Patents by Inventor Yen-An CHEN

Yen-An CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11513318
    Abstract: An optical photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The third lens element has two surfaces being both aspheric. The fourth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, wherein two surfaces thereof are aspheric. The fifth lens element has an image-side surface being convex in a paraxial region thereof, wherein two surfaces thereof are aspheric.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: November 29, 2022
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Dung-Yi Hsieh, Chun-Yen Chen, Chun-Che Hsueh, Hsin-Hsuan Huang
  • Patent number: 11507533
    Abstract: A data query method and apparatus are disclosed. The method includes: determining a target directory block including m directory entries and m file names, where the m directory entries one-to-one correspond to the m file names, and the m directory entries and the m file names are sequentially arranged according to a preset rule; determining a current first set and a current second set based on a binary search algorithm and the target directory block; determining a first common prefix between a to-be-accessed file name and a file name in the current second set; comparing the to-be-accessed file name with a third file name character by character from a first character after the first common prefix; and if the to-be-accessed file name is the same as the third file name, obtaining data of a to-be-accessed file based on a directory entry corresponding to the third file name.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: November 22, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiang Gao, Wei Du, Chun Yen Chen, Ning Wang
  • Patent number: 11508185
    Abstract: A method for collecting facial recognition data includes: locating a first face area from an Nth image frame; extracting a first facial feature defined with S factors; acquiring a second facial feature extracted from a second face area shown in an (N?1)th image frame at a corresponding position; determining whether the first face area is relevant to the second face area, and assigning to the first face area a tracing code; determining whether to store the first facial feature according to a similarity level of the first facial feature to existent data; storing and inputting the first facial feature into a neural network to generate an adjusted feature defined with T factors if the similarity level of the first facial feature to the existent data is not lower than a preset level, wherein T is not smaller than S; acquiring adjusted data generated by inputting the existent data into the neural network; determining whether the person is a registered one according to a similarity level of the adjusted feature to a
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: November 22, 2022
    Assignee: QNAP SYSTEMS, INC.
    Inventors: Chun-Yen Chen, Chan-Cheng Liu, Ting-An Lin
  • Patent number: 11507995
    Abstract: An information recommendation system and method of the present invention provide a user interface for the user to operate and thereby to generate some confirmation signals. A processing unit calculates recommendation parameters respectively based on aforesaid confirmation signals which includes a temperature confirmation signal, a physique confirmation signal, a residence confirmation signal, and a wearing habit confirmation signal. In another word, the generation of the recommendation information is based on the user's residence temperature and climate as well as the user's physique and wearing habits, and in particular, by further calculating on every recommendation parameters. Therefore, the products recommended by the recommendation information can better match the user's residence and habits whereby increasing the product fitness and decreasing the chances of waste due to unfitness.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: November 22, 2022
    Assignee: Hop Lion Feather Works Corp.
    Inventor: Yen-Chen Chen
  • Publication number: 20220365673
    Abstract: A non-intrusive shared processing method for pop-up window is applied for inhibiting or closing the pop-up window on the display device. The method includes the following steps: a non-intrusive terminal device publishing the pop-up window data to an information theme in a communication interface; a central processing device subscribing to the information theme to receive the pop-up window data and generating a decision data corresponding to the pop-up window data, and publishing the decision data to the information theme; and, the non-intrusive terminal device receiving the decision data from the information theme and inhibiting or closing the pop-up window of the display device according to the decision data. Therefore, the method of the present invention can automatically transmit the information and solution of the pop-up window to other equipments with the same type through subscription/publishing mechanism, thereby decreasing the process time.
