Patents by Inventor Yasushi Nakayama

Yasushi Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110204929
    Abstract: In order to obtain a drive circuit of a power semiconductor device capable of making a fast response to a voltage fluctuation dV/dt and preventing a malfunction of the power semiconductor device while suppressing power consumption with a simple circuit configuration, a control circuit controlling ON and OFF switching of the power semiconductor device, a DC power supply supplying a voltage between control terminals of the power semiconductor device, and a switching element connected between the control terminals of the power semiconductor device are provided. The switching element turns ON in a case where a power supply voltage of the DC power supply drops or in a case where the voltage between the control terminals of the power supply device increases in a state where the power supply voltage of the DC power supply has dropped, and thereby causes a short-circuit between the control terminals of the power semiconductor device.
    Type: Application
    Filed: July 22, 2009
    Publication date: August 25, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasushi Nakayama, Ryosuke Nakagawa
  • Publication number: 20110187003
    Abstract: A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.
    Type: Application
    Filed: April 14, 2011
    Publication date: August 4, 2011
    Inventors: Takeshi Oi, Seiji Oka, Yoshiko Obiraki, Osamu Usui, Yasushi Nakayama
  • Publication number: 20110082325
    Abstract: The invention provides transition metal complex compounds, high-activity olefin oligomerization catalysts containing the compounds, and olefin oligomerization processes using the catalysts. A transition metal complex compound [A] according to the invention is represented by Formula (I) or Formula (I?) below. An olefin oligomerization catalyst includes the transition metal complex compound [A]. In an olefin oligomerization process of the invention, an olefin is oligomerized in the presence of the catalyst.
    Type: Application
    Filed: June 27, 2008
    Publication date: April 7, 2011
    Inventors: Yasuhiko Suzuki, Shinsuke Kinoshita, Atsushi Shibahara, Naritoshi Yoshimura, Isao Hara, Tetsuya Hamada, Kazumori Kawamura, Kou Tsurugi, Yasunori Saito, Seiichi Ishii, Yasushi Nakayama, Naoto Matsukawa, Susumu Murata
  • Patent number: 7881086
    Abstract: A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: February 1, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasushi Nakayama, Takeshi Oi, Kazuyoshi Toya, Akihiro Murahashi
  • Patent number: 7875350
    Abstract: Ethylene polymer particles having an intrinsic viscosity [?] of 5 dl/g to 30 dl/g, a degree of crystallinity of as high as 80% or more, and a specific shape on the surface of the particles. The ethylene polymer particles can be obtained by carrying out polymerization of olefins including ethylene using an olefin polymerization catalyst containing a solid titanium catalyst component including magnesium, halogen and titanium under specific conditions. The ethylene polymer particles obtained by a solid phase method, such as solid phase drawing molding, are capable of providing a molded article with high strength.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: January 25, 2011
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Tetsuhiro Matsumoto, Tetsunori Shinozaki, Yasushi Nakayama, Kunihiko Mizumoto, Satoshi Akiyama, Toshiyuki Tsutsui
  • Publication number: 20100117219
    Abstract: A power semiconductor device in which transfer molding resin seals: a metallic circuit substrate; a power semiconductor element joined to a wiring pattern; and a side surface of a cylindrical external terminal communication section provided on the wiring pattern and to which an external terminal can be inserted and connected. The cylindrical external terminal communication section is substantially perpendicular to a surface on which the wiring pattern is formed. An outer surface of a metal plate of the metallic circuit substrate and a top portion of the cylindrical external terminal communication section are exposed from the transfer molding resin. The transfer molding resin is not present within the cylindrical external terminal communication section.
    Type: Application
    Filed: January 18, 2008
    Publication date: May 13, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Seiji Oka, Osamu Usui, Yasushi Nakayama, Yoshiko Obiraki, Takeshi Oi
  • Publication number: 20100013085
    Abstract: A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.
    Type: Application
    Filed: July 16, 2009
    Publication date: January 21, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Oi, Seiji Oka, Yoshiko Obiraki, Osamu Usui, Yasushi Nakayama
  • Publication number: 20100013086
    Abstract: A power semiconductor device with improved productivity, reduced size and reduction of amounting area therefore is provided. In the provided power semiconductor device, an external terminal does not limit an increase in current. The power semiconductor device is sealed with transfer molding resin. In the power semiconductor device, a cylindrical external terminal communication section is arranged on a wiring pattern so as to be substantially perpendicular to the wiring pattern. An external terminal can be inserted and connected to the cylindrical external terminal communication section. The cylindrical external terminal communication section allows the inserted external terminal to be electrically connected to the wiring pattern. A taper is formed at, at least, one end of the cylindrical external terminal communication section, which one end is joined to the wiring pattern.
