Patents by Inventor Yasushi Inoue

Yasushi Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190315936
    Abstract: The present invention provides a new method by which polymers can be modified. The present invention provides a method for modifying a polymer including the step of: irradiating a reaction system containing a polymer with light to react the reaction system in a presence of a compound radical, wherein the compound radical is a radical containing one element selected from the group consisting of Group 15 elements and Group 16 elements, and a Group 17 element.
    Type: Application
    Filed: December 16, 2017
    Publication date: October 17, 2019
    Inventors: Kiyoto TAKAMORI, Kei OHKUBO, Tsuyoshi INOUE, Yasushi MIZUTA, Yuichi ITOU
  • Patent number: 10447528
    Abstract: A radio communication system includes: slave devices which repetitively transmit, a plurality of times, a radio signal with a prescribed frequency that includes device identification information during a radio communication with a master device; a master device which generates communication situation information including a reception success rate and received signal strength of a radio signal during each radio communication from each slave device; and a failure factor estimation apparatus which, based on communication situation information with respect to a plurality of radio communications including a radio communication in which a communication failure of the received signal strength is lower than prescribed strength and/or the reception success rate is lower than a prescribed rate has occurred, generates and outputs failure factor presentation information indicating a failure inducer estimated to have induced the communication failure and an estimation result of a position of the failure inducer.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: October 15, 2019
    Assignee: OMRON Corporation
    Inventors: Soji Ohmae, Ryota Yamada, Hajime Umeki, Yasushi Kawashima, Yuki Inoue
  • Patent number: 10418565
    Abstract: To provide a light-emitting element with an improved reliability, a light-emitting element with a high current efficiency (or a high quantum efficiency), and a novel dibenzo[f,h]quinoxaline derivative that is favorably used in a light-emitting element which is one embodiment of the present invention. A light-emitting element includes an EL layer between an anode and a cathode. The EL layer includes a light-emitting layer; the light-emitting layer contains a first organic compound having an electron-transport property and a hole-transport property, a second organic compound having a hole-transport property, and a light-emitting substance; the combination of the first organic compound and the second organic compound forms an exciplex; the HOMO level of the first organic compound is lower than the HOMO level of the second organic compound; and a difference between the HOMO level of the first organic compound and the HOMO level of the second organic compound is less than or equal to 0.4 eV.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: September 17, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Satoshi Seo, Takao Hamada, Tatsuyoshi Takahashi, Yasushi Kitano, Hiroki Suzuki, Hideko Inoue
  • Patent number: 10381160
    Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and an external electrode. The multi-layer unit includes an end surface oriented in a first direction, a side surface oriented in a second direction orthogonal to the first direction, a ridge connecting the end surface and the side surface, ceramic layers, and internal electrodes. The multi-layer ceramic electronic component satisfies the following relationships: A/L?0.0142*ln(L)+0.0256, A/T?0.0274*ln(T)+0.0719, B/L?0.0103*ln(L)+0.0281, and B/T?0.0189*ln(T)+0.0707, where A represents a thickness of the external electrode in the second direction at a position adjacent to the ridge on the side surface, B represents a thickness of the external electrode in the first direction at a position adjacent to the ridge on the end surface, L represents a dimension of the multi-layer ceramic electronic component in the first direction, and T represents a dimension of the multi-layer ceramic electronic component in the second direction.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: August 13, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Katsuo Sakatsume, Masumi Ishii, Takeshi Nosaki, Norihiro Arai, Jyouji Ariga, Yasushi Inoue
  • Patent number: 10379017
    Abstract: In order to surely discharge dust produced in a sample containing part 10, the present invention is adapted to include: a dust introduction part 30 that has a through-hole 3a formed penetrating in a vertical direction and introduces dust produced in the sample containing part 10 into the through-hole 3a; a dust containing part 43 that contains the dust discharged through the through-hole 3a; and a dust discharge path 41a of which one end is connected to the dust introduction part 30 to communicatively connect to the through-hole 3a and the other end is connected to the dust containing part 43, in which the dust discharge path 41a is linearly formed along the vertical direction from the one end to the other end.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 13, 2019
    Assignee: HORIBA, LTD.
    Inventors: Yasushi Hirata, Takahito Inoue, Takuji Kurozumi
  • Patent number: 10322185
    Abstract: The present invention can provide a controlled drug release carrier formed by using a silk fibroin porous material, which has high drug controlled release rate, controllability of the drug controlled release speed, high strength, easy handleability, skin care properties from high biocompatibility, high water retentivity, and capability of efficiently retaining a drug.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: June 18, 2019
    Assignees: HITACHI CHEMICAL COMPANY, LTD., ST. MARIANNA UNIVERSITY, SCHOOL OF MEDICINE, NATIONAL INSTITUTE OF AGROBIOLOGICAL SCIENCES
    Inventors: Kazutoshi Kobayashi, Kunihiro Suto, Naosuke Sumi, Hajime Inoue, Yasushi Tamada
  • Publication number: 20190180940
    Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 13, 2019
    Inventors: JYOUJI ARIGA, KATSUO SAKATSUME, MASUMI ISHII, TAKESHI NOSAKI, NORIHIRO ARAI, YASUSHI INOUE
  • Publication number: 20180151295
    Abstract: A multi-layer ceramic capacitor includes: a body including first and second end surfaces facing each other in a uniaxial direction, a first internal electrode drawn to the first end surface, a second internal electrode drawn to the second end surface, a capacitance forming unit including the first and second internal electrodes, and first and second end margins; a first external electrode; and a second external electrode, the multi-layer ceramic capacitor having a dimension of 0.4 mm or less in the uniaxial direction, the multi-layer ceramic capacitor satisfying the following condition: R??4.4*ln(S)+2.3, where R (%) represents a proportion of a total dimension of the first and second end margins in the uniaxial direction to a dimension of the body in the uniaxial direction, and S (mm2) represents an area of a cross section of the capacitance forming unit, the cross section being orthogonal to the uniaxial direction.
