Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first conductive structure and a second conductive structure. A dielectric structure is arranged between the first conductive structure and the second conductive structure. The dielectric structure comprises an upper region over a lower region. The lower region comprises a first lateral surface and a second lateral surface on opposing sides of the upper region. A passivation layer overlies the second conductive structure and the dielectric structure. The passivation layer comprises a lateral segment contacting the first lateral surface. A height of the lateral segment is greater than a height of the upper region. A top surface of the lateral segment is below a top surface of the passivation layer.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: An endoscope cleaning device is applied to an endoscope having a main body and a tube body connected to the main body. The endoscope cleaning device includes a frame, a receiving tank for receiving the tube body, a circulating module, and an operating module that is electrically connected to the circulating module. The receiving tank and the operating module are disposed on the frame. The circulating module is connected to a source of first solution supply, a source of second solution supply, and the receiving tank. The operating module is manipulated by a user to control the circulating module to transmit the solution provided by the source of first solution supply and the solution provided by the source of second solution supply to the receiving tank and then to drain the solution in the receiving tank out. A cleaning method of an endoscope by using the endoscope cleaning device is provided.

Abstract: The present disclosure relates to a MIM (metal-insulator-metal) capacitor having a top electrode overlying a substrate. A passivation layer overlies the top electrode. The passivation layer has a step region that continuously contacts and extends from a top surface of the top electrode to sidewalls of the top electrode. A metal frame overlies the passivation layer. The metal frame continuously contacts and extends from a top surface of the passivation layer to upper sidewalls of the passivation layer in the step region. The metal frame has a protrusion that extends through the passivation layer and contacts the top surface of the top electrode.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: Various embodiments of the present disclosure are directed towards a piezoelectric metal-insulator-metal (MIM) device including a piezoelectric structure between a top electrode and a bottom electrode. The piezoelectric layer includes a top region overlying a bottom region. Outer sidewalls of the bottom region extend past outer sidewalls of the top region. The outer sidewalls of the top region are aligned with outer sidewalls of the top electrode. The piezoelectric layer is configured to help limit delamination of the top electrode from the piezoelectric layer.

Abstract: Various embodiments of the present application are directed towards a trench capacitor with a high capacitance density. In some embodiments, the trench capacitor overlies the substrate and fills a trench defined by the substrate. The trench capacitor comprises a lower capacitor electrode, a capacitor dielectric layer, and an upper capacitor electrode. The capacitor dielectric layer overlies the lower capacitor electrode and lines the trench. The upper capacitor electrode overlies the capacitor dielectric layer and lines the trench over the capacitor dielectric layer. The capacitor dielectric layer comprises a high ? dielectric material. By using a high ? material for the dielectric layer, the trench capacitor may have a high capacitance density suitable for use with high performance mobile devices.

Abstract: The disclosure provides a transporting device, a transporting system, and a shelf transporting method. The method includes: estimating a device pose of the transporting device in a specific field; detecting a shelf pose of a shelf located in the specific field; in response to receiving a transporting request for the shelf, setting an entry point associated with the shelf based on the shelf pose of the shelf, and controlling the transporting device to move to the entry point; in response to determining that the transporting device has arrived at the entry point, rotating to align with the shelf, and entering an accommodating space beneath the shelf via an entrance of the shelf; raising a lift bar to dock with the shelf, and moving to transport the shelf.

Abstract: A sensing device including a transistor, at least one response electrode, and a receptor is provided. The transistor includes a gate end, a source end, a drain end, and a semiconductor layer. The source end and the drain end are located on the semiconductor layer, and the gate end is located between the source end and the drain end. The at least one response electrode is disposed opposite to the gate end of the transistor and spaced apart from the transistor. The receptor is bonded onto the at least one response electrode. When a voltage is applied to the at least one response electrode, an electric field between the at least one response electrode and the gate end of the transistor is F, and F?1 mV/cm.

Abstract: Various embodiments of the present disclosure are directed towards a piezoelectric metal-insulator-metal (MIM) device including a piezoelectric structure between a top electrode and a bottom electrode. The piezoelectric layer includes a top region overlying a bottom region. Outer sidewalls of the bottom region extend past outer sidewalls of the top region. The outer sidewalls of the top region are aligned with outer sidewalls of the top electrode. The piezoelectric layer is configured to help limit delamination of the top electrode from the piezoelectric layer.

Abstract: Various embodiments of the present application are directed towards a trench capacitor with a high capacitance density. In some embodiments, the trench capacitor overlies the substrate and fills a trench defined by the substrate. The trench capacitor comprises a lower capacitor electrode, a capacitor dielectric layer, and an upper capacitor electrode. The capacitor dielectric layer overlies the lower capacitor electrode and lines the trench. The upper capacitor electrode overlies the capacitor dielectric layer and lines the trench over the capacitor dielectric layer. The capacitor dielectric layer comprises a high ? dielectric material. By using a high ? material for the dielectric layer, the trench capacitor may have a high capacitance density suitable for use with high performance mobile devices.