    Type: Application
    Filed: July 16, 2009
    Publication date: January 21, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshiko OBIRAKI, Seiji Oka, Osamu Usui, Yasushi Nakayama, Takeshi Oi
  • Patent number: 7601423
    Abstract: Ethylene-based copolymer microparticles and functional group-containing ethylene-based copolymer microparticles that have particle diameter smaller than that of conventional polyethylene fine-particles, no inter-particle agglomeration, very narrow particle size distribution, and high sphericity are provided, in which requirements (A) to (E): (A) The intrinsic viscosity [?] measured in decalin at 135° C. is in the range of 0.1 to 50 dl/g, (B) at least 95 wt % or more of particles pass through a mesh screen with an opening of 37 ?m, (C) the median diameter (d50) measured by laser diffraction scattering is 3 ?m?d50?25 ?m, (D) the circularity coefficient is 0.85 or more, and (E) the variation coefficient of particle diameter (Cv) is 20% or less. Non-agglomerated spherical magnesium-containing microparticles used as magnesium-containing carrier component for olefin-polymerization catalysts that can manufacture the above microparticles are also provided.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: October 13, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasushi Nakayama, Naoto Matsukawa, Junji Saito, Hideki Bando, Yoshiho Sonobe, Kenji Michiue, Makoto Mitani, Terunori Fujita
  • Publication number: 20090219696
    Abstract: A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.
    Type: Application
    Filed: March 8, 2007
    Publication date: September 3, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasushi Nakayama, Takeshi Oi, Kazuyoshi Toya, Akihiro Murahashi
  • Patent number: 7528091
    Abstract: Solid fine particles which contain a magnesium atom, an aluminum atom and a C1-20 alkoxy group simultaneously, are insoluble in a hydrocarbon solvent, and have an average particle diameter of 3 to 80 ?m, and an olefin polymerization catalyst containing the solid fine particles and a transition metal compound in the groups 3 to 11 in the periodic table, exhibit a very high olefin polymerization activity without combination with an expensive organoaluminum oxy compound or organoboron compound and maintains a high activity in polymerization for a long time, and an olefin polymer excellent in powdery properties can be produced by using the olefin polymerization catalyst. The transition metal compound in the groups 3 to 11 in the periodic table includes a transition metal compound having a ligand containing two or more atoms selected from a boron atom, a nitrogen atom, an oxygen atom, a phosphorus atom and a sulfur atom.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: May 5, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasushi Nakayama, Hideki Bando, Yoshiho Sonobe, Makoto Mitani, Terunori Fujita
  • Publication number: 20090098381
    Abstract: To provide capsular fine particles comprising an olefinic polymer which have a uniform particle size distribution and a uniform particle size, and which are spherical and free from the coagulation between particles. Capsular fine particles comprising the olefinic polymer, of which the ratio (L/M) of the outer diameter (L) to the inner diameter (M) is 1.1 to 6.0, and the average diameter is 0.6 to 40 ?m.
    Type: Application
    Filed: April 7, 2006
    Publication date: April 16, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Yasushi Nakayama, Naoto Matsukawa, Junji Saito, Susumu Murata, Makoto Mitani, Terunori Fujita
  • Publication number: 20090080155
    Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.
    Type: Application
    Filed: March 31, 2006
    Publication date: March 26, 2009
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
  • Publication number: 20090065182
    Abstract: There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.
    Type: Application
    Filed: March 31, 2006
    Publication date: March 12, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
  • Publication number: 20080090081
    Abstract: The present invention provides ethylene polymer particles obtained by a solid phase method such as solid phase drawing molding and capable of providing a molded article with high strength. The ethylene polymer particles have an intrinsic viscosity [?] of 5 dl/g to 30 dl/g, a degree of crystallinity of as high as 80% or more, and a specific shape on the surface of the particles. The ethylene polymer particles can be obtained, for example, by carrying out polymerization of olefins including ethylene using an olefin polymerization catalyst containing a solid titanium catalyst component including magnesium, halogen and titanium under specific conditions.
