Abstract: A memory hard macro designed to support multiple design for test (DFT) techniques having signal paths associated with the DFT techniques and the functional operation of the memory instance that share logic devices or components. The memory hard macro includes a functional input port and a functional output port, forming a functional memory data path, which includes input latches from the memory instance. The memory hard macro also includes a scan input port and a scan output port, forming a scan data path, which includes input latches from the array of data buffer circuits and output latches from the array of sense amplifiers. The memory hard macro further includes a BIST input port and a BIST output port, forming a BIST data path, which includes at least one input latch from the array of data buffer circuits and at least one output latch from the array of sense amplifiers.

Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: A method and system for testing an electronic memory. The method includes subjecting the electronic memory to a first test condition of a predetermined set of test conditions. The method also includes testing functionality of the electronic memory, a first plurality of times, for the first test condition using a predetermined test algorithm. The method further includes checking availability of a second test condition from the predetermined set of test conditions if the functionality of the electronic memory is satisfactory. Further, the method includes testing the functionality of the electronic memory, a second plurality of times, for the second test condition using the predetermined test algorithm if the second test condition is available. Moreover, the method includes accepting the electronic memory for use in a product if the functionality of the electronic memory is satisfactory.

Abstract: Testing electronic memories based on fault and test algorithm periodicity. A processor unit for testing an electronic memory includes a built-in self-test (BIST) finite state machine, an address generator, a data generator, a test algorithm generation unit, a programmable test algorithm register, and a test algorithm register control unit. A memory wrapper unit for testing an electronic memory includes an operation decoder, a data comparator, and an electronic memory under test. The method includes constructing a fault periodic table having columns corresponding with test mechanisms, and rows corresponding with fault families. A first March test sequence and second March test sequence are selected according to respective fault families and test mechanisms, and applied to an electronic memory. The electronic memory under test is determined to be one of acceptable and unacceptable based on results of the first March test sequence and the second March test sequence.

Abstract: Architecture, system and method for providing compression of repair data in an IC design having a plurality of memory instances. In one embodiment, the repair data storage method includes determining repair data for each of the memory instances and compressing the repair data into a compressed format that is stored in a shared nonvolatile storage common to the memory instances.

Abstract: Various methods and apparatuses are described for a system that includes some on-chip components, e.g., I-Os, test processors, soft wrappers, etc., an external testing unit that provides Parametric Measurement Unit (PMU) capability, and various tests performed on the I-Os by the on-chip testing logic, the test vector patterns supplied by the external testing unit.

Abstract: A structural primitive verification tool for memory compilers is described. A first set of memory structural primitives are supplied by a designer by filling in fields of a presented user interface. The first set of structural primitives describe certain physical layout features of a proposed memory array in an integrated circuit. A first model of a memory instance derived from the first set of memory structural primitives supplied by the designer is compared to a second model of a memory instance derived from a memory layout file from a memory compiler under-test. The first model is verified against the second model to verify to an integrity of the first set of memory structural primitives supplied by the designer compared to the memory layout file derived from a second set of memory structural primitives configuring that memory instance from the memory compiler.

Abstract: Architecture, system and method for providing compression of repair data in an IC design having a plurality of memory instances. In one embodiment, the repair data storage method includes determining repair data for each of the memory instances and compressing the repair data into a compressed format that is stored in a shared nonvolatile storage common to the memory instances.

Abstract: Architecture, system and method for providing compression of repair data in an IC design having a plurality of memory instances. In one embodiment, the repair data storage method includes determining repair data for each of the memory instances and compressing the repair data into a compressed format that is stored in a shared nonvolatile storage common to the memory instances.

Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: Various methods and apparatuses are described for a system that includes some on-chip components, e.g., I-Os, test processors, soft wrappers, etc., an external testing unit that provides Parametric Measurement Unit (PMU) capability, and various tests performed on the I-Os by the on-chip testing logic, the test vector patterns supplied by the external testing unit.

Abstract: Various methods and apparatuses are described for a system that includes some on-chip components, e.g., I-Os, test processors, soft wrappers, etc., an external testing unit that provides Parametric Measurement Unit (PMU) capability, and various tests performed on the I-Os by the on-chip testing logic, the test vector patterns supplied by the external testing unit.

Abstract: A method and system for repairing a memory. A test and repair wrapper is operable to be integrated with input/output (I/O) circuitry of a memory instance to form a wrapper I/O (WIO) block that is operable to receive test and repair information from a built-in self-test and repair (BISTR) processor. Logic circuitry associated with the WIO block is operable generate a current error signal that is used locally by the BISTR processor for providing a repair enable control signal in order to repair a faulty memory portion using a redundant memory portion without having to access a post-processing environment for repair signature generation.

Abstract: A computer-implemented method for creating an integrated circuit, IC, test engine for testing a proposed IC memory array using new memory structural model. An IC designer inputs the number of words that can be stored and a column multiplexer ratio in a proposed IC memory array. A selection of one or more procedures is made from a library of computer-readable procedures. Each of the procedures is to produce one or more structural primitives that describe certain physical layout features of the proposed IC memory array, without analyzing a CAD layout file of the proposed IC memory array. The library of procedures as a whole translates between a physical model of a family of IC memory arrays and a user interface model of the family. A data background, DB, pattern is produced to be used by the test engine in testing the proposed IC memory array. This is done by executing the selected one or more procedures, wherein these procedures take as input the received number of words and column multiplexer size.

Abstract: An intellectual property (IP) integrity verification system and method operable with respect to integrating an IP design into a user's embedded IC design. In one embodiment, the IP design is partitioned into a plurality of IP modules based on the requirements of the embedded IC design. For each IP module, a corresponding integrity checker module is provided, wherein each integrity checker module has a port-wise correspondence with its corresponding IP module. The embedded IC design is simulated with the integrity checker modules rather than the IP modules for generating a netlist, which may be verified with respect to any interconnectivity errors associated with the IP modules.

Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: Various methods and apparatuses are described for a system that includes some on-chip components, e.g., I-Os, test processors, soft wrappers, etc., an external testing unit that provides Parametric Measurement Unit (PMU) capability, and various tests performed on the I-Os by the on-chip testing logic, the test vector patterns supplied by the external testing unit.

Abstract: A structural primitive verification tool for memory compilers is described. A first set of memory structural primitives are supplied by a designer by filling in fields of a presented user interface. The first set of structural primitives describe certain physical layout features of a proposed memory array in an integrated circuit. A first model of a memory instance derived from the first set of memory structural primitives supplied by the designer is compared to a second model of a memory instance derived from a memory layout file from a memory compiler under-test. The first model is verified against the second model to verify to an integrity of the first set of memory structural primitives supplied by the designer compared to the memory layout file derived from a second set of memory structural primitives configuring that memory instance from the memory compiler.

Abstract: Integrated circuit test circuits may include at least an instruction processor and input-output subsystems. Input-output subsystems are segmented together into input-output subsystem segments. Each input-output subsystem includes an analog wrapper circuit (IW-A) operable to connect an input-output port to analog buses and further operable to isolate the input-output port from the buses, an integrated wrapper for delay test circuit (IW-D) operable to control a delay test sequence, and a soft wrapper circuit operable to control the IW-A and the IW-D, the soft wrapper circuit being directed by the instruction processor.

Abstract: A method and system for repairing a memory. A test and repair wrapper is operable to be integrated with input/output (I/O) circuitry of a memory instance to form a wrapper I/O (WIO) block that is operable to receive test and repair information from a built-in self-test and repair (BISTR) processor. Logic circuitry associated with the WIO block is operable generate a current error signal that is used locally by the BISTR processor for providing a repair enable control signal in order to repair a faulty memory portion using a redundant memory portion without having to access a post-processing environment for repair signature generation.