Abstract: A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Abstract: A cache and a method for managing a cache are provided. The cache includes a storage circuit, a buffer circuit and a control circuit. The buffer circuit stores data in a first-in first-out (FIFO) manner. The control circuit is coupled to the storage circuit and the buffer circuit and is configured to find a storage space in the storage circuit and write the data to the storage space.

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

Abstract: A data write system includes a processor circuit, a first memory, at least one register, and a second memory. The first memory is coupled to the processor circuit. The at least one register is configured to define at least one range. The second memory is coupled to the first memory. If a cache miss occurs and an access address of a reading command is in the at least one range in the second memory, a predetermined amount of data corresponding to the access address is written from the second memory into at least one first way of the first memory.

Abstract: An electronic apparatus with a data transceiving mechanism includes: a processing circuit, configured to generate a data request; a transceiving apparatus, coupled to the processing circuit, configured to transmit the data request to at least one target electronic apparatus; and a monitoring circuit, coupled to the processing circuit and the transceiving apparatus, configured to calculate data related parameters for the data transmitted by or received by the transceiving apparatus in a predetermined time period after the transceiving apparatus transmits or receives the data request. If the data related parameter does not match a predetermined rule, the monitoring circuit substitutes the processing circuit to complete a data transaction and to generate an inform message to the processing circuit.

Abstract: A processor circuit is provided. The processor circuit includes an instruction decode unit, an instruction detector, an address generator and a data buffer. The instruction decode unit is configured to decode a load instruction to generate a decoding result. The instruction detector, coupled to the instruction decode unit, is configured to detect if the load instruction is in a load-use scenario. The address generator, coupled to the instruction decode unit, is configured to generate a first address requested by the load instruction according to the decoding result. The data buffer is coupled to the instruction detector and the address generator. When the instruction detector detects that the load instruction is in the load-use scenario, the data buffer is configured to store the first address generated from the address generator, and store data requested by the load instruction according to the first address.

Abstract: An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.

Abstract: The present disclosure provides a memory data access apparatus and method thereof. The memory data access apparatus includes a cache memory and a processing unit. The processing unit is configured to: execute a memory read instruction, wherein the memory read instruction includes a memory address; determine that access of the memory address in the cache memory is missed; determine that the memory address is within a memory address range, wherein the memory address range corresponds to a data access amount; and read data blocks corresponding to the data access amount from the memory address of a memory.

Abstract: A data write system includes a main memory, a cache memory, and a core processing circuit. The main memory includes a restricted region and a non-restricted region. The cache memory is coupled to the main memory. The cache memory includes multiple ways. The core processing circuit is coupled to the cache memory and includes a logic circuit. The logic circuit is configured to select one of the ways as a selected way according to an access address of the main memory, the restricted region, and mode setting information, to write data corresponding to the access address into the selected way.

Abstract: An electronic device can execute instructions, comprising: a processing circuit; a first storage device, coupled to the processing circuit, configured to store at least one instruction and first operation data; and a second storage device, coupled to the processing circuit. The processing circuit reads at least one of the instruction and the first operation data corresponding to the read instruction from the first storage device, and the second storage device does not store the first operation data corresponding to the read instruction, the processing circuit backs up the read first operation data to the second storage device.

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

Abstract: Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.

Abstract: A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

Abstract: An electronic apparatus with a data transceiving mechanism includes: a processing circuit, configured to generate a data request; a transceiving apparatus, coupled to the processing circuit, configured to transmit the data request to at least one target electronic apparatus; and a monitoring circuit, coupled to the processing circuit and the transceiving apparatus, configured to calculate data related parameters for the data transmitted by or received by the transceiving apparatus in a predetermined time period after the transceiving apparatus transmits or receives the data request. If the data related parameter does not match a predetermined rule, the monitoring circuit substitutes the processing circuit to complete a data transaction and to generate an inform message to the processing circuit.

Abstract: An electronic device can execute instructions, comprising: a processing circuit; a first storage device, coupled to the processing circuit, configured to store at least one instruction and first operation data; and a second storage device, coupled to the processing circuit . The processing circuit reads at least one of the instruction and the first operation data corresponding to the read instruction from the first storage device, and the second storage device does not store the first operation data corresponding to the read instruction, the processing circuit backs up the read first operation data to the second storage device.

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.