Abstract: A disposable undergarment includes a liquid-impervious base sheet and a liquid-absorbent structure lying on a wearer's skin side surface of the base sheet. The base sheet includes a breathable but liquid-impervious plastic film and a fibrous nonwoven fabric joined to the plastic film to define an undergarment side surface, the base sheet having a total luminous transmittance in a range between 60 and 85%.

Abstract: A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe—based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

Abstract: A cylinder block for a multi-cylinder engine is provided with a water jacket partly on an intake side of a row of cylinders and partly on an exhaust side of the row of cylinders and a water guide passage through which cooling water is introduced into the water jacket. The cylinder block is provided with oil return passages each of which extends straight from top to bottom of the cylinder block between each adjacent cylinders. A branch oil return passage branches off from a middle portion of the rearmost oil return passage and extends rearward up.

Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

Abstract: The present invention provides a switching circuit and an electronic switching component having a switching semiconductor device to perform switching between a conducting state and a non-conducting state of a conducting path to thereby reduce the power loss thereof and a control method thereof. In the present invention, at least two FETs 11 and 12, wherein the FET 11 has a faster switching time and the FET 12 has a lower ON resistance. Active terminals (drains and sources) of the FETs 11 and 12 are connected to each other in parallel. By employing these FETs 11 and 12, the conversion between an ON-state and an OFF-state of the conducting path is performed. In converting from the non-conducting state to the conducting state, the control circuit 13 first turns on the FET 11 and then turns on the FET 12 when if a voltage between terminals of the FET 11 reaches around a saturation value thereof.

Abstract: A disposable diaper includes a front waist region, a rear waist region, and a crotch region extending therebetween, and an end portion of the rear waist region is provided with an elastic member associated with a waist-opening and having transversely opposite side edges and upper and lower edges. A plurality of slits extending through the diaper in its thickness direction and extending in a longitudinal direction are arranged to be spaced one from another by a predetermined dimension in a waist-surrounding direction between the side edges and spaced one from another by a predetermined dimension in the longitudinal direction between the vicinity of the upper edge and the vicinity of the lower edge.

Abstract: A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.

Abstract: A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.

Abstract: A multilayer wiring substrate which can be produced by a simple method and has a high connection reliability is disclosed.

Abstract: Disposable training pants includes a liquid-permeable topsheet layer, a liquid-impermeable backsheet layer and a liquid-absorbent core disposed therebetween. The topsheet layer is formed in a transverse middle thereof overlying at least a crotch region of the pants with a liquid-impermeable zone having a hydrophobicity higher than the laterally adjacent zones.

Abstract: A pants-type disposable diaper includes a pants-type outer cover and an absorbent pad attached on an inner surface of the outer cover, the outer cover having first elastic members which circumferentially extend in the vicinity of a waist-opening of the outer cover and second elastic members which circumferentially extend in the vicinity of the uppermost points of a pair of leg-opening of the outer cover, the pad having an elongate pad body provided with a pair of barrier cuffs, the barrier cuffs having third elastic member at distal edges of the barrier cuff and fourth elastic members between the distal edges and proximal edges of the barrier cuffs, the fourth elastic member intersecting the second elastic members in front and rear waist regions of the outer cover.

Abstract: The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other.

Abstract: A disposable diaper includes a cover member presenting an hourglass-shape and a separate liquid-absorbent member composed of a liquid-permeable topsheet, a liquid-impermeable backsheet and a liquid-absorbent core. The cover member has an elastic stretchability along the upper end of front or rear waist region and these front and rear waist regions are connected or connectable along transversely opposite side edges thereof. The liquid-absorbent member includes first and second elastically stretchable members circumferentially extending across portions of the front and rear trunk regions lying immediately above the crotch region. Longitudinally opposite ends of these elastically stretchable members are bonded to the transversely opposite side edges of the cover member.

Abstract: A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.

Abstract: An electrically operated flow control valve 100 comprises a can 160 fixed to the upper portion of a valve body 110. A rotor member 130 is equipped inside a can 160, and a stator member not shown in the drawing is equipped to the exterior of the can 160. The can is formed by press-working a metal plate, and a flange portion 164 is formed to the opening. The can 160 is welded onto the valve body 110, and a box nut 180 is used to firmly fix the can to the body, thereby improving the pressure resistibility of the valve.

Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

Abstract: Training pants having a front region, a rear region and a crotch region therebetween includes a liquid-permeable topsheet, a liquid-impermeable backsheet and an absorbent core disposed therebetween, and the topsheet has a liquid-permeability lower in a transversely middle zone of the crotch region than in transversely opposite side zones, and thereby the pants can give a wearer a feeling of wetness even if the pants have slipped down.

Abstract: A disposable pull-on garment is provided along at least one of front and rear regions an auxiliary flap. The auxiliary flap is elastic circumferentially of the garment and has its circumferentially opposite side edges unitized with the waist region along transversely opposite side edges of this waist region.

Abstract: A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe-based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

Abstract: The present invention relates to a multilayer wiring substrate for mounting a semiconductor chip, etc. The multilayer wiring substrate is comprised of a plurality of double-sided circuit substrates, each comprised of an organic high molecular weight insulating layer and wiring conductor. An adhesive is used for laminating the double-sided circuit substrates. A Ni--Fe based alloy foil or a titanium foil is embedded within the organic high molecular weight insulating layer.