Abstract: The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor. This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.

Abstract: A alloy (Mg—X) of metal (X) and Mg in a liquid phase is made to react with B in a solid phase at a low temperature to manufacture a superconductor, which contains a large amount of MgB2 potential for MRI, linear motorcar, superconducting cavity, electric power transmission cable, high-magnetic field magnet for medical units, electric power storage (SMES), and the like and is formed in the shape of bulk, wire, and foil, by heat treatment performed at a low temperature for a short time and at low cost.

Abstract: An access management apparatus receives a command message having setting and changing functions, performs corresponding processing, and transmits results. A checking unit checks the presence/absence of a data element to be accessed. Access is permitted based on looking up a setting access condition if the data element is not set and looking up a changing access condition if the data element is set. A control table contains identification information, location information, a data setting access condition, and a data changing access condition of each of a plurality of data elements. When receiving a command, a determining unit determines whether the designated data element is already set by looking up location information of the data element in the control table. A data setting/changing unit sets or changes data in accordance with the access condition looked up.

Abstract: A alloy (Mg—X) of metal (X) and Mg in a liquid phase is made to react with B in a solid phase at a low temperature to manufacture a superconductor, which contains a large amount of MgB2 potential for MRI, linear motorcar, superconducting cavity, electric power transmission cable, high-magnetic field magnet for medical units, electric power storage (SMES), and the like and is formed in the shape of bulk, wire, and foil, by heat treatment performed at a low temperature for a short time and at low cost.

Abstract: A superfine multi-core Nb3Al superconductive wire is produced by getting a Nb3Al superconductive wire ready which was obtained by subjecting a precursor wire having a superfine multi-core structure in which a plurality of Nb/Al complex cores are embedded in Nb, Ta, a Nb based dilute alloy, or a Ta based dilute alloy as the matrix to a rapid heating and quenching treatment comprising rapidly heating to a temperature range near 2,000° C. in 2 seconds, (A) coating the Nb3Al superconductive wire with Cu or Ag as the stabilizing material; then (B) subjecting to a hot isostatic press (HIP) process for 10 minutes or more in a inert gas environment with a pressure of 40 atmospheres or more; and then (C) subjecting heat treatment for 1–200 hours in temperature range of 680–850° C.

Abstract: A superfine multi-core Nb3Al superconductive wire is produced by getting a Nb3Al superconductive wire ready which was obtained by subjecting a precursor wire having a superfine multi-core structure in which a plurality of Nb/Al complex cores are embedded in Nb, Ta, a Nb based dilute alloy, or a Ta based dilute alloy as the matrix to a rapid heating and quenching treatment comprising rapidly heating to a temperature range near 2,000° C. in 2 seconds, (A) coating the Nb3Al superconductive wire with Cu or Ag as the stabilizing material; then (B) subjecting to a hot isostatic press (HIP) process for 10 minutes or more in a inert gas environment with a pressure of 40 atmospheres or more; and then (C) subjecting heat treatment for 1-200 hours in temperature range of 680-850° C.

Abstract: By rapidly heating a precursor wire having a multifilamentary structure in which multiple composite cores in which a composite compound of an Nb—Ga compound and Nb is embedded in Nb are embedded in Nb, Ta, Nb-base alloy or Ta-base alloy as a matrix material to a temperature range of 1400 to 2100° C. in 2 seconds, quenching the precursor wire at a rate of 5000° C./second or larger, and subjecting the precursor wire to additional heat treatment at a temperature range of 600 to 850° C. for 1 to 400 hours, a superconducting wire having a multifilamentary structure in which multiple composite cores in which a composite compound containing Nb3Ga of a stoichiometric composition embedded in Nb are embedded in Nb, Ta, Nb-base alloy or Ta-base alloy as a matrix material is obtained.

Abstract: An access management apparatus receives a command message having setting and changing functions, performs corresponding processing, and transmits results. A checking unit checks the presence/absence of a data element to be accessed. Access is permitted based on looking up a setting access condition if the data element is not set and looking up a changing access condition if the data element is set. A control table contains identification information, location information, a data setting access condition, and a data changing access condition of each of a plurality of data elements. When receiving a command, a determining unit determines whether the designated data element is already set by looking up location information of the data element in the control table. A data setting/changing unit sets or changes data in accordance with the access condition looked up.

Abstract: By rapidly heating a precursor wire having a multifilamentary structure in which multiple composite cores in which a composite compound of an Nb—Ga compound and Nb is embedded in Nb are embedded in Nb, Ta, Nb-base alloy or Tabase alloy as a matrix material to a temperature range of 1400 to 2100° C. in 2 seconds, quenching the precursor wire at a rate of 5000° C./second or larger, and subjecting the precursor wire to additional heat treatment at a temperature range of 600 to 850° C. for 1 to 400 hours, a superconducting wire having a multifilamentary structure in which multiple composite cores in which a composite compound containing Nb3Ga of a stoichiometric composition embedded in Nb are embedded in Nb, Ta, Nb-base alloy or Tabase alloy as a matrix material is obtained.

Abstract: A high-performance Nb3Al extra-fine multifilamentary superconducting wire is produced simply and inexpensively through the improvement of critical values, Tc, Hc2 and Jc, without the addition of third elements such as Ge, Si and Cu. A first rapid heating and quenching treatment is applied to an Nb/Al composite wire having an atomic ratio of Al to Nb from 1:2.5 to 1:3.5 and having an extra-fine multifilamentary structure to form a BCC alloy phase comprising Nb with Al supersaturatedly dissolved therein wherein the treatment comprises heating the composite wire up to a temperature not lower than 1900° C. within two seconds and then introducing it into a molten metal at a temperature not higher than 400° C. to rapidly quench it.

