Patents by Inventor Yi-Chen Chen
Yi-Chen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260124600Abstract: A water-absorbing composite with a biodegradability includes an egg white composition, an acylation reagent, and a crosslinking reagent. The egg white composition contains a plurality of proteins with an amount between 3 wt % and 5 wt %. The acylation reagent reacts with a part of amines of the proteins of the egg white composition, so that the egg white composition has a plurality of hydrophilic groups. A weight ratio of the acylation reagent to the proteins is between 0.05 g/g and 0.5 g/g. The crosslinking reagent bonds to another part of amines of the proteins of the egg white composition or a part of hydroxyl groups of the proteins of the egg white composition. A weight ratio of the crosslinking reagent added to the protein solution to the proteins is between 0.1 g/g and 0.7 g/g. A manufacturing method of the water-absorbing composite with the biodegradability is also provided.Type: ApplicationFiled: January 15, 2025Publication date: May 7, 2026Applicant: National Taiwan UniversityInventors: YI-CHEN CHEN, YU-SHAN CHANG
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Patent number: 12613946Abstract: Example electronic devices are disclosed. In some examples, the electronic device includes a display panel, an image sensor, and a controller coupled to the image sensor. The controller is to use the image sensor to detect an interaction between a first viewer of the display panel and a second viewer of the display panel. In addition, the controller is to determine whether the second viewer is authorized to view information presented on the display panel based on the interaction. Further, the controller is to adjust a presentation of the information on the display panel based on the determination.Type: GrantFiled: August 6, 2020Date of Patent: April 28, 2026Assignee: Hewlett-Packard Development Company, L.P.Inventors: Lee Warren Atkinson, Yi-Chen Chen, Chen-Fang Hsu
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Publication number: 20260066371Abstract: A cylindrical battery sorting system includes a host, a conveying device, a sorting device, an acceleration device, and a camera device. The conveying device is electrically connected to the host, includes rollers disposed side by side, and has a feeding area, an acceleration area, and a sorting area. The sorting device is electrically connected to the host and disposed corresponding to the sorting area. The acceleration device is electrically connected to the host and disposed in the acceleration area. The camera device is electrically connected to the host and disposed corresponding to the acceleration area. When a battery enters a capturing area, the camera device moves synchronously with rolling of the battery to capture an image of the rolling battery, and transmit the image back to the host to determine type of the battery. The sorting device places the battery into a corresponding recycling area according to the captured image.Type: ApplicationFiled: December 17, 2024Publication date: March 5, 2026Applicant: Industrial Technology Research InstituteInventors: Feng-Sheng Kao, Jen-You Chu, Cheng-Lin Li, Jr-Chiun Yu, Yi-Chen Chen
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Publication number: 20250327973Abstract: A semiconductor device is provided. The semiconductor device includes a waveguide over a substrate. The semiconductor device includes a first dielectric structure over the substrate, wherein a portion of the waveguide is in the first dielectric structure. The semiconductor device includes a second dielectric structure under the waveguide, wherein a first sidewall of the second dielectric structure is adjacent a first sidewall of the substrate.Type: ApplicationFiled: June 30, 2025Publication date: October 23, 2025Inventors: Yi-Chen CHEN, Lee-Chuan TSENG, Shih-Wei LIN
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Publication number: 20250318153Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a capacitor. The capacitor is disposed over a semiconductor substrate. The capacitor includes a plurality of electrodes and a plurality of capacitor dielectric layers vertically stacked over one another. A contact structure overlies the plurality of electrodes, wherein the contact structure continuously extends from above a top surface of the plurality of electrodes to contact a first electrode in the plurality of electrodes. A first conductive via overlies and contacts the contact structure, wherein the first conductive via is directly electrically coupled to the first electrode by way of the contact structure.Type: ApplicationFiled: June 19, 2025Publication date: October 9, 2025Inventors: Yi-Chen Chen, Ming Chyi Liu
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Publication number: 20250275838Abstract: The present invention provides a dental crown model generation method and a dental crown model generation system. The method includes: retrieving preset dental shape data including multiple geometric features based on the target position of the treated tooth; adjusting the preset dental shape using rotation, stretching, and translation parameters to obtain the adjusted geometric features; scoring the matching degree between the adjusted geometric feature and multiple conditional operations; performing weighted calculations on the scores to obtain a denture score; if the denture score is below a threshold score, inputting the denture score into a parameter correction artificial intelligence unit to obtain new rotation, stretching, and translation parameters, and continuing the adjustment until the denture score exceeds the threshold score; and using the dental shape corresponding to the final parameters as the final dental crown model for the patient.Type: ApplicationFiled: February 27, 2025Publication date: September 4, 2025Inventors: Cheng-Kang Chou, Hsiao-Yang Liu, Yi-Chen Chen, Da-Rong Liu