    Type: Application
    Filed: August 18, 2021
    Publication date: November 17, 2022
    Inventors: CHIEN-CHUNG LIN, WEI-JYUN TU, YU-YEN CHEN
  • Publication number: 20220367398
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Hung CHEN, Yu-Nu HSU, Chun-Chen LIU, Heng-Chi HUANG, Chien-Chen LI, Shih-Yen CHEN, Cheng-Nan HSIEH, Kuo-Chio LIU, Chen-Shien CHEN, Chin-Yu KU, Te-Hsun PANG, Yuan-Feng WU, Sen-Chi CHIANG
  • Publication number: 20220359333
    Abstract: In an embodiment, a device includes: a processor die including circuit blocks, the circuit blocks including active devices of a first technology node; a power gating die including power semiconductor devices of a second technology node, the second technology node larger than the first technology node; and a first redistribution structure including first metallization patterns, the first metallization patterns including power supply source lines and power supply ground lines, where a first subset of the circuit blocks is electrically coupled to the power supply source lines and the power supply ground lines through the power semiconductor devices, and a second subset of the circuit blocks is permanently electrically coupled to the power supply source lines and the power supply ground lines.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Fong-Yuan Chang, Chieh-Yen Chen
  • Publication number: 20220359467
    Abstract: In an embodiment, a device includes: a first die array including first integrated circuit dies, orientations of the first integrated circuit dies alternating along rows and columns of the first die array; a first dielectric layer surrounding the first integrated circuit dies, surfaces of the first dielectric layer and the first integrated circuit dies being planar; a second die array including second integrated circuit dies on the first dielectric layer and the first integrated circuit dies, orientations of the second integrated circuit dies alternating along rows and columns of the second die array, front sides of the second integrated circuit dies being bonded to front sides of the first integrated circuit dies by metal-to-metal bonds and by dielectric-to-dielectric bonds; and a second dielectric layer surrounding the second integrated circuit dies, surfaces of the second dielectric layer and the second integrated circuit dies being planar.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Chen-Hua Yu, Chuei-Tang Wang, Chieh-Yen Chen, Wei Ling Chang
  • Publication number: 20220352082
    Abstract: A semiconductor device includes a first plurality of dies on a wafer, a first redistribution structure over the first plurality of dies, and a second plurality of dies on the first redistribution structure opposite the first plurality of dies. The first redistribution structure includes a first plurality of conductive features. Each die of the first plurality of dies are bonded to respective conductive features of the first plurality of conductive features by metal-metal bonds on a bottom side of the first redistribution structure. Each die of the second plurality of dies are bonded to respective conductive features of the first plurality of conductive features in the first redistribution structure by metal-metal bonds on a top side of the first redistribution structure.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 3, 2022
    Inventors: Chen-Hua Yu, Jeng-Shien Hsieh, Chuei-Tang Wang, Chieh-Yen Chen
  • Patent number: 11487091
    Abstract: A photographing lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The seventh lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the seventh lens element includes at least one convex shape in an off-axis region thereof. The object-side surface and the image-side surface of the seventh lens element are aspheric.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: November 1, 2022
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che Hsueh, Chun-Yen Chen, Wei-Yu Chen
  • Patent number: 11488683
    Abstract: Disclosed is a device for detecting the margin of a circuit operating at an operating speed. The device includes: a signal generating circuit generating an input signal including predetermined data; a first adjustable delay circuit delaying the input signal by a first delay amount and thereby generating a delayed input signal; a circuit under test performing a predetermined operation based on a predetermined operation timing and thereby generating a to-be-tested signal according to the delayed input signal; a second adjustable delay circuit delaying the to-be-tested signal by a second delay amount and thereby generating a delayed to-be-tested signal; a comparison circuit comparing the data included in the delayed to-be-tested signal with the predetermined data based on the predetermined operation timing and thereby generating a comparison result; and a calibration circuit determining whether the circuit under test passes a speed test according to the comparison result.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: November 1, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chun-Yi Kuo, Ying-Yen Chen
  • Publication number: 20220345240
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE receives, from a first base station, a data transmission on a first cell using a first RAT. The UE determines a CRS transmission using a second RAT on a second cell from a second base station. The UE determines that the CRS transmission on the second cell interferes with receiving the data transmission on the first cell at the UE. The UE applies an interference cancellation on the first cell to mitigate an interference from the CRS transmission on the second cell to the data transmission on the first cell.
