Abstract: The disclosure relates to an aerial transportation vehicle including a vehicle frame.

Abstract: Provided herein are methods for the clinical treatment of tumors (e.g., advanced solid tumors) in patients having certain levels of serum IL-8 using an anti-IL-8 antibody in combination with an anti-PD-1 antibody.

Abstract: An image segmentation method, apparatus, and a storage medium are provided. The method includes: selecting a current image frame in a video according to a time sequence of the video; determining a reference image frame before the current image frame in the time sequence; obtaining first location information of a target object key point in the reference image frame; performing an affine transformation on the current image frame with reference to an affine transformation relationship between the first location information and a target object key point template to obtain a target object diagram; performing a key point detection on the target object diagram to obtain second location information of the target object key point; segmenting a target object from the target object diagram to obtain segmentation information; and obtaining the target object from the current image frame according to the segmentation information and the second location information.

Abstract: The disclosure relates to a lifting vehicle frame and an aerial transportation vehicle. The aerial transportation vehicle includes a lifting vehicle frame, which includes an upper vehicle frame (1), a lower vehicle frame (2), a lifting assembly (a) and a locking device (b), wherein the upper vehicle frame (1) and the lower vehicle frame (2) are connected through the lifting assembly (a); at least two lifting assemblies (a) are provided opposite to each other in a first direction; the lower vehicle frame (2) and the upper vehicle frame (1) can move close to or apart from each other by operating the at least two lifting assemblies (a); the locking device (b) is disposed on the lower vehicle frame (2); when the lower vehicle frame (2) and the upper vehicle frame (1) move close to each other, the lower vehicle frame (2) and the upper vehicle frame (1) are locked together by operating the locking device (b).

Abstract: Computer-implemented methods of optimizing a process simulation model that predicts a result of a semiconductor device fabrication operation to process parameter values characterizing the semiconductor device fabrication operation are disclosed. The methods involve generating cost values using a computationally predicted result of the semiconductor device fabrication operation and a metrology result produced, at least in part, by performing the semiconductor device fabrication operation in a reaction chamber operating under a set of fixed process parameter values. The determination of the parameters of the process simulation model may employ pre-process profiles, via optimization of the resultant post-process profiles of the parameters against profile metrology results. Cost values for, e.g., optical scatterometry, scanning electron microscopy and transmission electron microscopy may be used to guide optimization.

Abstract: An image processing method, apparatus, and device, and a storage medium are provided. The method is performed by a computing device, and includes: determining a first image feature of a first size of an input image, the first image feature having at least two channels; performing weight adjustment on each channel in the first image feature by using a first weight adjustment parameter, to obtain an adjusted first image feature, the first weight adjustment parameter including at least two parameter components, and each parameter component being used for adjusting a pixel of a channel corresponding to each parameter component; downsampling the adjusted first image feature to obtain a second image feature having a second size; combining the first image feature and the second image feature to obtain a combined image feature; and determining an image processing result according to the combined image feature.

Abstract: An implantable medical device having a package, including: a device body, and a package configured for packaging the device body. The package includes at least one organic film layer and at least one inorganic film layer that are stacked on one another. An innermost layer of the package is an organic film layer or an inorganic film layer, and an outermost layer of the package is an organic film layer or an inorganic film layer. Each organic film layer is a parylene film or polyimide resin film with biocompatibility, and each inorganic film layer is an inorganic film with biocompatibility. A method for packaging an implantable medical device is also provided.

Abstract: A hair perming device and its temperature control circuit are disclosed. The temperature control circuit for a hair perming device is electrically connected with a heater of the hair penning device and comprises a main control module and a trigger module. The main control module controls the trigger module to be switched on such that a control signal outputted by the main control module can be sent to the heater for heating, and meanwhile for detects a working state of the trigger module. When a failure of the trigger module is detected, the main control module controls the trigger module to be switched off such that a continuous heating of the heater is stopped. When a failure of the trigger module is detected, the electrical power supply path of the heater is disconnected, and a continuous heating of the heater is stopped for avoiding excessive high temperature.

Abstract: Provided herein are methods for the clinical treatment of tumors (e.g., advanced solid tumors) in patients having certain levels of serum IL-8 using an anti-IL-8 antibody in combination with an anti-PD-1 antibody.

Abstract: A large beam spot spectral reflectometer system for measuring a substrate is provided. Hardware components for collecting in situ large beam spot optical signals is disclosed. Machine learning models for denoising large beam spot optical signals are disclosed. Machine learning models for interpreting in situ optical data and facilitating process control are also disclosed.

Abstract: The disclosure relates to an aerial transportation vehicle including a vehicle frame.

Abstract: The disclosure relates to a lifting vehicle frame and an aerial transportation vehicle. The aerial transportation vehicle includes a lifting vehicle frame, which includes an upper vehicle frame (1), a lower vehicle frame (2), a lifting assembly (a) and a locking device (b), wherein the upper vehicle frame (1) and the lower vehicle frame (2) are connected through the lifting assembly (a); at least two lifting assemblies (a) are provided opposite to each other in a first direction; the lower vehicle frame (2) and the upper vehicle frame (1) can move close to or apart from each other by operating the at least two lifting assemblies (a); the locking device (b) is disposed on the lower vehicle frame (2); when the lower vehicle frame (2) and the upper vehicle frame (1) move close to each other, the lower vehicle frame (2) and the upper vehicle frame (1) are locked together by operating the locking device (b).