Abstract: A Cu-containing Nb3Al multifilamentary superconductive wire having a multifilamentary (superfine multi-core structure that a large number of micro-complex cores each obtained by complexing a Cu—Al alloy containing Cu in an amount of more than 0.2 at. % and at most 10 at. % in Nb are embedded in Nb, Ta, an Nb alloy or a Ta alloy as a matrix, wherein in the micro-complex cores, an A15 phase compound structure is formed by rapid heating at a temperature of 1,700° C. or more for 2 seconds or less and quenching to approximately room temperature, and further additionally heat-treated at a temperature of 650 to 900° C. This superconductive wire has high Jc in a low magnetic field, can be applied to all magnetic fields of 29 T or less, and is excellent in Jc characteristics in a high magnetic field in comparison with an Nb3Al wire.

Abstract: A process for producing an ultrafine multifilamentary superconducting Nb3(Al,Ge) wire capable of generating a high critical current density comprising: preparing a composite core material comprising an A1—(2-30)at. % Ge alloy (where at. % represents % by atomic) 1 &mgr;m or less in thickness uniformly incorporated into a Nb matrix at a volume ratio in a range of 1:2.5 to 1:3.5 and forming a composite therewith; fabricating a composite wire having an ultrafine multifilamentary structure by embedding several tens to several millions of the resulting composite core materials in a cylindrical matrix material containing Nb; forming a A15-phase filament having a lower order in crystallinity inside the composite wire by a rapid heating and quenching treatment comprising rapidly heating to a temperature of 1,700° C.

Abstract: A high-performance Nb3Al extra-fine multifllamentary superconducting wire is produced simply and inexpensively through the improvement of critical Values, Tc, Hc2 and Jc, without the addition of third elements such an Go, Si and Cu

Abstract: A voltage value of an impulse voltage repetitively applied on a test-piece coil is increased in accordance with time elapse. A terminal voltage applied on both ends of the test-piece coil is monitored to detect an electric breakdown of the test-piece coil. Upon detecting such a breakdown, application of the impulse voltage is immediately stopped to prevent the test-piece coil from being unnecessarily damaged. Meanwhile, a voltage value of the impulse voltage is measured quantitatively at the time the electric breakdown is detected and the measured data is stored in a memory, so that the memorized data can be used later as a breakdown voltage value.

Abstract: A method and apparatus issues a plurality of kinds of IC cards. A plurality of items of issue information are stored, to be written into a plurality of kinds of IC cards being issued. The kind of the IC card connected to the IC card processing apparatus is determined, based on received information from the IC card. Command data corresponding to the determined kind of the IC card is generated, the generated command data including a function code corresponding to the kind of the IC card and an item of issue information of the plurality of items of stored issue information, and the command data being formed into a format corresponding to the kind of the IC card. The command and data having a converted format prepared by a selected processing method is transmitted to the IC card.

Abstract: A file managing method includes a step of setting a key data of a portable storage medium having a plurality of storage areas, a step of determining whether the key data is changed, a step of inhibiting data from being processed in the plurality of storage areas when it is determined that the key data is not changed, and a step of processing data of the plurality of storage areas in response to a given command when it is determined that the key data is changed.

Abstract: A method of nondestructive insulation testing is disclosed which comprises the steps of: (a) placing an electric device, having a core and at least one winding provided on the core, in a reduced atmospheric pressure; (b) insulating the laminated core from the ground; (c) supplying a voltage signal having a first surge waveform to the winding; and detecting a glow discharge which may result from step (c) to detect an insulation condition of the winding, wherein the reduced atmospheric pressure ranges from 65 to 75 Torr and the voltage signal is applied in the first direction of the winding and then, is applied in the second, opposite, direction of the winding.

Abstract: A high speed dynamic run-out testing apparatus includes a drive source rotatable at a high speed and having an output shaft, a main shaft coupled coaxially with the output shaft of the drive source, a non-contact bearing for rotatably supporting the main shaft in a non-contact fashion, a testpiece carrier shaft provided on one side of the main shaft remote from the drive source for supporting a cylindrical testpiece mounted on such testpiece carrier shaft, and a non-contact displacement detector for measuring a displacement of the cylindrical testpiece.

Abstract: As a method for transferring data between a first data processing apparatus and a second data processing apparatus connected thereto attachably and detachably, there is provided a transmission method of changing protocol having a step for transmitting a first request signal from the first data processing apparatus to the second data processing apparatus, based on a first protocol, for requesting a change from the first protocol to second protocol, a second transmission step for transmitting, when no first response signals to the first request signal are received from the second data processing apparatus, a second request signal to the second data processing apparatus, based on the second protocol, for requesting the change from the first to the second protocol, and a step for determining, in accordance with receiving of a second response signal to the second request signal from the second data processing apparatus, whether data transfer between the apparatuses should be executed or not.

Abstract: Disclosed is a data transmission system comprising a first device having first clock generator for generating a first clock signal for data exchange with a second device, second clock generator for generating a second clock signal for resetting the second device to be operable, and clock supplying unit for supplying the first and second clock signals to the second device, and the second device for performing data exchange with the first device in response to the first clock, the second device being reset by the second clock. It is thus possible to ensure data exchange using existing hardware such as a UART, while supplying a reset clock whose frequency will not be a multiple of 1200 bps even by frequency division by 2.sup.n, to the IC card. This data transmission system will therefore cope with both the demand for the ISO standardization and the use of existing hardware.