Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 ?-cm and 0.32 ?-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 ?m and 50 ?m and a volume resistivity less than 0.1 ?-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R100/Ri is between 3 and 20.

Abstract: An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same plane. The PTC material layer is formed on the first substrate, the first grating electrode and the second grating electrode, and between the first grating electrode and the second grating electrode. In an embodiment, the first grating electrode and the second grating electrode serve as a current input port and a current output port, respectively.

Abstract: A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.

Abstract: Color cholesteric liquid crystal display devices and driving methods thereof are provided. A color cholesteric liquid crystal display device includes a color cholesteric liquid crystal display panel with a plurality of sub-pixels. A driving module exerts a first voltage on a portion of sub-pixels of the color cholesteric liquid crystal display panel to hold displaying states of the biased sub-pixels. An input element exerts pressure on the color cholesteric liquid crystal display panel to change displaying states of the unbiased sub-pixels.

Abstract: A display panel including a substrate, a first electrode layer, a plurality of partition structures, a liquid display medium, a cap layer, a buffer layer and a second electrode layer is provided. The first electrode layer is disposed on the substrate. The partition structures are disposed on the first electrode layer, exposing a part of the first electrode layer. The liquid display medium is disposed on the first electrode layer between the partition structures. The cap layer is formed on the liquid display medium, and a buffer layer is formed on the cap layer. The second electrode layer is disposed on the buffer layer.

Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

Abstract: An over-current protection device comprises two metal foils, a positive temperature coefficient (PTC) material layer and a packaging material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 ?-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer with a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 ??-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer. The packaging material layer which encapsulates the chip is essentially comprised of the PTC layer and the two metal foils. The packaging material layer is formed by reacting epoxy resin with a hardener having amide functional group.

Abstract: An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 ?-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer of a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 ??-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer.

Abstract: Transflective liquid crystal displays and fabrication methods thereof. A single gap transflective liquid crystal display includes a first substrate with a reflective region and a transmissive region. A second substrate opposes the first substrate with a gap therebetween. A liquid crystal layer is disposed between the first and second substrates. A color filter is disposed on the first substrate, wherein the color filter is thicker in the transmissive region than in the reflective region, wherein a recess is formed at the reflective region. A first alignment layer is conformably formed on the color filter, forming a second recess in the reflective region. The second recess is filled with a second alignment, wherein the first and second alignment layers provide different orientations and pre-tilt angles for the liquid crystal layer.

Abstract: An over-current protection device comprises two metal foils, a positive temperature coefficient (PTC) material layer and a packaging material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 ?-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer with a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 ??-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer. The packaging material layer which encapsulates the chip is essentially comprised of the PTC layer and the two metal foils. The packaging material layer is formed by reacting epoxy resin with a hardener having amide functional group.

Abstract: A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.

Abstract: A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film.

Abstract: Driving methods for cholesteric liquid crystal display devices are provided. The driving method includes providing a cholesteric liquid crystal display, wherein the capacitance detector corresponds to a driving module; outputting a capacitance sensing voltage waveform from the driving module to the cholesteric liquid crystal display panel such that a capacitance value of the cholesteric liquid crystal layer is acquired and stored in the memory; and when the capacitance value falls in a capacitance range of a second displaying state, the capacitance detector outputs a second sensing result, and when the capacitance value falls in a capacitance range of a first displaying state, the capacitance detector outputs a first sensing result.

Abstract: An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 ?-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer of a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 ??-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer.

Abstract: The invention relates to optically compensated bend (OCB) mode liquid crystal display devices and fabrication methods thereof. The OCB mode liquid crystal display includes a first substrate, a second substrate and a liquid crystal layer interposed therebetween. A first pixel electrode is disposed on the first substrate. A second pixel electrode is disposed overlying the first pixel electrode with a dielectric layer interposed therebetween such that a discontinuous fringe field is formed at the edge of the second pixel electrode. A first alignment layer is disposed on the first substrate covering the first and second pixel electrode. A common electrode is disposed on the second substrate, and a second alignment layer is disposed on the second substrate covering the common electrode.

Abstract: A display panel including a substrate, a first electrode layer, a plurality of partition structures, a liquid display medium, a cap layer, a buffer layer and a second electrode layer is provided. The first electrode layer is disposed on the substrate. The partition structures are disposed on the first electrode layer, exposing a part of the first electrode layer. The liquid display medium is disposed on the first electrode layer between the partition structures. The cap layer is formed on the liquid display medium, and a buffer layer is formed on the cap layer. The second electrode layer is disposed on the buffer layer.

Abstract: A liquid crystal display (LCD) device and a manufacture method for the same are proposed in the present invention. The LCD device of the present invention has a top substrate, a bottom substrate, an upper alignment film, a lower alignment film and a liquid crystal layer. The LCD device and the method of the present invention use different alignment materials to form the alignment films on the top and bottom substrates. Due to different properties of the alignment films, multiple liquid crystal domains with different alignment orientations are provided.

Abstract: Substrate structures, liquid crystal display devices and methods of fabricating liquid crystal display devices. A substrate structure comprises a transparent substrate having an electrode layer thereon. A first alignment layer is formed on the transparent substrate. A second alignment layer is selectively formed on the first alignment, wherein alignment orientations of liquid crystal molecules on the first and second alignment layers are different.

Abstract: A display-enabled electronic system. The display-card electronic comprises an external device and card-type device receiving the external device. The external device provides a data signal. The card-type device comprises a card body, at least one image display unit, and an interface. The card body comprises a display surface and a receiving portion. The image display unit disposed in the display surface displays corresponding images in response to the data signal. The interface disposed in the receiving portion, electrically connects to the external device to transmit the data signal.

Abstract: Horizontal-switching flexible liquid crystal displays (LCD) and fabrication methods thereof are provided. The horizontal-switching flexible liquid crystal display includes a flexible first substrate, a second substrate and a liquid crystal (LC) layer interposed therebetween. The LC layer consists of liquid crystal molecules affected by a horizontal field and divided into an upper portion and a lower portion. At least one pair of a patterned pixel electrode and a common electrode is disposed on the first substrate. The pixel electrode and the common electrode are formed on the same plane, thereby generating a horizontal field during operation. First and second alignment layers allow the LC molecules of the LC layer to be in a substantially vertical alignment. The phase retardation of the horizontal-switching LCD is due to the lower portion of the LC layer.