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Patent number: 12345920Abstract: A semiconductor device is provided. The semiconductor device includes a waveguide over a substrate. The semiconductor device includes a first dielectric structure over the substrate, wherein a portion of the waveguide is in the first dielectric structure. The semiconductor device includes a second dielectric structure under the waveguide, wherein a first sidewall of the second dielectric structure is adjacent a first sidewall of the substrate.Type: GrantFiled: March 4, 2024Date of Patent: July 1, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Yi-Chen Chen, Lee-Chuan Tseng, Shih-Wei Lin
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Publication number: 20250199224Abstract: An optical film includes a plurality of alternating first and second polymeric layers, such that the first polymeric layers have a smaller average in-plane index of refraction than the second polymeric layers and the first polymeric layers have a glass transition temperature of at least 107 deg. C. The optical film may be a reflective polarizer. An optical stack includes a linear absorbing polarizer and the reflective polarizer disposed on, and bonded to, the absorbing polarizer. The reflective polarizer may have an optical reflectance of at least 60% for a first polarization state and an optical transmittance of at least 60% for an orthogonal second polarization state. When heated at 105 deg. C. for 15 minutes, a difference in shrinkage of the reflective polarizer and the absorbing polarizer along the first and second polarization states may be greater than about zero and 0.2%, respectively.Type: ApplicationFiled: March 6, 2025Publication date: June 19, 2025Inventors: Adam D. Haag, Yi-Chen Chen, Tze Yuan Wang, Hiroki Matsuda, Michelle L. Toy, Ryan J. Eismin, John F. VanDerlofske, III, David J. McDaniel, Matthew B. Johnson
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Publication number: 20250182293Abstract: An image processing method, applied to an image processing device, comprising: (a) deciding a first reference size of at least one reference region of an input image based on a computational resource of the image processing device or task types of tasks which are being processed by the image processing device; and (b) processing at least portion of the input image based on the reference region to generate a processed image.Type: ApplicationFiled: November 28, 2024Publication date: June 5, 2025Applicant: MEDIATEK INC.Inventors: Kuang-Hung Chien, Yu-Chun Chen, Yi-Chen Chen, Sheng-Po Kuo, Chia-Ping Chen, Hui Ouyang, Yu-Cheng Chu
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Patent number: 12321520Abstract: A haptic feedback method for an electronic system includes pairing an electronic device with a first wireless communication module and an input device with a second wireless communication module and a haptic feedback motor unit, inputting a control signal to the electronic device through the input device, and sending a wireless motor driving signal to the second wireless communication module of the input device by the first wireless communication module of the electronic device according to the control signal, so that the second wireless communication module generates a wired motor driving signal according to the wireless motor driving signal and directly transmits the wired motor driving signal to the haptic feedback motor unit to directly enable vibration of the haptic feedback motor unit.Type: GrantFiled: July 6, 2023Date of Patent: June 3, 2025Assignee: Silicon Integrated Systems Corp.Inventors: Yi-chen Chen, Min-han Lee, Kun-tien Ting
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Patent number: 12271015Abstract: An optical film includes a plurality of alternating first and second polymeric layers, such that the first polymeric layers have a smaller average in-plane index of refraction than the second polymeric layers and the first polymeric layers have a glass transition temperature of at least 107 deg. C. The optical film may be a reflective polarizer. An optical stack includes a linear absorbing polarizer and the reflective polarizer disposed on, and bonded to, the absorbing polarizer. The reflective polarizer has an optical reflectance of at least 60% for a first polarization state and an optical transmittance of at least 60% for an orthogonal second polarization state. When heated at 105 deg. C. for 15 minutes, a difference in shrinkage of the reflective polarizer and the absorbing polarizer along the first and second polarization states is greater than about zero and 0.2%, respectively.Type: GrantFiled: May 20, 2020Date of Patent: April 8, 2025Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Adam D. Haag, Yi-Chen Chen, Tze Yuan Wang, Hiroki Matsuda, Michelle L. Toy, Ryan J. Eismin, John F. VanDerlofske, III, David J. McDaniel, Matthew B. Johnson
