Abstract: A heat sink assembly includes a heat-conductive base (20), and a plurality of combined fins (30) uprightly attached onto the base. Each fin includes a main body (31), a bottom flange (32) extending from the main body, and two lower abutting plates (34) extending upwardly from the flange. A pair of first locking tabs (342) is formed from outer sides of the lower abutting plate, and extends into corresponding cutouts (36) of the main body of an adjacent fin. Two upper abutting plates (34′) are formed from a top edge of the main body. A second locking tab (40) extends from an outer side of each upper abutting plate, and into a corresponding notch (38) of the main body of the adjacent fin. Then, the first and second locking tabs are bent inwardly to abut against the main body of the adjacent fin. Thus, the fins are firmly combined together.

Abstract: A heat sink clip (10) includes a pressing section (11) and first and second spring sections (12, 14). A first arm (15) depends from the first spring section. An operation lever (24) defines a pair of second pivot holes (244) and a pair of third pivot holes (246) at one end. The third pivot holes are closer to said one end of the lever. A connecting portion (20) has one end pivotably connected to the second spring section, and the other end pivotably connected at the third pivot holes of the lever. A second arm (25) is pivotably connected to the second pivot holes. The first and second arms define slots (18, 28) to engagingly receive posts (82) of a back plate (80). When the lever is rotated downwardly, the second arm of the clip is raised, and a heat sink (30) is thereby secured to a CPU (60).

Abstract: A heat sink clip (10) includes a pressing section (11) and first and second spring sections (12, 14). A first arm (15) depends from the first spring section. An operation lever (24) defines a pair of second pivot holes (244) and a pair of third pivot holes (246) at one end. The third pivot holes are closer to said one end of the lever. A connecting portion (20) has one end pivotably connected to the second spring section, and the other end pivotably connected at the third pivot holes of the lever. A second arm (25) is pivotably connected to the second pivot holes. The first and second arms define slots (18, 28) to engagingly receive posts (82) of a back plate (80). When the lever is rotated downwardly, the second arm of the clip is raised, and a heat sink (30) is thereby secured to a CPU (60).

Abstract: A retaining device includes a retention frame (20), a back plate (40), a clip (10) and a wire arm (30). The retention frame forms a pair of protrusions (24, 25) at respective opposite sides thereof and an ear (26) at one of said sides of the retention frame. A pair of posts (44) extends from the back plate and further protrudes from the protrusions. The clip comprises a pressing lever (12) and a pair of legs (14, 16) depending from the lever. A pair of hooks (142, 162) is inwardly formed from the legs for engaging with the posts. The wire arm comprises a locating portion (34) positioned on the retention frame, a pressing portion (32) resting on the clip and an operating portion (36) clamped under the ear of the retention frame. The locating portion and the operating portion extend in opposite directions from the pressing portion.

Abstract: A heat removal system includes a heat dissipation assembly (10) and a system fan (20) which cooperatively achieve optimized heat dissipation efficiency. The heat dissipation assembly includes a heat sink (12) and an angled fan (14). The heat sink includes a base (122) and a plurality of parallel fins (124). A slanted surface (126) is defined by a set of adjacent edges of the fins. The fan defines a through hole (142) at each of four corners thereof. Four screws (144) extend through the through holes, thus attaching the fan to the heat sink at the slanted surface. A rotational axis of the fan intersects a central portion of the base of the heat sink, which portion defines a region of highest temperature of the heat sink. The angled fan together with the system fan provide maximized cooling airflow.

Abstract: A heat dissipation device includes a heat sink (80) and an assembling device for securing the heat sink to a, chip (90) mounted on a printed circuit board (100). The heat sink has a pair of ears (82) each defining an aperture (84) therein. The assembling device includes a clip (70), a pair of sleeves (50) each defining a cavity (62) therethrough, and a pair of springs (60). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts (66) for extending through the printed circuit board to engage with the corresponding cavities.

Abstract: A heat sink assembly includes a heat sink (60), a fan (20) and a fixing device (70). The heat sink has a plurality of fins (64). The outermost fins define catches (66). The fixing device includes an upper portion (10) and a lower portion (30). The upper and lower portions respectively define upper and lower openings (14, 36) providing air flow access for the fan. A pole (18) depends from each comer of the upper portion. The fan has first through holes (22) for extension of the poles therethrough. A pair of latches (38) extends upwardly from the lower portion, for engaging with the upper portion. The upper portion defines two cutouts (16) in communication with the upper opening, for receiving the latches. A side wall (50) depends from each of two opposite sides of the lower portion. Each side wall defines two recess (54) at respective opposite ends thereof. A barb (52) is formed at each opposite end of each side wall, for engaging with the corresponding catch of the heat sink.

Abstract: A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.

Abstract: A clip assembly (30) includes a nail member (40), a sleeve member (60), and a spring (50) around the sleeve member. The nail member includes a cap (42), a post (44), a neck (46) and a cone-shaped barb (48). A pair of wedges (442) is formed on an outer surface of the post. The sleeve member is cylindrical. The sleeve member defines a central bore (62) for receiving the nail member, and a pair of rectangular slots (66) for receiving the wedges. A circumferential shoulder (68) is formed on the sleeve member, for abutting against a bottom surface of a heat sink. A lower portion (72) of the sleeve member defines cutouts (722), thereby also forming deformable fingers (723). The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.

Abstract: A heat sink assembly for use in conjunction with an electronic integrated circuit, such as a chip, comprises a heat sink and a pair of retainers. The heat sink includes a plate defining a large number of fins and a flat bottom surface. A locking protrusion is formed at a proper position of each side of the plate. Each retainer comprises a transition portion, two engaging arms perpendicular to each other, and a nail beneath the transition portion. A rectangular sheath is formed on a distal end of each engaging arm for cooperating with a corresponding locking protrusion. Each nail includes a main body, a neck section, a protruding section and a cone section. A slot is defined through the lower portion of the section and through the protruding section and the cone section.