Patents by Inventor Yeu-Lih Lin
Yeu-Lih Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080105408Abstract: A heat-pipe type heat sink (100) includes a plurality of fins (10), at least a heat pipe (20) extending through the fins, and soldering material (40) disposed between the heat pipe and the fins. Each of the fins defines therein a through hole (12) and a cutout (13) adjacent to the through hole. A sidewall of the through hole forms a collar (122) contacting with the heat pipe, whilst a sidewall of the cutout forms at least a fringe (132) connecting with the collar. The fringe guides the soldering material in molten state to flow from the cutout towards the collar to fill in a gap formed between the heat pipe and the fins to bond the heat pipe and the fins together after the molten soldering material is cooled.Type: ApplicationFiled: November 3, 2006Publication date: May 8, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: JING ZHANG, YEU-LIH LIN, CHIN-LUNG CHEN, MING-LIANG HAO, MING YANG
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Publication number: 20080099186Abstract: A flexible heat pipe (10) includes a casing (12), a wick structure (20) arranged in the casing, and a working medium saturated in the wick structure. The casing includes an evaporation section (122), a condensation section (126), and a flexible adiabatic section (124) connecting the evaporation section with the condensation section. The wick structure includes a first portion (21), a second portion (23) and a third portion respectively disposed in the evaporation, the condensation and the adiabatic sections of the casing. The adiabatic section of the casing further accommodates a supporting member (30) therein for supporting the third portion of the wick structure to have an intimate contact with an inner surface of the adiabatic section.Type: ApplicationFiled: March 15, 2007Publication date: May 1, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Fang-Xiang Yu, Yeu-Lih Lin
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Patent number: 7365983Abstract: A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, two wings (144) extending from two opposite sides of the main body, and a plurality of projections (148) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.Type: GrantFiled: November 3, 2005Date of Patent: April 29, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Shu-Liang Huang, Yeu-Lih Lin, Ai-Min Huang, Ming Yang
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Patent number: 7292442Abstract: A heat sink clip and an assembly incorporating such clip are provide. The heat sink clip comprises: a body, an actuating member and a movable fastener. The body has a securing portion formed at one end thereof. The actuating member has a hinge portion thereof. The movable fastener is secured to the hinge portion of the actuating member. The actuating member is pivotably mounted to the securing portion of the body in a direction substantially perpendicular to the body, and the actuating member is turnable relative to the body between a locked position and an unlocked position.Type: GrantFiled: April 24, 2006Date of Patent: November 6, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Fang-Xiang Yu, Yeu-Lih Lin, Ming Yang
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Patent number: 7254026Abstract: A heat dissipation device (40) includes at least a heat pipe (45) and a plurality of metal fins (43) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (431). An extension flange (433) extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (435). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.Type: GrantFiled: March 20, 2006Date of Patent: August 7, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ming Yang, Yeu-Lih Lin, Chin-Lung Chen
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Patent number: 7249626Abstract: A heat dissipation device includes a fin unit (50), and at least a heat pipe (30) including an evaporating section (32) and at least a condensing section (34) extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a V-shaped section (52,53) and a planar section (54) therebetween. The wavy and V-shaped sections of the fins can guide an airflow flowing into the fin unit to smoothly flow therethrough, and prevent escape of the airflow from lateral directions of the fin unit. Furthermore, the wavy and V-shaped sections increase the heat dissipation area of the fins and strengthen the fins.Type: GrantFiled: December 25, 2005Date of Patent: July 31, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ming-Liang Hao, Yeu-Lih Lin, Ai-Min Huang, Ming Yang
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Publication number: 20070132092Abstract: An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.Type: ApplicationFiled: July 20, 2006Publication date: June 14, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TSENG-HSIANG HU, YEU-LIH LIN, LI-KUANG TAN
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Publication number: 20070121301Abstract: A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.Type: ApplicationFiled: July 13, 2006Publication date: May 31, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: LI-KUANG TAN, YEU-LIH LIN, TSENG-HSIANG HU
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Publication number: 20070115638Abstract: A heat sink clip and an assembly incorporating such clip are provide. The heat sink clip comprises: a body, an actuating member and a movable fastener. The body has a securing portion formed at one end thereof. The actuating member has a hinge portion thereof. The movable fastener is secured to the hinge portion of the actuating member. The actuating member is pivotably mounted to the securing portion of the body in a direction substantially perpendicular to the body, and the actuating member is turnable relative to the body between a locked position and an unlocked position.Type: ApplicationFiled: April 24, 2006Publication date: May 24, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Fang-Xiang Yu, Yeu-Lih Lin, Ming Yang
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Publication number: 20070115637Abstract: A heat dissipation device (40) includes at least a heat pipe (45) and a plurality of metal fins (43) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (431). An extension flange (433) extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (435). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.Type: ApplicationFiled: March 20, 2006Publication date: May 24, 2007Applicant: FOXCONN TECHNOLOGY CO.,LTD.Inventors: Ming Yang, Yeu-Lih Lin, Chin-Lung Chen
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Publication number: 20070097654Abstract: A heat dissipation device includes a heat sink with a plurality of fins, a fan mounted on a side of the heat sink with a space formed between the heat sink and the fan, and at least one airflow guiding board formed by one end of at least one of the fins. The airflow guiding board extends through the space to connect with the fan. The airflow guiding board can guide the airflow generated by the fan to the heat sink, so as to reduce the loss of the airflow from the edge of the heat sink, and enhance the effect of heat dissipation. Alternatively, the airflow guide board can also function to guide the airflow to cool other heat sinks.Type: ApplicationFiled: April 24, 2006Publication date: May 3, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Ming-Liang Hao, Ming Yang, Chin-Lung Chen, Yeu-Lih Lin
