Patents by Inventor Yeh Hsu

Yeh Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11956462
    Abstract: Video processing methods and apparatuses for coding a current block comprise receiving input data of a current block, partitioning the current block into multiple sub-blocks, deriving sub-block MVs for the current block according to a sub-block motion compensation coding tool, constraining the sub-block MVs to form constrained sub-block MVs, and encoding or decoding the current block using the constrained sub-block MVs, and applying motion compensation to the current block using the constrained sub-block MVs to encode or decode the current block. The sub-block MVs may be constrained according to a size, width, or height of the current block or a sub-block, an inter prediction direction of one of control point MVs of the current block, the current block, or current sub-block, the control point MVs, or a combination of the above.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Tzu-Der Chuang, Ching-Yeh Chen, Chen-Yen Lai, Chih-Wei Hsu
  • Patent number: 11956469
    Abstract: Video processing methods and apparatuses implemented in a video encoding or decoding system with conditional secondary transform signaling. The video encoding system determines and applies a transform operation to residuals of a transform block to generate final transform coefficients, and adaptively signals a secondary transform index according to a position of a last significant coefficient in the transform block. A value of the secondary transform index is determined according to the transform operation.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
  • Patent number: 11956421
    Abstract: Method and apparatus of video coding are disclosed. According to one method, in the decoder side, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block when the neighboring block satisfies one or more conditions. An MPM (Most Probable Mode) list is derived based on information comprising at least one of neighboring Intra modes. A current Intra mode is derived utilizing the MPM list. The current luma block is decoded according to the current Intra mode According to another method, a predefined Intra mode is assigned to a neighboring block adjacent to the current luma block if the neighboring block is coded in BDPCM (Block-based Delta Pulse Code Modulation) mode, where the predefined Intra mode is set to horizontal mode or vertical mode depending on prediction direction used by the BDPCM mode.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Patent number: 11943476
    Abstract: Video processing methods and apparatuses implemented in a video encoding or decoding system with conditional secondary transform signaling. The video encoding system determines and applies a transform operation to residuals of one or more transform blocks to generate final transform coefficients, and skip signaling a secondary transform index if a position of a last significant coefficient in each considered transform block is less than or equal to a predefined position; otherwise, the video encoding system signals a secondary transform index according to the transform operation.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 26, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
  • Patent number: 11930174
    Abstract: A method and apparatus for block partition are disclosed. If a cross-colour component prediction mode is allowed, the luma block and the chroma block are partitioned into one or more luma leaf blocks and chroma leaf blocks. If a cross-colour component prediction mode is allowed, whether to enable an LM (Linear Model) mode for a target chroma leaf block is determined based on a first split type applied to an ancestor chroma node of the target chroma leaf block and a second split type applied to a corresponding ancestor luma node. According to another method, after the luma block and the chroma block are partitioned using different partition tress, determine whether one or more exception conditions to allow an LM for a target chroma leaf block are satisfied when the chroma partition tree uses a different split type, a different partition direction, or both from the luma partition tree.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 12, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Tzu-Der Chuang, Chih-Wei Hsu, Ching-Yeh Chen, Zhi-Yi Lin
  • Publication number: 20240080490
    Abstract: A video codec receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video codec signals or parses a first syntax element for a first coding mode in a particular set of two or more coding modes. Each of coding mode of the particular set of coding modes modifies a merge candidate or an inter-prediction that is generated based on the merge candidate. The video codec enables the first coding mode and disables one or more other coding modes in the particular set of coding modes. The disabled one or more coding modes in the particular set of coding modes are disabled without parsing syntax elements for the disabled coding modes. The video codec encodes or decodes the current block by using the enabled first coding mode and bypassing the disabled coding modes.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 7, 2024
    Applicant: HFI Innovation Inc.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Ching-Yeh Chen
  • Patent number: 11924444