    Type: Application
    Filed: November 28, 2017
    Publication date: May 31, 2018
    Inventors: Daisuke Iwai, Shoji Kusumoto, Yoshinori Shibata, Michio Oshima, Atsuhiro Yanagisawa, Yasushi Inoue
  • Publication number: 20180053601
    Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and an external electrode. The multi-layer unit includes an end surface oriented in a first direction, a side surface oriented in a second direction orthogonal to the first direction, a ridge connecting the end surface and the side surface, ceramic layers, and internal electrodes. The multi-layer ceramic electronic component satisfies the following relationships: A/L?0.0142*ln(L)+0.0256, A/T?0.0274*ln(T)+0.0719, B/L?0.0103*ln(L)+0.0281, and B/T?0.0189*ln(T)+0.0707, where A represents a thickness of the external electrode in the second direction at a position adjacent to the ridge on the side surface, B represents a thickness of the external electrode in the first direction at a position adjacent to the ridge on the end surface, L represents a dimension of the multi-layer ceramic electronic component in the first direction, and T represents a dimension of the multi-layer ceramic electronic component in the second direction.
    Type: Application
    Filed: August 15, 2017
    Publication date: February 22, 2018
    Inventors: Katsuo Sakatsume, Masumi Ishii, Takeshi Nosaki, Norihiro Arai, Jyouji Ariga, Yasushi Inoue
  • Publication number: 20170345568
    Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and at least a pair of external electrodes that are provided on the first face and the second face of the ceramic multilayer structure, wherein the external electrode includes a base conductive layer including ceramic of 5 weight % or less and being mainly composed of a transition metal other than an iron group or a noble metal and a first plated film having a thickness that is half of a thickness of the base conductive layer or more and being mainly composed of a transition metal other than an iron group.
    Type: Application
    Filed: March 13, 2017
    Publication date: November 30, 2017
    Inventors: Katsuo SAKATSUME, Masumi ISHII, Takeshi NOSAKI, Norihiro ARAI, Jyouji ARIGA, Yasushi INOUE
  • Publication number: 20170345570
    Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein the external electrode includes a base conductive layer that includes glass of less than 7 weight % and is mainly composed of a transition metal other than an iron group or a noble metal, and a first plated film that covers the base conductive layer, has a thickness that is half of a thickness of the base conductive layer or more and is mainly composed of a transition metal other than an iron group.
    Type: Application
    Filed: March 13, 2017
    Publication date: November 30, 2017
    Inventors: Katsuo SAKATSUME, Masumi ISHII, Takeshi NOSAKI, Norihiro ARAI, Jyouji ARIGA, Yasushi INOUE
  • Patent number: 9597537
    Abstract: To present an injection head having silencing function for gas type fire extinguisher capable of reducing the noise generated upon release of fire extinguishing gas. In a gas type fire extinguisher using a fire extinguishing gas, a silencer 3A is disposed in an injection head 1A installed for releasing a fire extinguishing gas into a fire extinguishing area.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: March 21, 2017
    Assignee: KOATSU CO., LTD.
    Inventors: Yasushi Inoue, Masahiro Yabushita
  • Patent number: 8890190
    Abstract: A light-emitting diode element includes an optical semiconductor layer, an electrode unit to be connected to the optical semiconductor layer, and an encapsulating resin layer that encapsulates the optical semiconductor layer and the electrode unit, the encapsulating resin layer containing a light reflection component.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: November 18, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Hisataka Ito, Yasushi Inoue, Sadahito Misumi
  • Patent number: 8699187
    Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 15, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Tetsuya Nakatsuka, Satoshi Kaneko, Masashi Okubo
  • Patent number: 8659157
    Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: February 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuta Kimura, Yasushi Inoue, Takeshi Matsumura
  • Patent number: 8642362
    Abstract: A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Hisataka Ito, Yasushi Inoue, Sadahito Misumi
  • Patent number: 8638001
    Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: January 28, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuta Kimura, Yasushi Inoue, Takeshi Matsumura
  • Publication number: 20130292140
    Abstract: To present an injection head having silencing function for gas type fire extinguisher capable of reducing the noise generated upon release of fire extinguishing gas. In a gas type fire extinguisher using a fire extinguishing gas, a silencer 3A is disposed in an injection head 1A installed for releasing a fire extinguishing gas into a fire extinguishing area.
    Type: Application
    Filed: May 3, 2012
    Publication date: November 7, 2013
    Inventors: Yasushi INOUE, Masahiro Yabushita
  • Publication number: 20120302042
    Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 29, 2012
    Inventors: Yuta KIMURA, Yasushi INOUE, Takeshi MATSUMURA
  • Publication number: 20120295416
    Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 22, 2012
    Inventors: Yuta KIMURA, Yasushi INOUE, Takeshi MATSUMURA