Patents by Inventor Yi-An Sha
Yi-An Sha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8941462Abstract: An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.Type: GrantFiled: April 19, 2013Date of Patent: January 27, 2015Assignee: Polytronics Technology Corp.Inventors: Wen Feng Lee, Kuo Hsun Chen, Chun Teng Tseng, Yi An Sha, Ming Hsun Lu
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Publication number: 20150022929Abstract: An over-current protection apparatus applied to a secondary battery comprises a lead frame, an IC and a PTC device. The lead frame has a carrier portion and two end portions bending therefrom to form an accommodating space. The two end portions electrically connect to positive and negative electrodes of the secondary battery. The carrier portion comprises a plurality of blocks. The IC and PTC device are disposed on the carrier portion and received in the accommodating space and encapsulated by a cover. The PTC device comprises a first electrode and a second electrode, and the first electrode and the second electrode electrically connect to different blocks of the carrier portion.Type: ApplicationFiled: May 19, 2014Publication date: January 22, 2015Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Yi An SHA, Chun Teng TSENG, Yi Nuo CHEN
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Publication number: 20150008360Abstract: A heat radiating material contains components which comprise 10-45 wt % of titanium dioxide, 5-25 wt % of zirconium dioxide, 2-30 wt % of magnesium oxide, and 0.01-0.5 wt % of an oxide of rare earth metal. The heat radiating material has a heat conductivity of 0.34-1.35 W/m-K, and a radiation efficiency equal to or larger than 88% which is measured in infrared spectroscopy wavelength range 4-14 ?m and at a temperature of 40° C..Type: ApplicationFiled: December 20, 2013Publication date: January 8, 2015Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Yu Sian JHUO, Kuo Hsun Chen, Yi An Sha
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Publication number: 20140374649Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.Type: ApplicationFiled: December 20, 2013Publication date: December 25, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Kuo Hsun CHEN, Meng Chun Ko, Yi An Sha, Hsiang Yun Yang
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Publication number: 20140306605Abstract: A PTC composition comprises crystalline polymer and conductive ceramic filler dispersed therein. The crystalline polymer has a melting point less than 90° C. and comprises 5%-30% by weight of the PTC composition. The crystalline polymer comprises ethylene, vinyl copolymer or the mixture thereof. The vinyl copolymer comprises at least one of the functional group selected from the group consisting of ester, ether, organic acid, anhydride, imide or amide. The conductive ceramic filler comprises a resistivity less than 500 ??-cm and comprises 70%-95% by weight of the PTC composition. The PTC composition has a resistivity about 0.01-5 ?-cm and its resistance at 85° C. is about 103 to 108 times that at 25° C.Type: ApplicationFiled: September 4, 2013Publication date: October 16, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Kuo Chang LO, Wei Tsang Dai, Yi An Sha, Chun Teng Tseng
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Patent number: 8830027Abstract: A surface mountable thermistor comprises a resistive device, first and second electrodes, and at least one heat conductive dielectric layer. The resistive device contains first and second electrically conductive members and a polymeric material layer laminated therebetween. The polymeric material layer exhibits PTC or NTC behavior. The polymeric material layer and the first and second electrically conductive members commonly extend in a first direction. The first electrode is electrically coupled to the first electrically conductive member. The second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The heat conductivity of the first electrode or the second electrode is at least 50 W/mK. The heat conductive dielectric layer comprises polymeric insulation matrix and heat conductive filler, and is disposed between the first electrode and the second electrode. The heat conductivity of heat conductive dielectric layer is between 1.Type: GrantFiled: September 5, 2012Date of Patent: September 9, 2014Assignee: Polytronics Technology Corp.Inventors: Yi An Sha, Chun Teng Tseng, David Shau Chew Wang
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Publication number: 20140209365Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.Type: ApplicationFiled: September 4, 2013Publication date: July 31, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Tong Cheng TSAI, Wen Feng LEE, Chun Teng TSENG, Chi Jen SU, Yi An SHA
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Publication number: 20140146432Abstract: A surface mountable over-current protection device comprises one PTC material layer, first and second conductive layers, first and second electrodes, and an insulating layer. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first and second conductive layers are disposed on first and second planar surfaces of the PTC material layer, respectively. The first and second electrodes are electrically connected to the first and second conductive layers. The insulating layer is disposed between the first and the second electrodes for insulation. At the melting point of the crystalline polymer, the CTE of the crystalline polymer is greater than 100 times the CTE of the first or second conductive layer, and the first and/or second conductive layers has a thickness which is large enough to obtain a resistance jump value R3/Ri less than 1.4.Type: ApplicationFiled: June 5, 2013Publication date: May 29, 2014Inventors: DAVID SHAU CHEW WANG, WEN FENG LEE, EN TIEN YANG, CHUN TENG TSENG, YI AN SHA
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Patent number: 8687337Abstract: An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same plane. The PTC material layer is formed on the first substrate, the first grating electrode and the second grating electrode, and between the first grating electrode and the second grating electrode. In an embodiment, the first grating electrode and the second grating electrode serve as a current input port and a current output port, respectively.Type: GrantFiled: September 21, 2011Date of Patent: April 1, 2014Assignee: Polytronics Technology Corp.Inventors: Yi An Sha, David Shau Chew Wang
