Abstract: A method for forming a semiconductor structure includes: providing a semiconductor substrate, the surface of the semiconductor substrate having a plurality of active areas and shallow trench isolation areas arranged in a first direction; etching the active areas and the shallow trench isolation areas in a direction perpendicular to the first direction to form first recesses and second recesses; covering the surfaces of the first recesses and the second recesses with an adhesive layer and a metal layer; and secondarily etching the metal layer and the adhesive layer in the direction perpendicular to the first direction to form a contact hole, the depth of the adhesive layer in the contact hole being defined as H2.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: Embodiments of the present application provide a semiconductor structure and its fabricating method, and a semiconductor memory. The method of fabricating a semiconductor structure comprises providing a substrate and performing ion implantation on the substrate to form an active area, forming a gate groove on surface of the substrate, measuring depth of the gate groove, and performing ion implantation compensation, if the depth of the gate groove meets a preset condition, on the substrate according to the depth of the gate groove, and forming an ion compensation region in the active area at one side of the gate groove.

Abstract: An image data association method, system, apparatus, and related computer program product are provided.

Abstract: A method for manufacturing a semiconductor structure and the semiconductor structure are provided. The method for manufacturing a semiconductor structure includes: providing an activated region; forming an initial gate located on the activated region; forming a first mask layer on a top surface of the initial gate, in which a first opening penetrating the first mask layer is provided in the first mask layer, and the first opening at least has opposite two sides extending along a first direction; forming sidewall layers located at least on sidewalls of both sides of the first opening extending in the first direction; removing the first mask layer; patterning the initial gate with the sidewall layers on both sides of the first opening as a mask to form gates.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: The present invention relates to a hinge system of an electric door comprising a control module, an intelligent automatic recognition system for installing in a door or a door frame and including a recognition device and a sensing module, and a hinge assembly. The hinge assembly comprises a pivot housing, a power unit disposed in the pivot housing and electrically connected to the control module, a first hinge member having a first knuckle for sleeving on the pivot housing and a second hinge member connected to two ends of the pivot housing. The power unit comprises a motor assembly having a motor axis, a reduction gearbox having one end connected to the motor axis, a gear shaft and plural planetary gears, and a gear connected to the gear shaft of the reduction gearbox.

Abstract: A method for forming a semiconductor structure includes: providing a semiconductor substrate, the surface of the semiconductor substrate having a plurality of active areas and shallow trench isolation areas arranged in a first direction; etching the active areas and the shallow trench isolation areas in a direction perpendicular to the first direction to form first recesses and second recesses; covering the surfaces of the first recesses and the second recesses with an adhesive layer and a metal layer; and secondarily etching the metal layer and the adhesive layer in the direction perpendicular to the first direction to form a contact hole, the depth of the adhesive layer in the contact hole being defined as H2.

Abstract: The present application relates to the technical field of semiconductor manufacturing, in particular to a method for forming a film layer with uniform thickness distribution and a semiconductor structure. The method for forming a film layer with uniform thickness distribution comprises: providing a substrate, a non-flat surface for forming a film layer being provided in the substrate; forming a first sub-layer on the non-flat surface at a first temperature by an in-situ steam generation process; and, forming a second sub-layer on a surface of the first sub-layer at a second temperature by an in-situ steam generation process, the film layer at least comprising the first sub-layer and the second sub-layer, the second temperature being higher than the first temperature.

Abstract: A debt repayment system and a debt management method are provided. In the method, a transaction via a purchase carrier is received, and a purchase amount is obtained. A repayment plan including first and second stages is determined according to a total debt and the purchase amount and transmitted as a smart contract to a blockchain network. A first repayment in the repayment plan of the first stage relates to interest repayment without principal for the total debt, and a second repayment in the repayment plan of the second stage relates to interest repayment with principal for the total debt. A repayment transferred from a repay account is determined according to a debt ratio of credit bank. A risk coefficient corresponding to the current transaction is determined, and a candidate verification is selected according to the risk coefficient. The current transaction is accepted in response to passing the candidate verification.