Abstract: In some examples, a wafer bow measurement system comprises a measurement unit including: a wafer support assembly to impart rotational movement to a measured wafer supported in the measurement unit, an optical sensor, a calibration standard to calibrate the optical sensor; a linear stage actuator to impart linear direction of movement to the optical sensor; a wafer centering sensor to determine a centering of the measured wafer supported in the measurement unit; and a wafer alignment sensor to determine an alignment of the measured wafer supported in the measurement unit.

Abstract: A hair straightener and its integrated switch for control and display are disclosed. The hair straightener comprises first and second clamping plate parts and the integrated switch for control and display arranged on an inner side of the second clamping plate part. The integrated switch for control and display comprises a temperature control knob assembly for regulating and controlling temperature, a display button assembly for displaying the temperature and turning on or off a power supply, and a control motherboard for digital display and electrical control. The temperature control knob assembly and the display button assembly are installed on the control motherboard. The temperature display, control and regulation functions, and the power supply switching on and off functions are centralized on the same switch key, such that the temperature can be controlled and regulated conveniently when operated by one hand and the visual information can be obtained without obstacles.

Abstract: The disclosure provides a three-dimensional (3D) image classification method and apparatus, a device, and a storage medium. The method includes: obtaining a 3D image, the 3D image including first-dimensional image information, second-dimensional image information, and third-dimensional image information; extracting a first image feature corresponding to planar image information from the 3D image; extracting a second image feature corresponding to the third-dimensional image information from the 3D image; fusing the first image feature and the second image feature, to obtain a fused image feature corresponding to the 3D image; and determining a classification result corresponding to the 3D image according to the fused image feature corresponding to the 3D image.

Abstract: An image processing method, apparatus, and device, and a storage medium are provided. The method is performed by a computing device, and includes: determining a first image feature of a first size of an input image, the first image feature having at least two channels; performing weight adjustment on each channel in the first image feature by using a first weight adjustment parameter, to obtain an adjusted first image feature, the first weight adjustment parameter including at least two parameter components, and each parameter component being used for adjusting a pixel of a channel corresponding to each parameter component; downsampling the adjusted first image feature to obtain a second image feature having a second size; combining the first image feature and the second image feature to obtain a combined image feature; and determining an image processing result according to the combined image feature.

Abstract: Computer-implemented methods of optimizing a process simulation model that predicts a result of a semiconductor device fabrication operation to process parameter values characterizing the semiconductor device fabrication operation are disclosed. The methods involve generating cost values using a computationally predicted result of the semiconductor device fabrication operation and a metrology result produced, at least in part, by performing the semiconductor device fabrication operation in a reaction chamber operating under a set of fixed process parameter values. The determination of the parameters of the process simulation model may employ pre-process profiles, via optimization of the resultant post-process profiles of the parameters against profile metrology results. Cost values for, e.g., optical scatterometry, scanning electron microscopy and transmission electron microscopy may be used to guide optimization.

Abstract: An image segmentation method, apparatus, and a storage medium are provided. The method includes: selecting a current image frame in a video according to a time sequence of the video; determining a reference image frame before the current image frame in the time sequence; obtaining first location information of a target object key point in the reference image frame; performing an affine transformation on the current image frame with reference to an affine transformation relationship between the first location information and a target object key point template to obtain a target object diagram; performing a key point detection on the target object diagram to obtain second location information of the target object key point; segmenting a target object from the target object diagram to obtain segmentation information; and obtaining the target object from the current image frame according to the segmentation information and the second location information.

Abstract: Computer-implemented methods of optimizing a process simulation model that predicts a result of a semiconductor device fabrication operation to process parameter values characterizing the semiconductor device fabrication operation are disclosed. The methods involve generating cost values using a computationally predicted result of the semiconductor device fabrication operation and a metrology result produced, at least in part, by performing the semiconductor device fabrication operation in a reaction chamber operating under a set of fixed process parameter values. The determination of the parameters of the process simulation model may employ pre-process profiles, via optimization of the resultant post-process profiles of the parameters against profile metrology results. Cost values for, e.g., optical scatterometry, scanning electron microscopy and transmission electron microscopy may be used to guide optimization.

Abstract: A metrology system for substrate processing includes an optical metrology station including a plurality of optical sensors to measure spectra from a plurality of measurement locations on a substrate. A plurality of fiber cables are connected to the plurality of optical sensors. A spectrometer is selectively connected to the plurality of fiber cables. A mass metrology station measures at least one of a mass or mass change of the substrate. A controller includes a modelling module to generate thickness values at the plurality of measurement locations based on the spectra from the plurality of measurement locations and a learned model. A spatial modelling module generates a spatial thickness distribution model for the substrate based on the thickness values at the plurality of measurement locations from the modelling module and the at least one of the mass or the mass change from the mass metrology station.