    Type: Application
    Filed: March 22, 2022
    Publication date: October 27, 2022
    Inventors: Yen-Chen Chen, Xiu-Sheng LI
  • Publication number: 20220336431
    Abstract: In an embodiment, a structure includes: a processor device including logic devices; a first memory device directly face-to-face bonded to the processor device by metal-to-metal bonds and by dielectric-to-dielectric bonds; a first dielectric layer laterally surrounding the first memory device; a redistribution structure over the first dielectric layer and the first memory device, the redistribution structure including metallization patterns; and first conductive vias extending through the first dielectric layer, the first conductive vias connecting the metallization patterns of the redistribution structure to the processor device.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen
  • Patent number: 11476367
    Abstract: A semiconductor device includes an oxide semiconductor layer, disposed over a substrate. A source electrode of a metal nitride is disposed on the oxide semiconductor layer. A drain electrode of the metal nitride is disposed on the oxide semiconductor layer. A metal-nitride oxidation layer is formed on a surface of the source electrode and the drain electrode. A ratio of a thickness of the metal-nitride oxidation layer to a thickness of the drain electrode or the source electrode is equal to or less than 0.2.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: October 18, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yen-Chen Chen, Xiao Wu, Hai Tao Liu, Ming Hua Du, Shouguo Zhang, Yao-Hung Liu, Chin-Fu Lin, Chun-Yuan Wu
  • Patent number: 11472961
    Abstract: A method of removing metal ions is provided, which includes contacting a metal removal composition with a solution containing metal ions for removing the metal ions from the solution, wherein the metal removal composition includes a polymer with a chemical structure of: wherein Q is a quinoline-based group, n=90˜450, o=10˜50, and p=0˜20. The metal removal composition has a type of fiber or film. In addition, the metal removal composition has a porosity of 60% to 90%.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: October 18, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Min-Fei Tsai, Feng-Jen Tsai, Ping-Yen Chen, Yen-Cheng Li, Li-Han Chung
  • Patent number: 11474366
    Abstract: A light projector including a light source, a beam multiplication film, and a tunable wave plate is provided. The light source is configured to emit a light beam. The beam multiplication film is disposed on a transmission path of the light beam and made of anisotropic refractive index material, wherein a plurality of separated light beams are produced after the light beam from the light source passes through the beam multiplication film. The tunable wave plate is disposed on transmission paths of the separated light beams from the beam multiplication film and configured to modulate the separated light beams.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: October 18, 2022
    Assignee: LIQXTAL TECHNOLOGY INC.
    Inventors: Hung-Shan Chen, Yen-Chen Chen
  • Publication number: 20220328631
    Abstract: In an embodiment, a device includes: a gate structure on a channel region of a substrate; a gate mask on the gate structure, the gate mask including a first dielectric material and an impurity, a concentration of the impurity in the gate mask decreasing in a direction extending from an upper region of the gate mask to a lower region of the gate mask; a gate spacer on sidewalls of the gate mask and the gate structure, the gate spacer including the first dielectric material and the impurity, a concentration of the impurity in the gate spacer decreasing in a direction extending from an upper region of the gate spacer to a lower region of the gate spacer; and a source/drain region adjoining the gate spacer and the channel region.
    Type: Application
    Filed: June 10, 2021
    Publication date: October 13, 2022
    Inventors: Wei-Ting Chien, Wen-Yen Chen, Li-Ting Wang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang
  • Patent number: 11469203
    Abstract: A method for forming a package structure includes forming an under bump metallization (UBM) layer over a metal pad and forming a photoresist layer over the UBM layer. The method further includes patterning the photoresist layer to form an opening in the photoresist layer. The method also includes forming a first bump structure over the first portion of the UBM layer. The first bump structure includes a first barrier layer over a first pillar layer. The method includes placing a second bump structure over the first bump structure. The second bump structure includes a second barrier layer over a second pillar layer. The method further includes reflowing the first bump structure and the second bump structure to form a solder joint between a first inter intermetallic compound (IMC) and a second IMC.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: October 11, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Publication number: 20220308319
    Abstract: An optical photographing assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The third lens element has at least one of an object-side surface and an image-side surface being aspheric. The fourth lens element has at least one of an object-side surface and an image-side surface being aspheric. The fifth lens element has at least one of an object-side surface and an image-side surface being aspheric, wherein at least one of the object-side surface and the image-side surface of the fifth lens element includes at least one inflection point.
    Type: Application
    Filed: June 8, 2022
    Publication date: September 29, 2022
    Inventor: Chun-Yen CHEN
  • Publication number: 20220302833
    Abstract: A boost converter includes an inductor and a diode electrically connected in series between an input voltage and an output voltage; a transistor electrically coupled to an interconnected node of the inductor and the diode; and a controller that controls switching of the transistor according to a transient mode and an estimated load current. The output voltage in a light-to-heavy load transient mode has at least one first valley point with a value of a transient voltage threshold, followed by at least one second valley point with a value higher than the first valley point, before exiting the light-to-heavy load transient mode.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 22, 2022
    Inventors: Chun-Yen Chen, Chien-Hung Tsai, Chia-Hsuan Huang, Teng-Kuei Wu