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Publication number: 20250113497Abstract: Various embodiments of the present disclosure are directed towards a trench capacitor with a trench pattern for yield improvement. The trench capacitor is on a substrate and comprises a plurality of capacitor segments. The capacitor segments extend into the substrate according to the trench pattern and are spaced with a pitch on an axis. The plurality of capacitor segments comprises an edge capacitor segment at an edge of the trench capacitor and a center capacitor segment at a center of the trench capacitor. The edge capacitor segment has a greater width than the center capacitor segment and/or the pitch is greater at the edge capacitor segment than at the center capacitor segment. The greater width may facilitate stress absorption and the greater pitch may increase substrate rigidity at the edge of the trench capacitor where thermal expansion stress is greatest, thereby reducing substrate bending and trench burnout for yield improvements.Type: ApplicationFiled: December 9, 2024Publication date: April 3, 2025Inventors: Yuan-Sheng Huang, Yi-Chen Chen
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Patent number: 12205982Abstract: Various embodiments of the present disclosure are directed towards a trench capacitor with a trench pattern for yield improvement. The trench capacitor is on a substrate and comprises a plurality of capacitor segments. The capacitor segments extend into the substrate according to the trench pattern and are spaced with a pitch on an axis. The plurality of capacitor segments comprises an edge capacitor segment at an edge of the trench capacitor and a center capacitor segment at a center of the trench capacitor. The edge capacitor segment has a greater width than the center capacitor segment and/or the pitch is greater at the edge capacitor segment than at the center capacitor segment. The greater width may facilitate stress absorption and the greater pitch may increase substrate rigidity at the edge of the trench capacitor where thermal expansion stress is greatest, thereby reducing substrate bending and trench burnout for yield improvements.Type: GrantFiled: November 17, 2023Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yuan-Sheng Huang, Yi-Chen Chen
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Publication number: 20250011423Abstract: Soluble TREML1 is involved in many inflammatory diseases and plays an important role in immune suppression. Soluble TREML1 can bind the l-domain of CD11b and induce an immune suppressive phenotype. Thus, soluble TREML1 may be a good target for treating inflammatory diseases. The present invention relates to antibodies that can reduce soluble TREML1 binding to CD11b+ immune cells and their uses for reversing TREML14 induced immune suppression. Anti-TREML1 antibodies provide a novel and potential therapy for these disease conditions such as cancer.Type: ApplicationFiled: November 15, 2022Publication date: January 9, 2025Applicant: Ascendo Biotechnology, Inc.Inventors: Yen-Ta Lu, Chia-Ming Chang, Yi-Chen Chen, I-Fang Tsai
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Publication number: 20240372018Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a first doped region disposed in a semiconductor substrate and a second doped region disposed in the semiconductor substrate. A photodetector is disposed between the first doped region and the second doped region. The photodetector has a lower surface that arcs between opposing sidewalls of the photodetector in a cross-sectional view. The first doped region and the second doped region contact the lower surface of the photodetector.Type: ApplicationFiled: July 17, 2024Publication date: November 7, 2024Inventors: Chen-Hao Chiang, Shih-Wei Lin, Eugene I-Chun Chen, Yi-Chen Chen
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Patent number: 12136679Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a first doped region having a first doping type disposed in a semiconductor substrate. A second doped region having a second doping type different than the first doping type is disposed in the semiconductor substrate and laterally spaced from the first doped region. A waveguide structure is disposed in the semiconductor substrate and laterally between the first doped region and the second doped region. A photodetector is disposed at least partially in the semiconductor substrate and laterally between the first doped region and the second doped region. The waveguide structure is configured to guide one or more photons into the photodetector. The photodetector has an upper surface that continuously arcs between opposite sidewalls of the photodetector. The photodetector has a lower surface that continuously arcs between the opposite sidewalls of the photodetector.Type: GrantFiled: May 3, 2023Date of Patent: November 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hao Chiang, Shih-Wei Lin, Eugene I-Chun Chen, Yi-Chen Chen
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Publication number: 20240210624Abstract: A semiconductor device is provided. The semiconductor device includes a waveguide over a substrate. The semiconductor device includes a first dielectric structure over the substrate, wherein a portion of the waveguide is in the first dielectric structure. The semiconductor device includes a second dielectric structure under the waveguide, wherein a first sidewall of the second dielectric structure is adjacent a first sidewall of the substrate.Type: ApplicationFiled: March 4, 2024Publication date: June 27, 2024Inventors: Yi-Chen CHEN, Lee-Chuan TSENG, Shih-Wei LIN
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Patent number: D1053195Type: GrantFiled: September 27, 2021Date of Patent: December 3, 2024Assignee: CHENBRO MICOM CO., LTD.Inventors: Hsin-Lin Teng, Yi-Chen Chen
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Patent number: D1055907Type: GrantFiled: October 5, 2021Date of Patent: December 31, 2024Assignee: CHENBRO MICOM CO., LTD.Inventors: Hsin-Lin Teng, Yi-Chen Chen
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Patent number: D1056919Type: GrantFiled: September 22, 2021Date of Patent: January 7, 2025Assignee: CHENBRO MICOM CO., LTD.Inventors: Hsin-Lin Teng, Yi-Chen Chen