transferring system that comprises a micropump having a chamber, a first fluid transferring portion connected to the chamber, and a second fluid transferring portion connected to the chamber. This system is characterized in that at least one of the first and second fluid transferring portions comprises a pressure absorbing section for absorbing or alleviating a liquid vibrational pressure therein.

Abstract: A surface acoustic wave device includes a first surface acoustic wave filter including at least two interdigital transducer IDTs arranged along a surface acoustic wave propagation direction on a piezoelectric substrate, and a second surface acoustic wave filter including at least two interdigital transducer IDTs arranged along the surface acoustic wave propagation direction on a piezoelectric substrate. The input terminals of the first and second surface acoustic wave filters are electrically connected to each other and to an unbalanced signal terminal via a common connection point. The output terminals of the surface acoustic wave filters are connected to balanced signal terminals, respectively. A delay line is introduced between the common connection point and the first surface acoustic wave filter on the piezoelectric substrate.

Abstract: An object of the present invention is to provide a surface protecting adhesive film for a semiconductor wafer having excellent adhesive properties, breakage resistance and stain resistance. According to the invention, provided is a surface protecting adhesive film for a semiconductor wafer in which at least one layer of an intermediate layer and an adhesive layer are provided on one surface of a base film, a minimum value (G′ min) of storage elastic modulus of an adhesive layer (B) at from 50° C. to 100° C. is from 0.07 MPa to 5 MPa, storage elastic modulus of at least one layer (C) of the intermediate layer at 50° C. is from 0.001 MPa to less than 0.

Abstract: In a transversal surface acoustic wave filter, an interdigital transducer on the input side, an interdigital transducer on the output side, and a reflector are arranged in the surface acoustic wave propagation direction on a piezoelectric substrate. While a surface acoustic wave passes through the interdigital transducer on the output side and while the surface acoustic wave reflecting from the reflector passes through the interdigital transducer on the output side, the surface acoustic wave is converted to first and second electrical signals, respectively. The interval between the reflector and the interdigital transducer on the output side is set so that no phase difference is generated between the first and second electrical signals. The interdigital transducer on the output side adjacent to the reflector is weighted so that a part of the interdigital transducer on the output side having the highest excitation intensity is positioned on the reflector side thereof.

Abstract: Disclosed herewith is an extracting structure for incorporating a substance contained in a first liquid into a second liquid. The extracting structure comprises: a channel for allowing the first liquid and the second liquid to flow therein in a form of a layered flow in which first laminar flows of the first liquid and second laminar flows of the second liquid alternately come in contact with each other, wherein the substance in the first laminar flow of the first liquid moves to the second laminar flow of the second liquid through the boundaries between the first laminar flows and the second laminar flows; and a separating section, connected to a lower stream side of the channel, for separating the second liquid from the first liquid. Further, disclosed also herewith is a separating structure for separating a second liquid from the mixture of a first liquid and the second liquid.

Abstract: A surface acoustic wave resonator includes a piezoelectric substrate and an interdigital transducer on the piezoelectric substrate. The interdigital transducer includes first and second comb-shaped electrodes having one or more electrode fingers which are interdigitated with each other. When the first comb-shaped electrode is connected to a positive potential, the second comb-shaped electrode is connected to a negative potential, and the electrode finger connected to the positive potential and the electrode finger connected to the negative potential are reversed in at least one pair of the electrode fingers in an area where electrode fingers connected to the positive potential and electrode fingers connected to the negative potential are alternately arranged in the direction of surface-wave propagation.

Abstract: A microchip comprises a flow pass in which a solution containing particles can flow, and a deflection mechanism for deflecting a portion of the particles as the particles flow through the flow pass.

Abstract: In a transversal surface acoustic wave filter, an interdigital transducer on the input side, an interdigital transducer on the output side, and a reflector are arranged in the surface acoustic wave propagation direction on a piezoelectric substrate. while a surface acoustic wave passes through the interdigital transducer on the output side and while the surface acoustic wave reflecting from the reflector passes through the interdigital transducer on the output side, the surface acoustic wave is converted to first and second electrical signals, respectively. The interval between the reflector and the interdigital transducer on the output side is set so that no phase difference is generated between the first and second electrical signals. The interdigital transducer on the output side adjacent to the reflector is weighted so that a part of the interdigital transducer on the output side having the highest excitation intensity is positioned on the reflector side thereof.

