Abstract: A hard disk drive suspension includes a suspension tail configured to electrically connect to a read-write transducer at a distal end and extending in a proximal direction toward a tapered tip at a proximal end, where the tapered tip comprises a decreasing taper that narrows in the proximal direction. Hence, structural overlap among adjacent suspension tails in misalignment scenarios and consequent marginalized electrical connections between the suspension tail and a corresponding flexible printed circuit are inhibited. The most proximal electrical pads of the suspension tail may be configured with a different aspect ratio, or in a fewer number of lines, from other adjacent electrical pads, thereby fitting within the narrowest portion of the tapered tip.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.

Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein the external electrode includes a base conductive layer that includes glass of less than 7 weight % and is mainly composed of a transition metal other than an iron group or a noble metal, and a first plated film that covers the base conductive layer, has a thickness that is half of a thickness of the base conductive layer or more and is mainly composed of a transition metal other than an iron group.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and an external electrode. The multi-layer unit includes an end surface oriented in a first direction, a side surface oriented in a second direction orthogonal to the first direction, a ridge connecting the end surface and the side surface, ceramic layers, and internal electrodes. The multi-layer ceramic electronic component satisfies the following relationships: A/L?0.0142*ln(L)+0.0256, A/T?0.0274*ln(T)+0.0719, B/L?0.0103*ln(L)+0.0281, and B/T?0.0189*ln(T)+0.0707, where A represents a thickness of the external electrode in the second direction at a position adjacent to the ridge on the side surface, B represents a thickness of the external electrode in the first direction at a position adjacent to the ridge on the end surface, L represents a dimension of the multi-layer ceramic electronic component in the first direction, and T represents a dimension of the multi-layer ceramic electronic component in the second direction.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.

Abstract: A multi-layer ceramic capacitor includes: a body including first and second end surfaces facing each other in a uniaxial direction, a first internal electrode drawn to the first end surface, a second internal electrode drawn to the second end surface, a capacitance forming unit including the first and second internal electrodes, and first and second end margins; a first external electrode; and a second external electrode, the multi-layer ceramic capacitor having a dimension of 0.4 mm or less in the uniaxial direction, the multi-layer ceramic capacitor satisfying the following condition: R??4.4*ln(S)+2.3, where R (%) represents a proportion of a total dimension of the first and second end margins in the uniaxial direction to a dimension of the body in the uniaxial direction, and S (mm2) represents an area of a cross section of the capacitance forming unit, the cross section being orthogonal to the uniaxial direction.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and an external electrode. The multi-layer unit includes an end surface oriented in a first direction, a side surface oriented in a second direction orthogonal to the first direction, a ridge connecting the end surface and the side surface, ceramic layers, and internal electrodes. The multi-layer ceramic electronic component satisfies the following relationships: A/L?0.0142*ln(L)+0.0256, A/T?0.0274*ln(T)+0.0719, B/L?0.0103*ln(L)+0.0281, and B/T?0.0189*ln(T)+0.0707, where A represents a thickness of the external electrode in the second direction at a position adjacent to the ridge on the side surface, B represents a thickness of the external electrode in the first direction at a position adjacent to the ridge on the end surface, L represents a dimension of the multi-layer ceramic electronic component in the first direction, and T represents a dimension of the multi-layer ceramic electronic component in the second direction.

Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and at least a pair of external electrodes that are provided on the first face and the second face of the ceramic multilayer structure, wherein the external electrode includes a base conductive layer including ceramic of 5 weight % or less and being mainly composed of a transition metal other than an iron group or a noble metal and a first plated film having a thickness that is half of a thickness of the base conductive layer or more and being mainly composed of a transition metal other than an iron group.

Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein the external electrode includes a base conductive layer that includes glass of less than 7 weight % and is mainly composed of a transition metal other than an iron group or a noble metal, and a first plated film that covers the base conductive layer, has a thickness that is half of a thickness of the base conductive layer or more and is mainly composed of a transition metal other than an iron group.

Abstract: To present an injection head having silencing function for gas type fire extinguisher capable of reducing the noise generated upon release of fire extinguishing gas. In a gas type fire extinguisher using a fire extinguishing gas, a silencer 3A is disposed in an injection head 1A installed for releasing a fire extinguishing gas into a fire extinguishing area.

Abstract: A light-emitting diode element includes an optical semiconductor layer, an electrode unit to be connected to the optical semiconductor layer, and an encapsulating resin layer that encapsulates the optical semiconductor layer and the electrode unit, the encapsulating resin layer containing a light reflection component.

Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate.

Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

Abstract: To present an injection head having silencing function for gas type fire extinguisher capable of reducing the noise generated upon release of fire extinguishing gas. In a gas type fire extinguisher using a fire extinguishing gas, a silencer 3A is disposed in an injection head 1A installed for releasing a fire extinguishing gas into a fire extinguishing area.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.