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Publication number: 20070095510Abstract: A heat-pipe type heat sink (10) includes a plurality of fins (140) each defining at least a through hole (143) therein, at least a heat pipe (16) extending through the through holes of the fins, and soldering material filled in spaces formed between the heat pipe and the fins. A sidewall of the through hole forms a first fringe (145) contacting with the heat pipe, and a second fringe (146) smoothly and linearly connecting with the first fringe. The second fringe includes two guide portions (147), which are capable of guiding the molten soldering material to flow towards the first fringe to fill in the spaces to bond the heat pipe to the fins after the molten soldering material is cooled. The through hole has a teardrop-like shape.Type: ApplicationFiled: July 7, 2006Publication date: May 3, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: YEU-LIH LIN, Ai-Min Huang, Jun Luo
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Publication number: 20070012421Abstract: A grease protecting apparatus (10) includes a heat sink (12), and a grease cover (14). The heat sink includes a bottom surface (122) for contacting with a heat-generating component. A layer of thermal grease (16) is spread on the bottom surface of the heat sink. The grease cover is attached to the bottom surface of the heat sink and covers the grease to protect the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, and two wings (144) extending from two opposite sides of the main body for attaching the grease cover to the bottom surface of the heat sink. The wings defines a plurality of perforations (148) therein to make the wings be capable of tilted upwardly and downwardly.Type: ApplicationFiled: December 21, 2005Publication date: January 18, 2007Inventors: Yeu-Lih Lin, Chin-Lung Chen, Jian-Qing Sheng
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Publication number: 20060278374Abstract: A heat dissipation device includes a fin unit (50), and at least a heat pipe (30) including an evaporating section (32) and at least a condensing section (34) extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a V-shaped section (52,53) and a planar section (54) therebetween. The wavy and V-shaped sections of the fins can guide an airflow flowing into the fin unit to smoothly flow therethrough, and prevent escape of the airflow from lateral directions of the fin unit. Furthermore, the wavy and V-shaped sections increase the heat dissipation area of the fins and strengthen the fins.Type: ApplicationFiled: December 25, 2005Publication date: December 14, 2006Inventors: Ming-Liang Hao, Yeu-Lih Lin, Ai-Min Huang, Ming Yang
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Publication number: 20060266500Abstract: A heat dissipating apparatus (10) includes a base (20), a plurality of stacked fins (30), and at least a heat pipe (40). The base absorbs heat from a heat-generating component. Each of the fins includes a main body (32), and a plurality of projection members (33) extending from the main body. The projection members of a first fin connect the projection members of a second fin. The projection members form a first heat transfer path for transferring heat from the base to the fins. The heat pipe includes a heat-absorbing portion (42) thermally contacting with the base, and a heat-dissipating portion (44) contacting with the fins. The heat pipe forms a second heat transfer path for transferring the heat from the base toward the fins.Type: ApplicationFiled: December 9, 2005Publication date: November 30, 2006Inventors: Tong-Hua Lin, Chin-Lung Chen, Yeu-Lih Lin, Da-Chang Chou
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Publication number: 20060268520Abstract: A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, two wings (144) extending from two opposite sides of the main body, and a plurality of projections (148) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.Type: ApplicationFiled: November 3, 2005Publication date: November 30, 2006Inventors: Shu-Liang Huang, Yeu-Lih Lin, Ai-Min Huang, Ming Yang
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Publication number: 20060124205Abstract: A method for combining two components together includes the following steps: a) surface treating the two components; b) placing them within a heating apparatus while they contact with each other, a force being applied to the two components to push then against each other on the contacting surfaces thereof; c) heating the two components to a predetermined temperature which is hold for a predetermined period time to cause the two components to diffuse at the contacting interface to thereby combine the two components together; d) cooling the combined two components and taking them out of the heating apparatus.Type: ApplicationFiled: October 18, 2005Publication date: June 15, 2006Inventors: Chu-Wan Hong, Chang-Ting Lo, Yi-Chyng Fang, Jung-Yuan Wu, Yeu-Lih Lin, Peng-Peng Zhang
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Patent number: 6995981Abstract: A heat sink assembly includes a heat-conductive base (20), and a plurality of combined fins (30) uprightly attached onto the base. Each fin includes a main body (31), a bottom flange (32) extending from the main body, and two lower abutting plates (34) extending upwardly from the flange. A pair of first locking tabs (342) is formed from outer sides of the lower abutting plate, and extends into corresponding cutouts (36) of the main body of an adjacent fin. Two upper abutting plates (34?) are formed from a top edge of the main body. A second locking tab (40) extends from an outer side of each upper abutting plate, and into a corresponding notch (38) of the main body of the adjacent fin. Then, the first and second locking tabs are bent inwardly to abut against the main body of the adjacent fin. Thus, the fins are firmly combined together.Type: GrantFiled: June 30, 2003Date of Patent: February 7, 2006Assignee: Hon Hai Precision Inc. Co., Ltd.Inventors: Aimin Huang, Yeu-Lih Lin
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Patent number: 6973962Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.Type: GrantFiled: July 16, 2004Date of Patent: December 13, 2005Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Ching-Bai Hwang, Yi-Chyng Fang, Yeu-Lih Lin
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Publication number: 20050082034Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.Type: ApplicationFiled: July 16, 2004Publication date: April 21, 2005Applicant: HON HAI Precision Industry CO., LTD.Inventors: Ching-Bai Hwang, Yi-Chyng Fang, Yeu-Lih Lin