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Publication number: 20140063671Abstract: A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 ?-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises a pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.Type: ApplicationFiled: May 23, 2013Publication date: March 6, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Fu Hua CHU, David Shau Chew Wang, Chun Teng Tseng, Yi An Sha
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Patent number: 8652641Abstract: A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.Type: GrantFiled: May 17, 2011Date of Patent: February 18, 2014Assignee: Polytronics Technology Corp.Inventors: David Shau Chew Wang, Yi An Sha, Kuo Hsun Chen
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Publication number: 20140035719Abstract: An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm.Type: ApplicationFiled: April 19, 2013Publication date: February 6, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Wen Feng LEE, Kuo Hsun Chen, Chun Teng Tseng, Yi An Sha, Ming Hsun Lu
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Patent number: 8536973Abstract: An over-current protection device includes two metal foils and a PTC material layer. The PTC material layer is laminated between the two metal foils and has a resistivity less than 0.4 ?-cm. The PTC material layer includes crystalline polymer and electrically conductive ceramic filler dispersed in the crystalline polymer. The conductive ceramic filler is of HCP structure and includes 70-95% by weight of the PTC material layer. The trip jump value of the over-current protection device after 300 times trip is less than or equal to 25. The resistance repeatability of the device can be effectively improved by adding the conductive ceramic filler.Type: GrantFiled: June 25, 2012Date of Patent: September 17, 2013Assignee: Polytronics Technology Corp.Inventors: Kuo Chang Lo, Yao Te Chang, Ya Fang Liang, Yi An Sha, David Shau Chew Wang
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Patent number: 8525636Abstract: A thermistor includes a first electrically conductive member, a second electrically conductive member and a polymer material layer laminated therebetween. The polymer material layer exhibits positive temperature coefficient (PTC) behavior, and includes at least one crystalline polymer and at least one electrically conductive filler distributed in the crystalline polymer. The conductive filler has a resistivity less than 500 ??-cm and includes 72-96% by weight of the polymer material layer. The thermistor has a device effective area, and the value of the hold current at 60° C. divided by the device effective area is around 0.16-0.8 A/mm2. The ratio of the hold current of the thermistor at 60° C. to the hold current at 25° C. of the thermistor is 40-95%.Type: GrantFiled: April 4, 2012Date of Patent: September 3, 2013Assignee: Polytronics Technology Corp.Inventors: Yi An Sha, Kuo Chang Lo, Tsungmin Su
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Publication number: 20130200988Abstract: An over-current protection device includes two metal foils and a PTC material layer. The PTC material layer is laminated between the two metal foils and has a resistivity less than 0.4 ?-cm. The PTC material layer includes crystalline polymer and electrically conductive ceramic filler dispersed in the crystalline polymer. The conductive ceramic filler is of HCP structure and includes 70-95% by weight of the PTC material layer. The trip jump value of the over-current protection device after 300 times trip is less than or equal to 25. The resistance repeatability of the device can be effectively improved by adding the conductive ceramic filler.Type: ApplicationFiled: June 25, 2012Publication date: August 8, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: KUO CHANG LO, YAO TE CHANG, YA FANG LIANG, YI AN SHA, DAVID SHAU CHEW WANG
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Publication number: 20130200987Abstract: A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 ?m.Type: ApplicationFiled: February 3, 2012Publication date: August 8, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Yi An SHA, Chun Teng TSENG, David Shau Chew WANG
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Patent number: 8502638Abstract: A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 ?m.Type: GrantFiled: February 3, 2012Date of Patent: August 6, 2013Assignee: Polytronics Technology Corp.Inventors: Yi An Sha, Chun Teng Tseng, David Shau Chew Wang
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Publication number: 20130187748Abstract: A surface mountable thermistor comprises a resistive device, first and second electrodes, and at least one heat conductive dielectric layer. The resistive device contains first and second electrically conductive members and a polymeric material layer laminated therebetween. The polymeric material layer exhibits PTC or NTC behavior. The polymeric material layer and the first and second electrically conductive members commonly extend in a first direction. The first electrode is electrically coupled to the first electrically conductive member. The second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The heat conductivity of the first electrode or the second electrode is at least 50 W/mK. The heat conductive dielectric layer comprises polymeric insulation matrix and heat conductive filler, and is disposed between the first electrode and the second electrode. The heat conductivity of heat conductive dielectric layer is between 1.Type: ApplicationFiled: September 5, 2012Publication date: July 25, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Yi An SHA, Chun Teng Tseng, David Shau Chew Wang
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Patent number: 8446245Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 ?-cm and 0.32 ?-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 ?m and 50 ?m and a volume resistivity less than 0.1 ?-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R100/Ri is between 3 and 20.Type: GrantFiled: September 19, 2011Date of Patent: May 21, 2013Assignee: Polytronics Technology Corp.Inventors: David Shau Chew Wang, Yi An Sha, Kuo Chang Lo, Tai Kuang Hei
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Patent number: 8421584Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.Type: GrantFiled: January 17, 2012Date of Patent: April 16, 2013Assignee: Polytronics Technology Corp.Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu