Abstract: An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

Abstract: A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.

Abstract: An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

Abstract: A heat dissipating fan includes a housing (201), a stator (21), a rotor (27) and a buffer structure. The housing defines an accommodating space (202) and includes a hollow tube (201b). The tube encloses first and second bearings (22, 23) therein. The stator is arranged in the accommodating space and around the tube. The rotor has a shaft rotatably disposed in the first and the second bearings. The buffer structure includes at least a pair of magnets (25, 26) received in the tube and located between the first and second bearings. Repellent force is generated between the magnets, thereby preventing at least one of the first and the second bearing from being damaged by an accidental force acting thereon.

Abstract: An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.

Abstract: A light emitting diode (LED) assembly includes at least an LED (102), a substrate (20), a heat dissipation apparatus (40) and at least one securing frame (30). The substrate forms a set of electrical circuitry (22) thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion (32) securing the substrate with the heat dissipation apparatus detachably.

Abstract: An antenna device (10) of a consumer electronic product is formed on an outer surface (302) of a shell (30) of the electronic product. The shell of the consumer electronic product is adapted for forming an enclosure of an electronic product. The antenna device extends on a planar plane and is integrally formed with and is coated on the outer surface of the shell. A method for making the antenna device includes: (A) providing a consumer electronic product having a shell for forming the antenna device on an outer surface thereof, the shell being adapted for enclosing components of the consumer electronic product therein; (B) coating a copper layer on the outer surface of the shell of the electronic product; (C) forming circuitry out of the copper layer to form the antenna device.

Abstract: A heat-pipe type heat sink (100) includes a plurality of fins (10), at least a heat pipe (20) extending through the fins, and soldering material (40) disposed between the heat pipe and the fins. Each of the fins defines therein a through hole (12) and a cutout (13) adjacent to the through hole. A sidewall of the through hole forms a collar (122) contacting with the heat pipe, whilst a sidewall of the cutout forms at least a fringe (132) connecting with the collar. The fringe guides the soldering material in molten state to flow from the cutout towards the collar to fill in a gap formed between the heat pipe and the fins to bond the heat pipe and the fins together after the molten soldering material is cooled.

Abstract: A heat dissipating fan includes a housing (201), a stator (21), a rotor (27) and a buffer structure. The housing defines an accommodating space (202) and includes a hollow tube (201b). The tube encloses first and second bearings (22, 23) therein. The stator is arranged in the accommodating space and around the tube. The rotor has a shaft rotatably disposed in the first and the second bearings. The buffer structure includes at least a pair of magnets (25, 26) received in the tube and located between the first and second bearings. Repellent force is generated between the magnets, thereby preventing at least one of the first and the second bearing from being damaged by an accidental force acting thereon.

Abstract: A cooling fan includes a fan housing (50) having a central tube (52), a bearing structure received in the central tube, a stator (60) mounted around the central tube, and a fan blade set (70). The bearing structure includes a shaft (30) being rotatably received in the central tube and connecting to the fan blade set. An inner bearing (20) is fixedly mounted around the shaft to rotate with the shaft. Upper and lower outer bearings (10) are fixedly mounted into the central tube and are mounted around two opposite ends of the inner bearing, respectively. The inner and outer bearings are made of magnetic materials. The inner bearing floats between the outer bearings whereby rotation of the shaft does not cause the inner and outer bearings to wear.

Abstract: A cooling fan includes a fan housing (10) having an upper tube (111) extending downwardly from a top side thereof and a lower tube (121) extending upwardly from a bottom side thereof, a ball bearing (20) being mounted in the upper tube, a sleeve bearing (30) being mounted in the lower tube, a stator (45) mounted around the lower tube, and a rotor (40). The rotor includes a hub (401) located between the ball bearing and the sleeve bearing and a shaft (50) extending through the hub. Two ends of the shaft are rotatably received in the ball bearing and the sleeve bearing, respectively.

