Abstract: Poor opening is detected with certainty and reliability with respect to a ground line of an integrated circuit device regardless of the connection state of a load and the operating state of a drive circuit. In an integrated circuit device 10, a drive circuit 30 switches between conduction and interruption of a load current using switch elements 40 and 45. The ground line 31 is grounded via the GND terminal 32 to the common ground provided outside the integrated circuit device 10 and is connected to the drive circuit 30. The ground line 21 is grounded to the common ground via the GND terminal 22 and is connected to the control circuit 20. The diagnostic current supply circuit 90 supplies a predetermined diagnostic current to the ground line 31. The rectifying elements 61 and 62 are connected between the ground line 21 and the ground line 31.

Abstract: With a simple configuration, responsiveness between an electronic control unit and a load drive circuit is monitored without deteriorating characteristics of the load drive circuit. The load drive circuit according to the present invention diagnoses an abnormality in responsiveness of a switch element that drives a load based on a drive command of the switch element and a signal at an output terminal of the switch element.

Abstract: Provided is an electronic control unit capable of performing a high-accurate failure diagnosis in a short time as an electronic control unit having a failure diagnosis function. A load drive circuit that drives a load, a control circuit that controls the load drive circuit, and a diagnosis circuit that diagnoses an output state of the load drive circuit and outputs a diagnostic result to the control circuit are provided. The diagnosis circuit outputs a diagnosis completion flag indicating whether or not there is a diagnosis opportunity to the control circuit.

Abstract: Provided is a current control device capable of continuing feedback control for a solenoid in normal feedback control while preventing occurrence of an unintended valve operation due to flow of a reverse current.

Abstract: Provided is an electronic control unit capable of performing a high-accurate failure diagnosis in a short time as an electronic control unit having a failure diagnosis function. A load drive circuit that drives a load, a control circuit that controls the load drive circuit, and a diagnosis circuit that diagnoses an output state of the load drive circuit and outputs a diagnostic result to the control circuit are provided. The diagnosis circuit outputs a diagnosis completion flag indicating whether or not there is a diagnosis opportunity to the control circuit.

Abstract: It is made possible to control ignition appropriately. An ignition device 1 for an internal combustion engine includes a spark coil 50 including: a primary side coil 51 connected to a direct current power supply 40 and a secondary side coil 52 magnetically connected to the primary side coil 51 and connected to an ignition plug 60; a switch element 30 that performs switching between energization and interruption of primary current I1 to the primary side coil 51; and a switch element controlling circuit 20 that controls the switch element 30 on the basis of an ignition controlling signal 51 supplied from an ECU 10. A turn-on delay adjustment circuit 22 that delays a control timing of the switch element 30 is disposed between the ECU 10 and the switch element 30 such that first resonance noise generated due to interruption of the primary current I1 to the primary side coil 51 is reduced.

Abstract: An electronic control device has a compact abnormality detection circuit that does not require a complicated circuit, and is capable of suppressing a cost increase when being applied a direct injection injector drive circuit and other drive circuits. A current detection circuit includes a current detection resistor, a differential amplifier, and a current detection unit. The current detected is supplied to the abnormality/normality determination unit. A combined resistance value of a diagnostic current drive circuit and the current detection resistor is higher than an injector drive circuit. A fuel injection signal is input to a logic circuit, and a fuel cut signal is input to a different terminal of the logic circuit. The logic circuit's output terminal is connected to the injector drive circuit's gate. The output signal from a fuel injection signal output unit is supplied via a switch to the diagnostic current drive circuit's gate.

Abstract: With a simple configuration, responsiveness between an electronic control unit and a load drive circuit is monitored without deteriorating characteristics of the load drive circuit. The load drive circuit according to the present invention diagnoses an abnormality in responsiveness of a switch element that drives a load based on a drive command of the switch element and a signal at an output terminal of the switch element.

Abstract: It is made possible to control ignition appropriately. An ignition device 1 for an internal combustion engine includes a spark coil 50 including: a primary side coil 51 connected to a direct current power supply 40 and a secondary side coil 52 magnetically connected to the primary side coil 51 and connected to an ignition plug 60; a switch element 30 that performs switching between energization and interruption of primary current I1 to the primary side coil 51; and a switch element controlling circuit 20 that controls the switch element 30 on the basis of an ignition controlling signal 51 supplied from an ECU 10. A turn-on delay adjustment circuit 22 that delays a control timing of the switch element 30 is disposed between the ECU 10 and the switch element 30 such that first resonance noise generated due to interruption of the primary current I1 to the primary side coil 51 is reduced.

Abstract: An electronic control device has a compact abnormality detection circuit that does not require a complicated circuit, and is capable of suppressing a cost increase when being applied a direct injection injector drive circuit and other drive circuits. A current detection circuit includes a current detection resistor, a differential amplifier, and a current detection unit. The current detected is supplied to the abnormality/normality determination unit. A combined resistance value of a diagnostic current drive circuit and the current detection resistor is higher than an injector drive circuit. A fuel injection signal is input to a logic circuit, and a fuel cut signal is input to a different terminal of the logic circuit. The logic circuit's output terminal is connected to the injector drive circuit's gate. The output signal from a fuel injection signal output unit is supplied via a switch to the diagnostic current drive circuit's gate.

