Abstract: The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor further records defect pixels of a pixel array such that in integrating pixel data to integrators, the pixel data associated with the defect pixels is not integrated into corresponding integrators.

Abstract: The present disclosure discloses a sound device includes a frame, a magnet system, and a first vibration system and a second vibration system arranged on two sides of a magnet system. The magnet system includes a first central yoke, a central magnet mounted on the first central yoke, a side yoke surrounding the central magnet and fixed to the frame, and a connection portion connecting the first central yoke and the side yoke. The side yoke includes a first side yoke fixed to the frame and a second side yoke bending and extending from an edge of the first side yoke towards the central magnet; the connection portion connects the first central yoke and the second side yoke. The sound device in the present disclosure has higher magnetic ability and miniaturization ability.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A sound generator provided in the present disclosure includes a frame, a magnetic circuit unit, and a first vibration unit and a second vibration unit arranged on two sides of the magnetic circuit unit. The magnetic circuit unit includes a first central magnetic yoke in the middle, a central magnet fixed to the first central magnetic yoke, a magnetic component arranged around the central magnet and fixed to the frame, and a connecting portion connecting the first central magnetic yoke to the magnetic component. The central magnet includes a first magnet portion fixed to the first central magnetic yoke and a second magnet portion fixed to the side of the first magnet portion away from the first central magnetic yoke, a projection area of the first magnet portion along a vibrating direction is greater than a projection area of the second magnet portion along the vibrating direction.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: Lithium difluorophosphate, a preparation method therefor, and an application thereof. Lithium hexafluorophosphate and silicon tetrachloride are utilized to generate lithium difluorotetrachloro phosphate, then lithium difluorotetrachloro phosphate reacts with lithium carbonate to obtain a mixture of lithium difluorophosphate and lithium chloride, and then the mixture is purified to obtain high-purity lithium difluorophosphate. The method has simple steps, low cost, short reaction time, and a high conversion rate.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: A combined bio-artificial liver support system, includes branch tubes that are connected in sequence: a blood input branch tube, an upstream tail end, a first plasma separation branch tube comprising at least a first plasma separator, a non-biological purification branch tube comprising at least a plasma perfusion device and a bilirubin adsorber, a biological purification branch tube comprising at least a hepatocyte culture cartridge assembly, and a plasma return branch tube, a downstream tail end of which is set as a blood output end.

Abstract: A semiconductor device includes a first source/drain feature on a front side of a substrate. The device includes a first backside metal line under the first source/drain feature and extending lengthwise along a first direction. The device includes a first backside via disposed between the first source/drain feature and the first backside metal line. The first backside metal line is a first bit line of a first static random access memory (SRAM) cell and is connected to the first source/drain feature through the first backside via. The first backside metal line includes a first portion and a second portion each extending widthwise along a second direction perpendicular to the first direction, the first portion is wider than the second portion, and the first portion partially lands on the first backside via. The first and the second portions are substantially aligned on one side along the first direction.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: The present invention relates compounds of Formula (A) as NK-1 receptor antagonists, as well as their preparation and uses, and further relates pharmaceutical compositions comprising these compounds and their uses as modulators of dysfunctional glutamate transmission. The present invention also relates to the uses of the compounds or pharmaceutical compositions in treating or preventing certain disorders and diseases which relate to NK-1 receptor in humans. More specifically, the compounds and/or pharmaceutical compositions of the present invention are believed to potentially offer therapeutic benefits to patients who suffer, among others, chemotherapy-induced nausea and vomit (CINV) and/or post-operative nausea and vomit (PONV).

Abstract: A semiconductor device includes a first to sixth regions, a first gate, a first metal contact and a second metal contact. The second region is disposed opposite to the first region with respect to the first gate. The first metal contact couples the first region to the second region. The fourth region is disposed opposite to the third region with respect to the first gate. The second metal contact is coupling the third region to the fourth region. The fifth region is disposed between the first gate and the second region, and is disconnected from the first metal contact and the second metal contact. The sixth region is disposed between the first gate and the first region, and is disconnected from the first metal contact and the second metal contact.

Abstract: A transfer system for wafer cassettes includes a tray and a rail compatible with the tray. The tray includes a base plate, a through hole, a wall, and a pair of first positioning features. The through hole is disposed on a center of the base plate, in which the through hole has a first direction axis and a second direction axis perpendicular to the first direction axis. The wall extends from a surface of the base plate and surrounding the through hole, in which the wall separates the base plate into an interior region and an exterior region. The pair of first positioning features having a first level height are in the interior region and arranged parallel to the first direction axis.

Abstract: A link status measurement method includes: A first OLT sends first indication information to a first ONU through a first port. The first ONU is one of at least one ONU included in a PON, and the first indication information indicates a measurement window for measuring the first ONU. The first OLT obtains quality of a signal corresponding to the first ONU. The quality of the signal is quality of a signal received by a second port on a second OLT from a first PON channel in a measurement window, and the first PON channel is a channel carried on a link between the second port and the first ONU. The first OLT determines a status of a backbone link based on quality of a signal corresponding to each ONU in the PON. The backbone link is a common part of a link from the second port to each ONU.

Abstract: A lens device including a lens barrel, a lens, a linear reciprocating motion mechanism, and a power machine is provided. The lens is disposed in the lens barrel. The linear reciprocating motion mechanism includes a first movable part and a second movable part. The first movable part is coupled to the lens barrel. The second movable part is coupled to the first movable part. The power machine is coupled to the second movable part to drive the second movable part to rotate, thereby driving the first movable part, and the first movable part drives the lens barrel to perform a linear reciprocating motion, wherein when the second movable part is rotated by N turns, the first movable part is rotated by one turn, and N is greater than or equal to 10.

Abstract: The present application provides a system for unmanned aerial vehicle (UAV) parachute landing. An exemplary system includes a detector configured to detect at least one of a flight speed, a wind speed, a wind direction, a position, a height, and a voltage of a UAV. The system also includes a memory storing instructions and a processor configured to execute the instructions to cause the system to: determine whether to open a parachute of the UAV in accordance with a criterion, responsive to the determination to open the parachute of the UAV, stop a motor of the UAV that spins a propeller of the UAV, and open the parachute of the UAV after stopping the motor of the UAV for a first period.

Abstract: A reciprocating aquaponic device includes a housing, a bell-shaped siphon, and a water pump. The housing defines a water inlet space, and a tidal space and a planting space in fluid communication with the water inlet space. The housing includes a mounting wall over the tidal space, and an inclined wall under the tidal space. The inclined wall is inclined downward toward the planting space. The bell-shaped siphon is dispose on the mounting wall and is disposed for moving water from the water inlet space through the siphon opening and into the tidal space. The water pump is disposed in the fish tank for drawing water from the fish tank into the water inlet space.

Abstract: Labels that include dibromopyridazinedione attached to signal molecules are disclosed, along with methods of producing and using same. Also disclosed are conjugates of the label attached to an analyte-specific binder, as well as methods of producing and using same. Kits containing the labels and/or conjugates are also disclosed, along with microfluidics devices containing same.

Abstract: The invention provides a semiconductor structure, which comprises a chip comprising a substrate, wherein the substrate has a front surface and a back surface, and the front surface of the substrate comprises a circuit layer, the back surface of the substrate comprises a plurality of microstructures, and a thermal interface material located on the back surface of the substrate, and the thermal interface material contacts the microstructures directly.