Abstract: A calibration method suitable for calibrating a light transceiver module includes: disposing a plurality of reflective regions, a plurality of light-absorbing regions and a feature region beside the light transceiver module; making the light transceiver module emit light toward the reflective regions, the light-absorbing regions and the feature region and sensing the images of the reflective regions, the light-absorbing regions and the feature region; comparing the actual orientations of the reflective regions, the light-absorbing regions and the feature region with the positions of the images formed by the reflective regions, the light-absorbing regions and the feature region on an image sensing surface of the light transceiver module so as to calibrate the actual orientations corresponding to the positions on the image sensing surface.

Abstract: A calibration method suitable for calibrating a light transceiver module includes: disposing a plurality of reflective regions, a plurality of light-absorbing regions and a feature region beside the light transceiver module; making the light transceiver module emit light toward the reflective regions, the light-absorbing regions and the feature region and sensing the images of the reflective regions, the light-absorbing regions and the feature region; comparing the actual orientations of the reflective regions, the light-absorbing regions and the feature region with the positions of the images formed by the reflective regions, the light-absorbing regions and the feature region on an image sensing surface of the light transceiver module so as to calibrate the actual orientations corresponding to the positions on the image sensing surface.

Abstract: A plasma processing method performs an etching process of supplying a fluorine-containing gas into a plasma processing space and etching a target substrate, in which a silicon oxide film or a silicon nitride film is formed on a surface of a metal silicide film, with plasma of the fluorine-containing gas (process S101). Then, the plasma processing method performs a reduction process of supplying a hydrogen-containing gas into the plasma processing space and reducing, with plasma of the hydrogen-containing gas, a metal-containing material deposited on a member, of which a surface is arranged to face the plasma processing space, after the etching process (process S102). Thereafter, the plasma processing method performs a removal process of supplying an oxygen-containing gas into the plasma processing space and removing metal, which is obtained by reducing the metal-containing material in the reduction process, with plasma of the oxygen-containing gas (process S103).

Abstract: A jig for calibrating a light transceiver module includes a disposition region for the light transceiver module on which the light transceiver module is suitably disposed and an arc structure, which takes the position of the disposition region for the light transceiver module as a circle center thereof and includes reflective regions, light-absorbing regions and a feature region. The reflective regions and light-absorbing regions are alternately arranged, and the feature region is a region for reflection or for absorbing light. When the feature region is the region for reflection, the width of the region for reflection is different from the width of each the reflective region, and when the feature region is the region for absorbing light, the width of the region for absorbing light is different from width of each of the light-absorbing regions. A calibration method is also provided.

Abstract: An optical touch device and a touch detecting method using the same are provided. The optical touch device is suitable for use with a touch surface and includes a control unit and first to fourth optical capturing units. The first to fourth optical capturing units are disposed on a side of the optical touch device close to the touch surface. The first to fourth optical capturing units are respectively disposed at predetermined distances from the touch surface and are disposed based on predetermined angles. A touch covering area of each of the first to fourth optical capturing units is obtained respectively based on the predetermined distance and the predetermined angle. The touch covering area is positively correlated to the predetermined distance. At least one touch point on the touch surface is calculated by the control unit based on optical sensing information captured by the first to fourth optical capturing units.

Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.

Abstract: A plasma processing method performs an etching process of supplying a fluorine-containing gas into a plasma processing space and etching a target substrate, in which a silicon oxide film or a silicon nitride film is formed on a surface of a nickel silicide film, with plasma of the fluorine-containing gas (process S101). Then, the plasma processing method performs a reduction process of supplying a hydrogen-containing gas into the plasma processing space and reducing, with plasma of the hydrogen-containing gas, a nickel-containing material deposited on a member, of which a surface is arranged to face the plasma processing space, after the etching process (process S102). Thereafter, the plasma processing method performs a removal process of supplying an oxygen-containing gas into the plasma processing space and removing nickel, which is obtained by reducing the nickel-containing material in the reduction process, with plasma of the oxygen-containing gas (process S103).

Abstract: A light source module comprising a substrate and a light-emitting diode (LED) array is provided. The LED array comprises a first LED sub-array, a second LED sub-array, and a third LED sub-array disposed on the substrate along a horizontal axis. The first LED sub-array is configured to emit a first light beam. The second LED sub-array is configured to emit a second light beam. The third LED sub-array disposed between the first and second LED sub-arrays is configured to emit a third light beam. The first, second, and third light beams jointly forms a light area. Luminance of the third light beam is less than luminance of the first light beam or luminance of the second light beam.