Abstract: This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.

Abstract: A microchip comprises a plurality of supply units capable of supplying a plurality of fluids, a common unit commonly provided for the plurality of supply units, and a flow pass connecting each supply unit and the common unit. The flow pass allows each fluid supplied by each supply unit to flow to the common unit. The dimensions and shape of the flow pass determines the relative timing for each fluid supplied from each supply unit to reach the common unit.

Abstract: Disclosed herein is a microchip provided with a specimen flow pass, a reagent flow pass, a confluence flow pass all of which are fine flow passes. The specimen flow pass allows specimen to flow toward one end thereof. The reagent flow pass is connected to that end of the specimen flow pass and allows at least one reagent to flow for reaction with the specimen. The confluence flow pass extends from that end of the specimen flow pass and allows the confluent specimen and reagent to flow. A sensing portion is assigned near or at the confluence flow pass, and the reaction of the specimen and the reagent is capable of being detected or observed there. Further to this, the microchip comprises a force applying means for reciprocally moving the specimen and the reagent at the sensing portion.

Abstract: A microchip is disclosed. One embodiment of the microchip has a flow pass for containing a reaction. A detection target region wherein light from the reaction is to be generated is located within at least a portion of the flow pass. The microchip has an optical path for detecting the light from the reaction. A length of the optical path is greater than a depth of the flow pass.

Abstract: The present invention relates to an ink jet recording apparatus using an electrostatic actuator. The present invention provides an ink jet recording apparatus comprising a resilient oscillating plate that is facing a pressure chamber that communicates with a nozzle, a first electrode provided on said oscillating plate, a second electrode opposing said first electrode across a space, and a voltage application unit that applies across the first electrode and the second electrode a first voltage that causes the ink in said pressure chamber to be ejected and a second voltage that does not cause the ink to be ejected, wherein said second voltage is applied a specified time prior to the application of the first voltage, so that the residual electrical charges on the first electrode and/or the second electrode can be positively discharged.

Abstract: An inkjet printing head which is capable of being assembled efficiently and easily. In the inkjet printing head, a main frame has a hollow portion for receiving a flexible cable therein, and a sub-frame has a rimmed window for receiving a flexible member. The main frame and sub-frame are combined such that the flexible cable and flexible member are sandwiched therebetween. The hollow portion of the main frame, the flexible cable and the rimmed window of the sub-frame have the same shape so that these members can be reliably positioned with respect to one another. Electrodes on the flexible cable are pressed, with a uniform pressure, to piezoelectric elements of a head assembly attached to the main frame.

Abstract: An electrostatic inkjet head has first and second electrodes. The first electrode is supported on a substrate and the second electrode is on a diaphragm so that a gap is formed between the first and second electrodes. A drive circuit is connected to the first and second electrodes to apply a voltage or pulse between the electrodes. When a voltage is applied between the electrodes, an electrostatic attraction force is generated between the electrodes. The attraction force displaces the diaphragm toward the substrate. This displacement of the diaphragm is used for the ejection of ink. Also, when the voltage is turned off, opposing central portions of the first and second electrodes define a gap that is greater than that defined by opposing end portions of the first and second electrodes.

Abstract: An ink jet head for a printer wherein an ink drop is ejected from a nozzle to fly and land on the recording paper to form an image. The ink jet head includes the nozzle for ejecting ink, an ink channel that communicates with the nozzle, a pair of oscillating plates that are opposing to each other on walls of the ink channel, a pair of electrodes disposed in contact with the oscillating plates, an ink chamber for holding the ink, and an inlet for supplying the ink from the ink chamber to the ink channel. A gap between the electrodes is filled with the ink having a relative dielectric constant higher than air. A voltage is applied between the electrodes.

Abstract: A method of producing a semiconductor wafer, which can prevent the breakage of a wafer, and also can reduce the working time in a series of operations attended by back surface grinding of the semiconductor wafer. The method involves producing a semiconductor wafer wherein an adhesive tape is applied on the surface of the semiconductor wafer and, after grinding the back surface of the semiconductor wafer using a grinding machine, the adhesive tape is peeled off, said process comprises using an adhesive tape having heat shrinkability as the adhesive tape, grinding the back surface of the semiconductor wafer and heating the adhesive tape in the grinding machine, thereby peeling off the adhesive tape from the surface of the semiconductor wafer.