Abstract: A flash-erasable semiconductor memory device has a memory cell array including a plurality of memory cell transistors each having an insulated floating gate for storing information and a control electrode provided on the floating gate, wherein the flash-erasable semiconductor memory device includes a write control circuit supplied with a write control signal, when writing information. The write control circuit produces a control signal such that a leading edge of the drain control signal appears after a leading edge of the gate control signal. Further, the gate control circuit shuts off the gate control signal such that a trailing edge of the gate control signal appears after a trailing edge of the drain control signal.

Abstract: A flash-erasable semiconductor memory device comprises a memory cell array including a plurality of memory cell transistors each having an insulated floating gate for storing information and a control electrode provided on said floating gate, wherein the flash-erasable semiconductor memory device includes a write control circuit supplied with a write control signal, when writing information. The write control circuit produces a control signal such that a leading edge of the drain control signal appears after a leading edge of the gate control signal. Further, the gate control circuit shuts off the gate control signal such that a trailing edge of the gate control signal appears after a trailing edge of the drain control signal.

Abstract: A flash memory performs channel erasing or source erasing by applying a negative voltage to a control gate. The device includes a voltage restriction device which restricts the negative voltage to be applied to the control gate so that the negative voltage will be a constant value relative to the voltage of the channel or source. Alternatively, two voltage restricting devices restrict the negative voltage applied to the control gate and the voltage to be applied to the source so that the voltages will be a constant value relative to a common reference voltage.

Abstract: A flash-erasable semiconductor memory device comprises a memory cell array including a plurality of memory cell transistors each having an insulated floating gate for storing information and a control electrode provided on said floating gate, wherein the flash-erasable semiconductor memory device includes a write control circuit supplied with a write control signal, when writing information. The write control circuit produces a control signal such that a leading edge of the drain control signal appears after a leading edge of the gate control signal. Further, the gate control circuit shuts off the gate control signal such that a trailing edge of the gate control signal appears after a trailing edge of the drain control signal.

Abstract: A negative-voltage circuit for realizing a flash memory is installed independently and is applied selectively to word lines in response to signals sent from row decoders. Row decoders for specifying word lines need not be installed in the negative voltage circuit. The negative circuit can therefore be reduced in scale.

Abstract: The present invention relates to improvements in erasing a flash memory. An object of the present invention is to shorten the erasing time. During pre-erase writing, at least either word lines or bit lines are selected in units of multiple lines at a time, and data are written in multiple selective transistors simultaneously.

Abstract: The present invention relates to improvements in erasing a flash memory. An object of the present invention is to shorten the erasing time. During pre-erase writing, at least either word lines or bit lines are selected in units of multiple lines at a time, and data are written in multiple selective transistors simultaneously.

Abstract: A nonvolatile semiconductor memory employs sense amplifiers, circuits for providing stabilized source voltages, and circuits for realizing high-speed and reliable read and write operations. The semiconductor memory has a matrix of nonvolatile erasable memory cell transistors.

Abstract: An exclusive OR circuit includes a first series circuit in which a source of a first pMIS transistor is connected to a positive-voltage power supply line. A drain of the first pMIS transistor is connected to a drain of a first nMIS transistor via a second nMIS transistor. The source of the first nMIS transistor is connected to a low-voltage power supply line via a fourth nMIS transistor. A second series circuit has a drain of a third nMIS transistor connected to a high-voltage power supply line via a second pMIS transistor. The source of the third nMIS transistor is connected to the source of a third pMIS transistor. The drain of the third pMIS transistor is connected to the low-voltage power supply line via a fourth pMIS transistor. The gates of the first and third nMIS transistors and the first and third pMIS transistors are connected to one another and provided with a first input.

Abstract: A semiconductor memory having address buffer means, memory cell means, word line selection means, bit line selection means, an output buffer, first address generation means connected to the address buffer means, for providing and address for specifying a group of data pieces, and second address generation means for providing addresses for specifying the data pieces, respectively, the semiconductor memory comprising first reading means for selecting and reading a group of data pieces through one of the word line selection means and bit line selection means according to an address provided by the first address generation means, second reading means for selecting the data pieces, which have been selected and read according to the address provided by the first address generation means, through one of the bit line selection means and word line selection means according addresses provided by the second address generation means and providing them to the output buffer; and pre-reading means for reading another group

Abstract: A semiconductor memory has a plurality of word lines, a plurality of bit lines, a plurality of memory cells, a differential sense amplifier, and load transistors. Each of the memory cells is a MIS transistor formed at each intersection of the word and bit lines. The threshold voltage of the MIS transistor is externally electrically controllable. The differential sense amplifier senses data stored in a selected memory cell located at an intersection of selected word and bit lines. A control pulse signal is applied to the gates of the load transistors, to bias the bit lines. The pulse width of the control pulse signal is a minimum essential to read data out of the selected memory cell. The control pulse signal controls the switching of the load transistors, to shorten a period during which a stress voltage is continuously applied to the drains of unselected memory cells that are connected to the bit line to which the selected memory cell is connected.

Abstract: A nonvolatile semiconductor memory employs sense amplifiers, circuits for providing stabilized source voltages, and circuits for realizing high-speed and reliable read and write operations. The semiconductor memory has a matrix of nonvolatile erasable memory cell transistors.

Abstract: A nonvolatile semiconductor memory employs sense amplifiers, circuits for providing stabilized source voltages, and circuits for realizing high-speed and reliable read and write operations. The semiconductor memory has a matrix of nonvolatile erasable memory cell transistors.