Abstract: Disclosed are a semiconductor device and a manufacturing method thereof. The method includes: providing a semiconductor substrate; forming a first wordline trench structure; forming a first sacrificial layer at the bottom of the first wordline trench structure; filling the first wordline trench structure located in active regions by epitaxial growth; forming a first insulation layer covering the top of the semiconductor substrate and the first wordline trench structure; forming a second wordline trench structure and a fin-type structure in the active regions, a depth of the second wordline trench structure being less than that of the first wordline trench structure, and a projection of the second wordline trench structure in a vertical direction completely overlapping with a projection of the first sacrificial layer in the vertical direction; removing the first sacrificial layer; and filling the first wordline trench structure, the second wordline trench structure and the wordline tunnel.

Abstract: Embodiments of the present application provide a semiconductor structure and its fabricating method, and a semiconductor memory. The method of fabricating a semiconductor structure comprises providing a substrate and performing ion implantation on the substrate to form an active area, forming a gate groove on surface of the substrate, measuring depth of the gate groove, and performing ion implantation compensation, if the depth of the gate groove meets a preset condition, on the substrate according to the depth of the gate groove, and forming an ion compensation region in the active area at one side of the gate groove.

Abstract: A real estate product related finance system and a management method thereof are provided. The finance organization server obtains a loan request. The real estate platform receives a real estate request and predicts a deductible amount of the customer through a machine learning algorithm. The sale terminal receives a deal processed through a purchase certificate, where the purchase certificate relates to digital money. The real estate platform calculates a value difference between a comparing result between the predicted deductible amount and the total purchase amount and home loan interest of the customer within a liquidation period, and provides the value difference to the finance organization server, to deduct the home loan interest within the liquidation period. Accordingly, the mechanism for paying the home loan interest is changed, it is easier to manage for financial organizations, and the customer can be notified automatically.

Abstract: An electric heating cloth having gaps and a connection structure thereof are disclosed. The electric heating cloth having gaps comprises plural conductive yarns arranged in a first direction and plural textile yarns and plural metal conductive wires arranged in a second direction for interweaving with the plural conductive yarns. The plural metal conductive wires are aligned at external sides of the plural textile yarns to form a first conductive side and a second conductive side respectively, and each of the first conductive side and the second conductive side has plural gaps.

Abstract: A mobile vehicle is disclosed herein. It comprises a car body having four wheels and a chassis bracket at a bottom thereof, and at least one drive motor disposed on a front side or a rear side or both of the chassis bracket and each of which has a motor body and a rotational shaft passing through a center of the motor body for driving the four wheels to rotate through a driver assembly.

Abstract: The present invention relates to a portable motor assembly comprising a case, a control module disposed in the case, a motor wrapped up with a friction wheel for connecting to the case and controlled by the control module for rotation, a fixing base connecting to a bottom of the case and having a clamp for fixing to a seat tube of a bicycle and at least one tension spring for pulling down the fixing base and making the friction wheel surrounding the motor tightly press against a surface of a rear wheel of the bicycle to drive a rear wheel of the bicycle.

Abstract: A mobile vehicle is disclosed herein. It comprises a car body having four wheels, an engine room on a front side thereof and a luggage compartment on a rear side thereof, and at least one drive motor disposed in the engine room or the luggage compartment or both and each of which has a motor body and a rotational shaft passing through a center of the motor body for driving the four wheels to rotate through a driver assembly.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: A debt repayment system and a debt management method are provided. In the method, a transaction via a purchase carrier is received, and a purchase amount is obtained. The purchase carrier includes a physical or virtual card for pay. Repayment plans for first and second stages are determined according to a total debt and the purchase amount. A first repayment in the repayment plan of the first stage relates to interest repayment without principal for the total debt, and a second repayment in the repayment plan of the second stage relates to interest repayment with principal for the total debt. A repayment transferred from a repay account is determined according to a debt ratio of each credit bank. The repay account is used for saving the first or second repayment and a rebate of the purchase amount. Accordingly, the debt is easier to be managed.