Patents by Inventor Yi-An Sha

Yi-An Sha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12288980
    Abstract: An over-current protection device includes a resistor element, an outer electrode, and an encapsulation layer. The resistor element has a first insulation layer, a first electrically conductive layer, a PTC material layer, a second electrically conductive layer and a second insulation layer stacked sequentially from bottom to top. The first insulation layer has a bottom surface and a first sidewall adjoining the bottom surface. The outer electrode has a first electrode and a second electrode disposed on the bottom surface. The first and second electrodes are electrically connected to the first conductive layer through the first and second vias, respectively. The encapsulation layer covers the first sidewall of the first insulation layer and extends to a part of the bottom surface, thereby forming a first perimeter on the bottom surface of the first insulation layer. The first and second electrodes are located inside the first perimeter.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: April 29, 2025
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Yi-Hsuan Lee, Pin Hsuan Li, Yi-An Sha
  • Publication number: 20240071656
    Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer.
    Type: Application
    Filed: January 13, 2023
    Publication date: February 29, 2024
    Inventors: Chien Hui WU, Yung-Hsien CHANG, Cheng-Yu TUNG, Ming-Hsun LU, Yi-An SHA
  • Publication number: 20230396060
    Abstract: A circuit protection device includes a temperature sensitive resistor element, a dielectric layer, a first electrically insulating layer, a first electrode and a second electrode. The temperature sensitive resistor element has a first electrically conductive layer, a second electrically conductive layer and a positive temperature coefficient (PTC) layer disposed therebetween. The first electrically conductive layer has two electrically conductive blocks. The two electrically conductive blocks dispose on the surface of the PTC layer, thus forming a trench in the PTC layer. The dielectric layer is disposed in the trench. The first electrically insulating layer is disposed on the first electrically conductive layer and covers the dielectric layer. The first and second electrodes are disposed on the first electrically insulating layer, and electrically connected to the two electrically conductive blocks, respectively.
    Type: Application
    Filed: December 12, 2022
    Publication date: December 7, 2023
    Inventors: YI-AN SHA, CHIEN HUI WU
  • Publication number: 20230361559
    Abstract: An over-current protection device includes a resistor element, an outer electrode, and an encapsulation layer. The resistor element has a first insulation layer, a first electrically conductive layer, a PTC material layer, a second electrically conductive layer and a second insulation layer stacked sequentially from bottom to top. The first insulation layer has a. bottom surface and a first sidewall adjoining the bottom surface. The outer electrode has a first electrode and a second electrode disposed on the bottom surface. The first and second electrodes are electrically connected to the first conductive layer through the first and second vias, respectively. The encapsulation layer covers the first sidewall of the first insulation layer and extends to a part of the bottom surface, thereby forming a first perimeter on the bottom surface of the first insulation layer. The first and second electrodes are located inside the first perimeter.
    Type: Application
    Filed: October 13, 2022
    Publication date: November 9, 2023
    Inventors: YI-HSUAN LEE, PIN HSUAN LI, YI-AN SHA
  • Publication number: 20190023960
    Abstract: A thermally conductive board is a laminated structure comprising a metal substrate, a thermally conductive and electrically insulating layer and a metal layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate, and the metal layer is disposed on the thermally conductive and electrically insulating layer. The thermally conductive and electrically insulating layer comprises polymer and non-spherical thermally conductive filler dispersed therein. The polymer comprises at least two straight-chain epoxy resins with different EEW. The product of a mean particle size and a BET surface area of the non-spherical thermally conductive filler is 7.5-15 ?m·m2/g. The thermally conductive and electrically insulating layer has a Tg of 40-90° C. and a thermal conductivity of 1-6 W/m·K.
    Type: Application
    Filed: November 30, 2017
    Publication date: January 24, 2019
    Inventors: KUO HSUN CHEN, MENG CHUN KO, YI AN SHA
  • Patent number: 9653192
    Abstract: A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: May 16, 2017
    Assignee: Polytronics Technology Corp.
    Inventors: Chien Cheng Ho, Tong Cheng Tsai, Kuo Chang Lo, Yi An Sha
  • Publication number: 20170066955
    Abstract: A thermal interface material comprises a fluoroelastomer component and a heat conductive filler evenly dispersed in the fluoroelastomer component. The fluoroelastomer component contains greater than 50% fluorine and has a Mooney viscosity ML(1+10) less than 60 at 121° C. The heat conductive filler comprises 40-65% by volume of the thermal interface material. The thermal interface material is manufactured by solventless processes, and has a heat conductivity between 0.7 W/m·K-9 W/m·K.
    Type: Application
    Filed: May 17, 2016
    Publication date: March 9, 2017
    Inventors: Kuo Hsun CHEN, Yi An SHA
  • Patent number: 9431822
    Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 ?-cm and 0.45 ?-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 ?-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: August 30, 2016
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Yu Hsuan Tseng, Yi An Sha
  • Publication number: 20160233667
    Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 ?-cm and 0.45 ?-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 ?-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.
    Type: Application
    Filed: February 11, 2015
    Publication date: August 11, 2016
    Inventors: Kuo Hsun CHEN, Yu Hsuan TSENG, Yi An SHA
  • Patent number: 9340712
    Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: May 17, 2016
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Meng Chun Ko, Yi An Sha, Hsiang Yun Yang
  • Publication number: 20160093414
    Abstract: A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.
    Type: Application
    Filed: July 22, 2015
    Publication date: March 31, 2016
    Inventors: CHIEN CHENG HO, TONG CHENG TSAI, KUO CHANG LO, YI AN SHA
  • Patent number: 9291311
    Abstract: An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm2, and the insulating adhesive layer can withstand a voltage of at least 500 volts.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: March 22, 2016
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Hsun Ching Chiang, Yi An Sha, Hsiang Yun Yang
  • Patent number: 9224525
    Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: December 29, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Tong Cheng Tsai, Wen Feng Lee, Chun Teng Tseng, Chi Jen Su, Yi An Sha
  • Patent number: 9177702
    Abstract: A PTC composition comprises crystalline polymer and conductive ceramic filler dispersed therein. The crystalline polymer has a melting point less than 90° C. and comprises 5%-30% by weight of the PTC composition. The crystalline polymer comprises ethylene, vinyl copolymer or the mixture thereof. The vinyl copolymer comprises at least one of the functional group selected from the group consisting of ester, ether, organic acid, anhydride, imide or amide. The conductive ceramic filler comprises a resistivity less than 500 ??-cm and comprises 70%-95% by weight of the PTC composition. The PTC composition has a resistivity about 0.01-5 ?-cm and its resistance at 85° C. is about 103 to 108 times that at 25° C.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: November 3, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Chang Lo, Wei Tsang Dai, Yi An Sha, Chun Teng Tseng
  • Patent number: 9147509
    Abstract: A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 ?-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 ?-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25° C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3A/mm2. Each electrode lead has a cross-sectional area of at least 0.16 mm2.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: September 29, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Fu Hua Chu, Yi An Sha, En Tien Yang, Tong Cheng Tsai
  • Patent number: 9074127
    Abstract: A heat radiating material contains components which comprise 10-45 wt % of titanium dioxide, 5-25 wt % of zirconium dioxide, 2-30 wt % of magnesium oxide, and 0.01-0.5 wt % of an oxide of rare earth metal. The heat radiating material has a heat conductivity of 0.34-1.35 W/m-K, and a radiation efficiency equal to or larger than 88% which is measured in infrared spectroscopy wavelength range 4-14 ?m and at a temperature of 40° C.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: July 7, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Yu Sian Jhuo, Kuo Hsun Chen, Yi An Sha
  • Publication number: 20150155080
    Abstract: A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 ?-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 ?-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25° C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3 A/mm2. Each electrode lead has a cross-sectional area of at least 0.16 mm2.
    Type: Application
    Filed: May 19, 2014
    Publication date: June 4, 2015
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Fu Hua CHU, Yi An SHA, En Tien YANG, Tong Cheng TSAI
  • Patent number: 9041507
    Abstract: A surface mountable over-current protection device comprises one PTC material layer, first and second conductive layers, first and second electrodes, and an insulating layer. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first and second conductive layers are disposed on first and second planar surfaces of the PTC material layer, respectively. The first and second electrodes are electrically connected to the first and second conductive layers. The insulating layer is disposed between the first and the second electrodes for insulation. At the melting point of the crystalline polymer, the CTE of the crystalline polymer is greater than 100 times the CTE of the first or second conductive layer, and the first and/or second conductive layers has a thickness which is large enough to obtain a resistance jump value R3/Ri less than 1.4.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: May 26, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: David Shau Chew Wang, Wen Feng Lee, En Tien Yang, Chun Teng Tseng, Yi An Sha
  • Patent number: 9000881
    Abstract: A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 ?-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: April 7, 2015
    Assignee: Polytronics Technology Corp.
    Inventors: Fu Hua Chu, David Shau Chew Wang, Chun Teng Tseng, Yi An Sha
  • Publication number: 20150036344
    Abstract: An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm2, and the insulating adhesive layer can withstand a voltage of at least 500 volts.
    Type: Application
    Filed: December 20, 2013
    Publication date: February 5, 2015
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Hsun Ching Chiang, Yi An Sha, Hsiang Yun Yang