Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer.

Abstract: A circuit protection device includes a temperature sensitive resistor element, a dielectric layer, a first electrically insulating layer, a first electrode and a second electrode. The temperature sensitive resistor element has a first electrically conductive layer, a second electrically conductive layer and a positive temperature coefficient (PTC) layer disposed therebetween. The first electrically conductive layer has two electrically conductive blocks. The two electrically conductive blocks dispose on the surface of the PTC layer, thus forming a trench in the PTC layer. The dielectric layer is disposed in the trench. The first electrically insulating layer is disposed on the first electrically conductive layer and covers the dielectric layer. The first and second electrodes are disposed on the first electrically insulating layer, and electrically connected to the two electrically conductive blocks, respectively.

Abstract: An over-current protection device includes a resistor element, an outer electrode, and an encapsulation layer. The resistor element has a first insulation layer, a first electrically conductive layer, a PTC material layer, a second electrically conductive layer and a second insulation layer stacked sequentially from bottom to top. The first insulation layer has a. bottom surface and a first sidewall adjoining the bottom surface. The outer electrode has a first electrode and a second electrode disposed on the bottom surface. The first and second electrodes are electrically connected to the first conductive layer through the first and second vias, respectively. The encapsulation layer covers the first sidewall of the first insulation layer and extends to a part of the bottom surface, thereby forming a first perimeter on the bottom surface of the first insulation layer. The first and second electrodes are located inside the first perimeter.

Abstract: A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Abstract: A thermally conductive board is a laminated structure comprising a metal substrate, a thermally conductive and electrically insulating layer and a metal layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate, and the metal layer is disposed on the thermally conductive and electrically insulating layer. The thermally conductive and electrically insulating layer comprises polymer and non-spherical thermally conductive filler dispersed therein. The polymer comprises at least two straight-chain epoxy resins with different EEW. The product of a mean particle size and a BET surface area of the non-spherical thermally conductive filler is 7.5-15 ?m·m2/g. The thermally conductive and electrically insulating layer has a Tg of 40-90° C. and a thermal conductivity of 1-6 W/m·K.

Abstract: A scattering measurement system is provided, including: a light source generator for generating a detection light beam with discontinuous multi-wavelengths, and generating a multi-order diffraction light beam with three-dimensional feature information when the detection light beam is incident on an object; a detector having a photosensitive array for receiving and converting the multi-order diffraction light beam into multi-order diffraction signals with the three-dimensional feature information; and a processing module for receiving the multi-order diffraction signals and comparing the multi-order diffraction signals with multi-order diffraction feature patterns in a database so as to analyze the three-dimensional feature information of the object.

Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.

Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.

Abstract: A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.

Abstract: A scattering measurement system is provided, including: a light source generator for generating a detection light beam with discontinuous multi-wavelengths, and generating a multi-order diffraction light beam with three-dimensional feature information when the detection light beam is incident on an object; a detector having a photosensitive array for receiving and converting the multi-order diffraction light beam into multi-order diffraction signals with the three-dimensional feature information; and a processing module for receiving the multi-order diffraction signals and comparing the multi-order diffraction signals with multi-order diffraction feature patterns in a database so as to analyze the three-dimensional feature information of the object.

Abstract: A thermal interface material comprises a fluoroelastomer component and a heat conductive filler evenly dispersed in the fluoroelastomer component. The fluoroelastomer component contains greater than 50% fluorine and has a Mooney viscosity ML(1+10) less than 60 at 121° C. The heat conductive filler comprises 40-65% by volume of the thermal interface material. The thermal interface material is manufactured by solventless processes, and has a heat conductivity between 0.7 W/m·K-9 W/m·K.

Abstract: A scattering measurement system is provided, including: a light source generator for generating a detection light beam with multi-wavelengths, wherein the detection light beam is incident on an object so as to generate a plurality of multi-order diffraction light beams with three-dimensional feature information; a spatial filter for filtering out zero-order light beams from the plurality of multi-order diffraction light beams; and a detector having a photosensitive array for receiving the plurality of multi-order diffraction light beams filtered out by the spatial filter and converting the filtered plurality of multi-order diffraction light beams into multi-order diffraction signals with the three-dimensional feature information. As such, the three-dimensional structure of the object can be obtained by comparing the multi-order diffraction signals with a database.

Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 ?-cm and 0.45 ?-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 ?-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.

Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 ?-cm and 0.45 ?-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 ?-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.

Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.

Abstract: A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.

Abstract: An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm2, and the insulating adhesive layer can withstand a voltage of at least 500 volts.

Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.