Abstract: Provide a cooking device capable of processing food with a simple configuration while inhibiting oxidation of food and also inhibiting pressure inside a cooking container from rising excessively. A cooking device processes food in an accommodation space by a processing tool rotated by a motor while an air in the accommodation space in which the processing tool to process the food is arranged is exhausted and includes a driving device (a closing member) and a check valve. The driving device opens/closes the accommodation space. The check valve allows an outflow of the air out of the accommodation space when the air in the accommodation space closed by the driving device is exhausted and also stops an opposite flow of the air after the air is exhausted.

Abstract: Provide a cooking device capable of processing food with a simple configuration while inhibiting oxidation of food and also inhibiting pressure inside a cooking container from rising excessively. A cooking device processes food in an accommodation space by a processing tool rotated by a motor while an air in the accommodation space in which the processing tool to process the food is arranged is exhausted and includes a driving device (a closing member) and a check valve. The driving device opens/closes the accommodation space. The check valve allows an outflow of the air out of the accommodation space when the air in the accommodation space closed by the driving device is exhausted and also stops an opposite flow of the air after the air is exhausted.

Abstract: Provide a cooking device capable of processing food with a simple configuration while inhibiting oxidation of food and also inhibiting pressure inside a cooking container from rising excessively. A cooking device processes food in an accommodation space by a processing tool rotated by a motor while an air in the accommodation space in which the processing tool to process the food is arranged is exhausted and includes a driving device (a closing member) and a check valve. The driving device opens/closes the accommodation space. The check valve allows an outflow of the air out of the accommodation space when the air in the accommodation space closed by the driving device is exhausted and also stops an opposite flow of the air after the air is exhausted.

Abstract: A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs.

Abstract: An internal operation of RF IC is adjusted so that the level of an RF transmitter signal is substantially stopped from rising, or made to descend in course of ramp-up of the RF transmitter signal. This adjustment is enabled by ramp-up adjustment data Last 4 symbols contained in preamble data precedent to real transmission data transmitted after completion of ramp-up. The ramp-up adjustment data and real transmission data are supplied from a baseband LSI. The RF transmitter signal contains phase and amplitude modulation components according to the EDGE system. RF IC includes phase and amplitude modulation control loops PM LP and AM LP. Ramp-up of RF power amplifiers PA1 and PA2 is performed by controlling the gain of the first variable amplifier MVGA included in the AM LP according to ramp information. Thus, unwanted radiation's level is reduced during ramp-up of the RF transmitter signal of the RF power amplifiers.

Abstract: A driver circuit transmits a signal generated by a signal level generation circuit to a circuit to be measured by transmitting the signal to a output buffer circuit via a circuit (prebuffer circuit) that drives the output buffer circuit and causing the output buffer circuit to drive a transmission line. The driver circuit includes the prebuffer circuit and a replica buffer circuit formed by imitating the prebuffer circuit. The prebuffer circuit and the replica buffer circuit are disposed in parallel. The driver circuit temporarily increases input bias current to be supplied to output-stage transistors of the output buffer circuit on the basis of output current of the replica buffer circuit during transition of an input or output signal.

Abstract: An internal operation of RF IC is adjusted so that the level of an RF transmitter signal is substantially stopped from rising, or made to descend in course of ramp-up of the RF transmitter signal. This adjustment is enabled by ramp-up adjustment data Last 4 symbols contained in preamble data precedent to real transmission data transmitted after completion of ramp-up. The ramp-up adjustment data and real transmission data are supplied from a baseband LSI. The RF transmitter signal contains phase and amplitude modulation components according to the EDGE system. RF IC includes phase and amplitude modulation control loops PM LP and AM LP. Ramp-up of RF power amplifiers PA1 and PA2 is performed by controlling the gain of the first variable amplifier MVGA included in the AM LP according to ramp information. Thus, unwanted radiation's level is reduced during ramp-up of the RF transmitter signal of the RF power amplifiers.

Abstract: A sheet separating device includes: an air blowing unit that is configured to blow air toward a side face of stacked sheets being stacked with a plurality of sheets to separate the sheets by forming an air layer between the sheets; and a sheet pressing unit that is configured to apply a pressing force on the uppermost sheet in the stacked sheets while the uppermost sheet is separated from other sheets, the pressing force having a downward component and a component in a direction along the uppermost sheet.

Abstract: An internal operation of RF IC is adjusted so that the level of an RF transmitter signal is substantially stopped from rising, or made to descend in course of ramp-up of the RF transmitter signal. This adjustment is enabled by ramp-up adjustment data Last 4 symbols contained in preamble data precedent to real transmission data transmitted after completion of ramp-up. The ramp-up adjustment data and real transmission data are supplied from a baseband LSI. The RF transmitter signal contains phase and amplitude modulation components according to the EDGE system. RF IC includes phase and amplitude modulation control loops PM LP and AM LP. Ramp-up of RF power amplifiers PA1 and PA2 is performed by controlling the gain of the first variable amplifier MVGA included in the AM LP according to ramp information. Thus, unwanted radiation's level is reduced during ramp-up of the RF transmitter signal of the RF power amplifiers.

Abstract: A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs.