Abstract: An air purifier and a purifying method are provided. The air purifier includes a housing, a sterilization and ozone-generating unit, a physical filter, a first ozone-removing unit, and a cover. The housing has a sidewall and a bottom surface to define a processing space, wherein an upper end of the housing has an air inlet and the sidewall has an air outlet. The sterilization and ozone-generating unit is disposed in the processing space. The physical filter is disposed in the processing space, extends along the sidewall, and surrounds the sterilization and ozone-generating unit. The first ozone-removing unit is disposed between the physical filter and the sidewall. The cover is openably disposed at the air inlet.

Abstract: An electronic device includes: a display panel and a host. The host is electrically connected to the display panel, and includes a processing unit and a graphics processing unit. The processing unit executes a driver program of the graphics processing unit and a specific program to render a display image of the specific program, wherein the display image includes a user interface. The processing unit obtains position information about a static area of the user interface. In response to the processing unit obtaining the position information about the static area of the user interface, the graphics processing unit performs a burn-in-prevention process on the static area via the driver program to generate an output image, and transmits the output image to the display panel for displaying.

Abstract: A human face identification apparatus, a distributed human face identification system and a corresponding method are provided. The method includes obtaining a human face block from an image, identifying a data of a person corresponding to the human face block according to a client database by a client apparatus, controlling the client apparatus to transmit the human face block to a server apparatus and controlling the server apparatus to identify the human face block according to a server database when the data of the person corresponding to the human face block cannot be identified by the client apparatus, and copying the data of the person corresponding to the human face block from the server database to the client database when the data of the person is identified according to the server database by the server apparatus.

Abstract: A display device, including a circuit substrate, a light-emitting layer, a quarter-wave plate, and a band-pass polarizing layer, is provided. The light-emitting layer is disposed on the circuit substrate and has light-emitting structures, which are electrically connected to the circuit substrate and include first light-emitting structures, which have a first main light-emitting wavelength. The quarter-wave plate is disposed in overlap with the light-emitting structures and is located between the band-pass polarizing layer and the light-emitting layer. The band-pass polarizing layer includes at least one first band-pass polarizing pattern, which have a first absorption axis. The first wavelength range is the first main light-emitting wavelength ±10 nm. An average transmittance of the first band-pass polarizing patterns to light with a wavelength outside the first wavelength range and a polarization direction parallel to the first absorption axis is less than 20%.

Abstract: Embodiments disclosed herein relate to using an implantation process and a melting anneal process performed on a nanosecond scale to achieve a high surface concentration (surface pile up) dopant profile and a retrograde dopant profile simultaneously. In an embodiment, a method includes forming a source/drain structure in an active area on a substrate, the source/drain structure including a first region comprising germanium, implanting a first dopant into the first region of the source/drain structure to form an amorphous region in at least the first region of the source/drain structure, implanting a second dopant into the amorphous region containing the first dopant, and heating the source/drain structure to liquidize and convert at least the amorphous region into a crystalline region, the crystalline region containing the first dopant and the second dopant.

Abstract: A circuit measuring device and a method thereof are provided. A voltage source supplies a common voltage such that a calibration current having a preset current value flows from a current-voltage converter to a final test machine. The current-voltage converter converts the calibration current into a calibration voltage. At this time, a voltage sensing component senses a voltage between an input terminal and an output terminal of the current-voltage converter to output sensed calibration data. The current-voltage converter converts a tested current outputted by a tested circuit into a tested voltage. At this time, the voltage sensing component senses the voltage between the input terminal and the output terminal of the current-voltage converter to output actual sensed data. When the final test machine determines that a difference between the sensed calibration data and the actual sensed data is larger than a threshold, the tested circuit is adjusted.

Abstract: Semiconductor devices and methods of forming semiconductor devices are provided. A method includes forming a first mask layer over a target layer, forming a plurality of spacers over the first mask layer, and forming a second mask layer over the plurality of spacers and patterning the second mask layer to form a first opening, where in a plan view a major axis of the opening extends in a direction that is perpendicular to a major axis of a spacer of the plurality of spacers. The method also includes depositing a sacrificial material in the opening, patterning the sacrificial material, etching the first mask layer using the plurality of spacers and the patterned sacrificial material, etching the target layer using the etched first mask layer to form second openings in the target layer, and filling the second openings in the target layer with a conductive material.

Abstract: An integrated fan-out (InFO) package includes a plurality of dies, an encapsulant, an insulating layer, a redistribution structure, a plurality of conductive structures, an antenna confinement structure, and a slot antenna. The encapsulant laterally encapsulates the dies. The insulating layer is disposed over the dies and the encapsulant. The redistribution structure is sandwiched between the insulating layer and the dies. The conductive structures and the antenna confinement structure are embedded in the insulating layer. The slot antenna is disposed on the insulating layer.

Abstract: A light emitting diode device with flip-chip structure includes a transparent protective substrate, a transparent conductor layer, a glue layer, a group III-V stack layer, a first conductivity metal electrode, a second conductivity metal electrode and an insulating layer. The transparent conductor layer is formed on the transparent protective substrate. The glue layer bonds the transparent protective substrate and the transparent conductor layer. The group III-V stack layer and the first conductivity metal electrode are respectively formed on a first portion and a second portion of the transparent conductor layer. The second conductivity metal electrode is formed on a portion of the group III-V stack layer. The insulating layer covers exposed portions of the transparent conductor layer and the group III-V stack layer, and the insulating layer further covers portions of the first and second conductivity metal electrodes, so as to expose the first and second conductivity metal electrodes.

Abstract: A temperature correction method is provided for detecting a temperature of a computer device that includes a first ambient temperature sensor and a second ambient temperature sensor that are spaced apart from each other, and a fan module. When a temperature difference between the temperatures sensed by the first and second ambient temperature sensors is greater than a predetermined threshold value, a controller of the computer device performs temperature correction that is related to the temperature difference, a fan speed of the fan module, and at least one of the sensed temperatures.

Abstract: An oxide semiconductor field effect transistor (OSFET) includes a first insulating layer, a source, a drain, a U-shaped channel layer and a metal gate. The first insulating layer is disposed on a substrate. The source and the drain are disposed in the first insulating layer. The U-shaped channel layer is sandwiched by the source and the drain. The metal gate is disposed on the U-shaped channel layer, wherein the U-shaped channel layer includes at least an oxide semiconductor layer. The present invention also provides a method for forming said oxide semiconductor field effect transistor.

Abstract: A disturbance source positioning method for positioning disturbance sources in a system including a plurality of nodes is provided. The method includes the following steps: grouping the plurality of nodes into a plurality of node groups based on an oscillation feature; establishing an in-group causality of the plurality of node groups based on a successive order of a coherent oscillation component; selecting at least one candidate group from the plurality of node groups based on the in-group causality; and positioning at least one disturbance source node in each candidate group.

Abstract: An image capturing lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The fifth lens element with positive refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The sixth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The seventh lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, and the image-side surface thereof includes at least one convex shape in an off-axis region thereof.

Abstract: A semiconductor device is provided. The semiconductor device includes a channel layer disposed on a substrate, a barrier layer disposed on the channel layer, and a nitride layer disposed on the barrier layer. The semiconductor device also includes a compound semiconductor layer that includes an upper portion and a lower portion, wherein the lower portion penetrates through the nitride layer and a portion of the barrier layer. The semiconductor device also includes a spacer layer conformally disposed on a portion of the barrier layer and extending onto the nitride layer. The semiconductor device further includes a gate electrode disposed on the compound semiconductor layer, and a pair of source/drain electrodes disposed on opposite sides of the gate electrode. The pair of source/drain electrodes extends through the spacer layer, the nitride layer, and at least a portion of the barrier layer.

Abstract: A package structure has a chip, a molding compound encapsulating the chip and an inductor structure disposed above the chip. A vertical projection of the inductor structure at least partially overlaps with a vertical projection of the chip.

Abstract: An optical sensing device adopted to use structured light to detect an object is provided. The optical sensing device includes a structured light projector and a sensor. The structured light projector includes a light source and at least one beam multiplication film. The light source is configured to emit a light beam. The at least one beam multiplication film is disposed on a transmission path of the light beam and is made of anisotropic refractive index material, wherein a plurality of separated light beams are produced after the light beam from the light source passes through the at least one beam multiplication film, so as to form the structured light. The sensor is configured to sense the structured light reflected from the object. Besides, a structured light projector is also provided.

Abstract: An optical sensing device adopted to use structured light to detect an object is provided. The optical sensing device includes a structured light projector and a sensor. The structured light projector includes a light source and at least one beam multiplication film. The light source is configured to emit a light beam. The at least one beam multiplication film is disposed on a transmission path of the light beam and is made of anisotropic refractive index material, wherein a plurality of separated light beams are produced after the light beam from the light source passes through the at least one beam multiplication film, so as to form the structured light. The sensor is configured to sense the structured light reflected from the object. Besides, a structured light projector is also provided.

Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.

Abstract: An optical transceiver includes an input assembly, an output port, a fiber patch panel, multiple first optical fibers and multiple second optical fibers. The input assembly is arranged on a circuit board and has a first input port and a second input port. The fiber patch panel is arranged between the input assembly and the output port, and has multiple first fiber patch slots and multiple second fiber patch slots. The first optical fibers are connected to the first input port and the output port. The first optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second optical fibers are connected to the second input port and the output port. The second optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second fiber patch slot accommodates the first optical fiber and the second optical fiber.

Abstract: An example redundant power supply system comprises a power supply input to receive power from a power supply; a buck-boost converter coupled to the power supply input; and a controller coupled to the buck-boost converter. The controller is to receive a power supply identification signal from the power supply. The controller is also to enable or disable the buck-boost converter based on the power supply identification signal.