    Type: Application
    Filed: July 25, 2007
    Publication date: April 17, 2008
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Tetsuhiro Matsumoto, Tetsunori Shinozaki, Yasushi Nakayama, Kunihiko Mizumoto, Satoshi Akiyama, Toshiyuki Tsutsui
  • Publication number: 20080044655
    Abstract: Ethylene-based copolymer microparticles and functional group-containing ethylene-based copolymer microparticles that have particle diameter smaller than that of conventional polyethylene fine-particles, no inter-particle agglomeration, very narrow particle size distribution, and high sphericity are provided, in which requirements (A) to (E): (A) The intrinsic viscosity [?] measured in decalin at 135° C. is in the range of 0.1 to 50 dl/g, (B) at least 95 wt % or more of particles pass through a mesh screen with an opening of 37 ?m, (C) the median diameter (d50) measured by laser diffraction scattering is 3 ?m?d50?25 ?m, (D) the circularity coefficient is 0.85 or more, and (E) the variation coefficient of particle diameter (Cv) is 20% or less. Non-agglomerated spherical magnesium-containing microparticles used as magnesium-containing carrier component for olefin-polymerization catalysts that can manufacture the above microparticles are also provided.
    Type: Application
    Filed: November 18, 2005
    Publication date: February 21, 2008
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Yasushi Nakayama, Naoto Matsukawa, Junji Saito, Hideki Bando, Yoshiho Sonobe, Kenji Michiue, Makoto Mitani, Terunori Fujita
  • Publication number: 20080015401
    Abstract: Solid fine particles which contain a magnesium atom, an aluminum atom and a C1-20 alkoxy group simultaneously, are insoluble in a hydrocarbon solvent, and have an average particle diameter of 3 to 80 ?m, and an olefin polymerization catalyst containing the solid fine particles and a transition metal compound in the groups 3 to 11 in the periodic table, exhibit a very high olefin polymerization activity without combination with an expensive organoaluminum oxy compound or organoboron compound and maintains a high activity in polymerization for a long time, and an olefin polymer excellent in powdery properties can be produced by using the olefin polymerization catalyst. The transition metal compound in the groups 3 to 11 in the periodic table includes a transition metal compound having a ligand containing two or more atoms selected from a boron atom, a nitrogen atom, an oxygen atom, a phosphorus atom and a sulfur atom.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 17, 2008
    Inventors: Yasushi Nakayama, Hideki Bando, Yoshiho Sonobe, Makoto Mitani, Terunori Fujita
  • Patent number: 7253132
    Abstract: Solid fine particles which contain a magnesium atom, an aluminum atom and a C1-20 alkoxy group simultaneously, are insoluble in a hydrocarbon solvent, and have an average particle diameter of 3 to 80 ?m, and an olefin polymerization catalyst containing the solid fine particles and a transition metal compound in the groups 3 to 11 in the periodic table, exhibit a very high olefin polymerization activity without combination with an expensive organoaluminum oxy compound or organoboron compound and maintains a high activity in polymerization for a long time, and an olefin polymer excellent in powdery properties can be produced by using the olefin polymerization catalyst. The transition metal compound in the groups 3 to 11 in the periodic table includes a transition metal compound having a ligand containing two or more atoms selected from a boron atom, a nitrogen atom, an oxygen atom, a phosphorus atom and a sulfur atom.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: August 7, 2007
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasushi Nakayama, Hideki Bando, Yoshiho Sonobe, Makoto Mitani, Terunori Fujita
  • Patent number: 7208559
    Abstract: An ethylene-based polymer which is an ethylene/C4 to C10 ?-olefin copolymer and satisfies the following requirements [k1] to [k3]: [k1] melt flow rate (MFR) under a loading of 2.16 kg at 190° C. is in the range of 1.0 to 50 g/10 minutes; [k2] LNR defined as a scale of neck-in upon film molding is in the range of 0.6 to 1.4; and [k3] take-up speed at break [DS (m/min)] at 160° C. and melt flow rate (MFR) satisfy the following relationship (Eq-1): 12×MFR0.577?DS?165×MFR0.577 (Eq-1), and a thermoplastic resin composition containing the ethylene-based polymer, provide a molded product, preferably a film, excellent in moldability and mechanical strength.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: April 24, 2007
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasuo Satoh, Mamoru Takahashi, Hideki Bando, Yoshiho Sonobe, Yasushi Nakayama
  • Patent number: 7117253
    Abstract: An information management system records in a server contents that need not be updated for a fixed time-period. The system accesses desired contents in a local device or the server storing the contents. A request for information is made from an information browsing unit to a local request relaying unit which receives the request and analyzes the request contents. The local request relaying unit acquires a server-side control file managed by the server to which the request is directed and also acquires a local-side control file from a duplicate information storing unit. Confirmation is made as to whether the latest version of the requested information exists in the duplicate information storing unit. If the latest version of the requested information exists in the duplicate information storing unit, the requested information is fetched from the duplicate information storing unit; otherwise the information is fetched from the server computer.
    Type: Grant
    Filed: November 5, 2002
    Date of Patent: October 3, 2006
    Assignee: Fujitsu Limited
    Inventors: Yasushi Nakayama, Mitsuru Osawa