Abstract: The present disclosure relates to a MIM (metal-insulator-metal) capacitor having a top electrode overlying a substrate. A passivation layer overlies the top electrode. The passivation layer has a step region that continuously contacts and extends from a top surface of the top electrode to sidewalls of the top electrode. A metal frame overlies the passivation layer. The metal frame continuously contacts and extends from a top surface of the passivation layer to upper sidewalls of the passivation layer in the step region. The metal frame has a protrusion that extends through the passivation layer and contacts the top surface of the top electrode.

Abstract: A sensing device including a transistor, at least one response electrode, and a receptor is provided. The transistor includes a gate end, a source end, a drain end, and a semiconductor layer. The source end and the drain end are located on the semiconductor layer, and the gate end is located between the source end and the drain end. The at least one response electrode is disposed opposite to the gate end of the transistor and spaced apart from the transistor. The receptor is bonded onto the at least one response electrode. When a voltage is applied to the at least one response electrode, an electric field between the at least one response electrode and the gate end of the transistor is F, and F?1 mV/cm.

Abstract: This disclosure relates to a light-emitting apparatus comprising a submount, a chip carrier formed on the submount, a light-emitting chip formed on the chip carrier, a reflecting cup formed on the submount and enclosing the light-emitting chip and the chip carrier, and a transparent encapsulating material for encapsulating the light-emitting chip.

Abstract: An optoelectronic semiconductor device includes a substrate, a semiconductor system having an active layer formed on the substrate and an electrode structure formed on the semiconductor system, wherein the layout of the electrode structure having at least a first conductivity type contact zone or a first conductivity type bonding pad, a second conductivity type bonding pad, a first conductivity type extension electrode, and a second conductivity type extension electrode wherein the first conductivity type extension electrode and the second conductivity type extension electrode have three-dimensional crossover, and partial of the first conductivity type extension electrode and the first conductivity type contact zone or the first conductivity type bonding pad are on the opposite sides of the active layer.

Abstract: The application discloses an array-type light-emitting device comprising a substrate, a semiconductor light-emitting array formed on the substrate and emitting a first light with a first spectrum, wherein the semiconductor light-emitting array comprises a first light-emitting unit and a second light-emitting units, a first wavelength conversion layer formed on the first light-emitting unit for converting the first light into a third light with a third spectrum, and a circuit layer connecting the first light-emitting unit and the second light-emitting unit in a connection form to make the first light-emitting and the second light-emitting unit light alternately in accordance with a predetermined clock when driving by a power supply.

Abstract: An operating system switching method for use in an electronic device is provided. The method includes the steps of: determining whether the first operating system receives an operating system switching command at time t1; storing first status data to a volatile memory and a non-volatile memory when a first operating system enters a non-operating state from an operating state based on the operating system switching command; writing second status data stored in the non-volatile memory to the volatile memory; and controlling the second operating system to enter the operating state from the non-operating state and recover to the operating status at time t2 based on the second status data stored in the volatile memory, wherein time t2 is earlier than time t1.

Abstract: A method for counting steps and an electronic apparatus are provided. The method includes the following steps: obtaining first three-axis accelerating values of the electronic apparatus; removing a specific ratio of an acceleration of gravity from the first three-axis accelerating values to generate second three-axis accelerating values; calculating inner product values and outer produce values according to the second three-axis accelerating values; determining whether a user of the electronic apparatus is in a walking status; if yes, setting the inner product values as reference values; if no, setting the outer product values as the reference values; calculating a number of steps corresponding to the second three-axis accelerating values according to the reference values.

Abstract: In a method for managing servers, operation parameters of servers located in a room are downloaded from a database in response to receiving a quick response code (Qrcode) of a doorplate of the room. An electronic map is displayed on a display screen of the electronic device, the electronic map showing a location of the room and a location of each of the servers in the room. The operation parameters of the selected server are displayed in response to receiving a selected server on the electronic map.

Abstract: This application discloses a light-emitting device with narrow dominant wavelength distribution and a method of making the same. The light-emitting device with narrow dominant wavelength distribution at least includes a substrate, a plurality of light-emitting stacked layers on the substrate, and a plurality of wavelength transforming layers on the light-emitting stacked layers, wherein the light-emitting stacked layer emits a first light with a first dominant wavelength variation; the wavelength transforming layer absorbs the first light and converts the first light into the second light with a second dominant wavelength variation; and the first dominant wavelength variation is larger than the second dominant wavelength variation.