    Abstract: Method and apparatus for constrained de-blocking filter are disclosed. One method receives input data related to a current block in a current picture at a video encoder side or a video bitstream corresponding to compressed data including the current block in the current picture at a video decoder side, and determines a first boundary associated with the current block, wherein the first boundary corresponds to one vertical boundary or one horizontal boundary of the current block. The method then applies de-blocking process to a reconstructed current block corresponding to the current block to result in a filtered-reconstructed current block, using a plurality of first reference samples at a same side of the first boundary, and replaces a first set of the first reference samples by one or more padding values. The method then generates a filtered decoded picture including the filtered-reconstructed current block.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 5, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang
  • Patent number: 11917185
    Abstract: A method and apparatus of Inter prediction for video coding using Multi-hypothesis (MH) are disclosed. If an MH mode is used for the current block: at least one MH candidate is derived using reduced reference data by adjusting at least one coding-control setting; an Inter candidate list is generated, where the Inter candidate list comprises said at least one MH candidate; and current motion information associated with the current block is encoded using the Inter candidate list at the video encoder side or the current motion information associated with the current block is decoded at the video decoder side using the Merge candidate list. The coding control setting may correspond to prediction direction setting, filter tap setting, block size of reference block to be fetched, reference picture setting or motion limitation setting.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: February 27, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang
  • Publication number: 20230343600
    Abstract: A method for manufacturing a semiconductor structure and the semiconductor structure are provided. The method for manufacturing a semiconductor structure includes: providing an activated region; forming an initial gate located on the activated region; forming a first mask layer on a top surface of the initial gate, in which a first opening penetrating the first mask layer is provided in the first mask layer, and the first opening at least has opposite two sides extending along a first direction; forming sidewall layers located at least on sidewalls of both sides of the first opening extending in the first direction; removing the first mask layer; patterning the initial gate with the sidewall layers on both sides of the first opening as a mask to form gates.
    Type: Application
    Filed: August 2, 2022
    Publication date: October 26, 2023
    Inventors: CHENG-YEH HSU, Xiao ZHU, Xiaohong ZHANG
  • Patent number: 11716964
    Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: August 8, 2023
    Assignee: LULUPET CO., LTD.
    Inventors: James Cheng-Han Wu, Pei-Hsuan Shih, Chun-Ming Su, You-Gang Kuo, Ning-Yuan Lyu, Chi-Yeh Hsu, Liang-Hao Huang
  • Publication number: 20230165213
    Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Inventors: James Cheng-Han Wu, Pei-Hsuan Shih, Chun-Ming Su, YOU-GANG KUO, Ning-Yuan Lyu, Chi-Yeh Hsu, Liang-Hao Huang
  • Patent number: 11639625
    Abstract: The present invention relates to a hinge system of an electric door comprising a control module, an intelligent automatic recognition system for installing in a door or a door frame and including a recognition device and a sensing module, and a hinge assembly. The hinge assembly comprises a pivot housing, a power unit disposed in the pivot housing and electrically connected to the control module, a first hinge member having a first knuckle for sleeving on the pivot housing and a second hinge member connected to two ends of the pivot housing. The power unit comprises a motor assembly having a motor axis, a reduction gearbox having one end connected to the motor axis, a gear shaft and plural planetary gears, and a gear connected to the gear shaft of the reduction gearbox.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 2, 2023
    Inventors: Richard Chi-Hsueh, Li-Pai Chen, Chung-Yeh Hsu, Yie-Yeh Hsu
  • Publication number: 20220310782
    Abstract: A method for forming a semiconductor structure includes: providing a semiconductor substrate, the surface of the semiconductor substrate having a plurality of active areas and shallow trench isolation areas arranged in a first direction; etching the active areas and the shallow trench isolation areas in a direction perpendicular to the first direction to form first recesses and second recesses; covering the surfaces of the first recesses and the second recesses with an adhesive layer and a metal layer; and secondarily etching the metal layer and the adhesive layer in the direction perpendicular to the first direction to form a contact hole, the depth of the adhesive layer in the contact hole being defined as H2.
    Type: Application
    Filed: April 12, 2021
    Publication date: September 29, 2022
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Junchao ZHANG, Cheng Yeh HSU
  • Publication number: 20220310618
    Abstract: The present application relates to the technical field of semiconductor manufacturing, in particular to a method for forming a film layer with uniform thickness distribution and a semiconductor structure. The method for forming a film layer with uniform thickness distribution comprises: providing a substrate, a non-flat surface for forming a film layer being provided in the substrate; forming a first sub-layer on the non-flat surface at a first temperature by an in-situ steam generation process; and, forming a second sub-layer on a surface of the first sub-layer at a second temperature by an in-situ steam generation process, the film layer at least comprising the first sub-layer and the second sub-layer, the second temperature being higher than the first temperature.