Abstract: An illumination device comprising a reflector and a light source module is provided. The light source module comprises a column, a first light-emitting diode (LED) light source, and a second LED light source. The column has a front end and a side. The first LED light source fixed to the front end of the column is configured to emit a first light beam for forming a first illumination area on a projection plane. The second LED light source fixed to the side of the column is configured to emit a second light beam for forming a second illumination area partly overlapping the first illumination area on the projection plane.

Abstract: A plasma processing method performs an etching process of supplying a fluorine-containing gas into a plasma processing space and etching a target substrate, in which a silicon oxide film or a silicon nitride film is formed on a surface of a nickel silicide film, with plasma of the fluorine-containing gas (process S101). Then, the plasma processing method performs a reduction process of supplying a hydrogen-containing gas into the plasma processing space and reducing, with plasma of the hydrogen-containing gas, a nickel-containing material deposited on a member, of which a surface is arranged to face the plasma processing space, after the etching process (process S102). Thereafter, the plasma processing method performs a removal process of supplying an oxygen-containing gas into the plasma processing space and removing nickel, which is obtained by reducing the nickel-containing material in the reduction process, with plasma of the oxygen-containing gas (process S103).

Abstract: A jig for calibrating a light transceiver module includes a disposition region for the light transceiver module on which the light transceiver module is suitably disposed and an arc structure, which takes the position of the disposition region for the light transceiver module as a circle center thereof and includes reflective regions, light-absorbing regions and a feature region. The reflective regions and light-absorbing regions are alternately arranged, and the feature region is a region for reflection or for absorbing light. When the feature region is the region for reflection, the width of the region for reflection is different from the width of each the reflective region, and when the feature region is the region for absorbing light, the width of the region for absorbing light is different from width of each of the light-absorbing regions. A calibration method is also provided.

Abstract: The present invention provides a spring clip mountable to a withdrawable artificial tooth and a removable artificial tooth that is assembled through the spring clip. The spring clip mounted to the withdrawable artificial tooth can clamp a projection block formed on a corresponding internal crown or a neighboring tooth to allow the external crown to be removed by direct application of force to the external crown thereby allowing a user to easily remove the artificial tooth (the external crown) for cleaning.

Abstract: The present invention provides a spring clip mountable to a withdrawable artificial tooth and a removable artificial tooth that is assembled through the spring clip. The spring clip mounted to the withdrawable artificial tooth can clamp a projection block formed on a corresponding internal crown or a neighboring tooth to allow the external crown to be removed by direct application of force to the external crown thereby allowing a user to easily remove the artificial tooth (the external crown) for cleaning.

Abstract: The present invention provides a spring clip mountable to a withdrawable artificial tooth and a removable artificial tooth that is assembled through the spring clip. The spring clip mounted to the withdrawable artificial tooth can clamp a projection block formed on a corresponding internal crown or a neighboring tooth to allow the external crown to be removed by direct application of force to the external crown thereby allowing a user to easily remove the artificial tooth (the external crown) for cleaning.

Abstract: The present invention provides a spring clip mountable to a withdrawable artificial tooth and a removable artificial tooth that is assembled through the spring clip. The spring clip mounted to the withdrawable artificial tooth can clamp a projection block formed on a corresponding internal crown or a neighboring tooth to allow the external crown to be removed by direct application of force to the external crown thereby allowing a user to easily remove the artificial tooth (the external crown) for cleaning.

Abstract: A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.

Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.

Abstract: A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked.

Abstract: The present invention provides a spring clip mountable to a withdrawable artificial tooth and a removable artificial tooth that is assembled through the spring clip. The spring clip mounted to the withdrawable artificial tooth can clamp a projection block formed on a corresponding internal crown or a neighboring tooth to allow the external crown to be removed by direct application of force to the external crown thereby allowing a user to easily remove the artificial tooth (the external crown) for cleaning.

Abstract: A method and system of characterizing a flow property of a production well site in a reservoir are provided. The method includes identifying a plurality of injection and production well sites in the reservoir; injecting fluid into selected injection well sites in accordance with an injection schedule; monitoring an output at the production well sites; determining a time delay between the selected injection sites and the production sites based on the monitored output using an estimated capacitance model; and characterizing a flow property of a production well site using the time delay and the estimated capacitance model.