Abstract: A cooling fan includes a fan housing (30) having a central tube (34) extending upwardly therefrom, a bearing (61) received in the central tube and defining a bearing hole (62) therein, a stator (20) mounted around the central tube, and a rotor (10) including a hub (12) having a shaft (18) extending from the hub into the bearing hole of the bearing. The stator includes a stator core, and upper and lower insulating frames (28a, 28b) respectively located at upper and lower sides of the stator core. An oil retaining structure (288) is integrally formed with the upper insulating frame, and extends inwardly from a top of the upper insulating frame to an outer surface of the shaft.

Abstract: A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.

Abstract: A heat dissipating apparatus (10) includes a base (20), a plurality of stacked fins (30), and at least a heat pipe (40). The base absorbs heat from a heat-generating component. Each of the fins includes a main body (32), and a plurality of projection members (33) extending from the main body. The projection members of a first fin connect the projection members of a second fin. The projection members form a first heat transfer path for transferring heat from the base to the fins. The heat pipe includes a heat-absorbing portion (42) thermally contacting with the base, and a heat-dissipating portion (44) contacting with the fins. The heat pipe forms a second heat transfer path for transferring the heat from the base toward the fins.

Abstract: A heat dissipation device includes a heat sink with a plurality of fins, a fan mounted on a side of the heat sink with a space formed between the heat sink and the fan, and at least one airflow guiding board formed by one end of at least one of the fins. The airflow guiding board extends through the space to connect with the fan. The airflow guiding board can guide the airflow generated by the fan to the heat sink, so as to reduce the loss of the airflow from the edge of the heat sink, and enhance the effect of heat dissipation. Alternatively, the airflow guide board can also function to guide the airflow to cool other heat sinks.

Abstract: An antenna device (10) of a consumer electronic product is formed on an outer surface (302) of a shell (30) of the electronic product. The shell of the consumer electronic product is adapted for forming an enclosure of an electronic product. The antenna device extends on a planar plane and is integrally formed with and is coated on the outer surface of the shell. A method for making the antenna device includes: (A) providing a consumer electronic product having a shell for forming the antenna device on an outer surface thereof, the shell being adapted for enclosing components of the consumer electronic product therein; (B) coating a copper layer on the outer surface of the shell of the electronic product; (C) forming circuitry out of the copper layer to form the antenna device.

Abstract: A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.

Abstract: A light-emitting diode (LED) includes a heat sink (10) having a cross section along an axial direction thereof being U-shaped. The heat sink includes a substrate (102) and a sidewall (11) extending from an outer periphery of the substrate. A circuit board (40) is received in the heat sink and arranged on the substrate. At least one LED (30) is arranged on and electrically connected to the circuit board and thermally connected with the substrate of the heat sink. A plurality of fins (100) extend outwardly from an outer surface (110) of the sidewall of the heat sink. Each fin has a plurality of branches (100a, 100b) being connected together at the outer surface of the sidewall and being spaced from each other at outer-peripheries thereof.

Abstract: A light emitting diode (LED) assembly includes at least an LED (102), a substrate (20), a heat dissipation apparatus (40) and at least one securing frame (30). The substrate forms a set of electrical circuitry (22) thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion (32) securing the substrate with the heat dissipation apparatus detachably.

Abstract: An assembly includes an electronic product (40), and a packaging box (10) for enclosing the electronic product therein. The packaging box includes a casing (12) and a cover (14). The casing includes a base wall (124) and four sidewalls (120, 121, 122, 123) disposed around the base wall. An accommodating space (125) is defined between the base wall and the sidewalls for enclosing an electronic product therein. Two opposite first sidewalls (120, 121) of the casing have two side plates (16) pivotably extending therefrom. The side plates include a plurality of projections (162, 164) extending towards the accommodating space for cushioning the electronic product. The cover is pivotably extended from a second sidewall (123) connected with the first sidewalls of the casing and covers the accommodating space.