    Type: Application
    Filed: March 1, 2021
    Publication date: September 29, 2022
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Tao CHEN, Cheng Yeh HSU, WenHao Hsieh
  • Publication number: 20220198457
    Abstract: A debt repayment system and a debt management method are provided. In the method, a transaction via a purchase carrier is received, and a purchase amount is obtained. A repayment plan including first and second stages is determined according to a total debt and the purchase amount and transmitted as a smart contract to a blockchain network. A first repayment in the repayment plan of the first stage relates to interest repayment without principal for the total debt, and a second repayment in the repayment plan of the second stage relates to interest repayment with principal for the total debt. A repayment transferred from a repay account is determined according to a debt ratio of credit bank. A risk coefficient corresponding to the current transaction is determined, and a candidate verification is selected according to the risk coefficient. The current transaction is accepted in response to passing the candidate verification.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Inventor: Chia-Yeh Hsu
  • Publication number: 20220077289
    Abstract: Disclosed are a semiconductor device and a manufacturing method thereof. The method includes: providing a semiconductor substrate; forming a first wordline trench structure; forming a first sacrificial layer at the bottom of the first wordline trench structure; filling the first wordline trench structure located in active regions by epitaxial growth; forming a first insulation layer covering the top of the semiconductor substrate and the first wordline trench structure; forming a second wordline trench structure and a fin-type structure in the active regions, a depth of the second wordline trench structure being less than that of the first wordline trench structure, and a projection of the second wordline trench structure in a vertical direction completely overlapping with a projection of the first sacrificial layer in the vertical direction; removing the first sacrificial layer; and filling the first wordline trench structure, the second wordline trench structure and the wordline tunnel.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Inventors: Qu Luo, Cheng Yeh Hsu
  • Publication number: 20220037481
    Abstract: Embodiments of the present application provide a semiconductor structure and its fabricating method, and a semiconductor memory. The method of fabricating a semiconductor structure comprises providing a substrate and performing ion implantation on the substrate to form an active area, forming a gate groove on surface of the substrate, measuring depth of the gate groove, and performing ion implantation compensation, if the depth of the gate groove meets a preset condition, on the substrate according to the depth of the gate groove, and forming an ion compensation region in the active area at one side of the gate groove.
    Type: Application
    Filed: October 13, 2021
    Publication date: February 3, 2022
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Bing ZOU, Cheng Yeh HSU
  • Publication number: 20210326978
    Abstract: A real estate product related finance system and a management method thereof are provided. The finance organization server obtains a loan request. The real estate platform receives a real estate request and predicts a deductible amount of the customer through a machine learning algorithm. The sale terminal receives a deal processed through a purchase certificate, where the purchase certificate relates to digital money. The real estate platform calculates a value difference between a comparing result between the predicted deductible amount and the total purchase amount and home loan interest of the customer within a liquidation period, and provides the value difference to the finance organization server, to deduct the home loan interest within the liquidation period. Accordingly, the mechanism for paying the home loan interest is changed, it is easier to manage for financial organizations, and the customer can be notified automatically.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Inventor: Chia-Yeh Hsu
  • Patent number: 11091856
    Abstract: An electric heating cloth having gaps and a connection structure thereof are disclosed. The electric heating cloth having gaps comprises plural conductive yarns arranged in a first direction and plural textile yarns and plural metal conductive wires arranged in a second direction for interweaving with the plural conductive yarns. The plural metal conductive wires are aligned at external sides of the plural textile yarns to form a first conductive side and a second conductive side respectively, and each of the first conductive side and the second conductive side has plural gaps.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: August 17, 2021
    Assignee: Bumblebee Tech Co., Ltd.
    Inventors: Chung-Yeh Hsu, Tzu-Chin Hsu, Yie-Yeh Hsu
  • Patent number: 10967724
    Abstract: A mobile vehicle is disclosed herein. It comprises a car body having four wheels and a chassis bracket at a bottom thereof, and at least one drive motor disposed on a front side or a rear side or both of the chassis bracket and each of which has a motor body and a rotational shaft passing through a center of the motor body for driving the four wheels to rotate through a driver assembly.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: April 6, 2021
    Inventors: Richard Chi-Hsueh, Chung-Yeh Hsu, Tzu-Chin Hsu, Yie-Yeh Hsu