Abstract: An interleaved three-phase Y-Delta connected power converter is provided. The interleaved three-phase Y-Delta connected power converter includes an input voltage source, an input capacitor, a first converter module, a second converter module, an output circuit, and a control circuit. The control circuit calculates a phase shift amount and an operating frequency through voltage and current feedbacks to generate a plurality of switch signal groups for controlling the first converter module and the second converter module, respectively.

Abstract: A power system including a gate driver configured with test circuitry to detect faults is disclosed. The power system may be configured to test the fault detection circuitry in order to confirm its ability to detect faults. Various methods and circuit implementations are disclosed to determine the ability of the system to detect faults. The testing may include different configurations and protocols in order to make conclusions about which components are likely responsible for a failure. These components may include components included in the gate driver or externally coupled to the gate driver. The disclose approach does not significantly add complexity because a test input to initiate a test may be communicated from a low voltage side to a high voltage side over a shared communication channel.

Abstract: A disclosed method for secured multi-payload antennas operators operations comprises generating, by an antenna operations center (AOC), AOC commands using an antenna location pointing request for each of at least one antenna associated with each of at least one customer. The method further comprises transmitting, by a satellite operation center (SOC), the AOC commands and SOC commands to a vehicle via a ground antenna, where the SOC commands are related to at least one antenna associated with a host. Also, the method comprises generating customer antenna gimballing commands by using the AOC commands, and generating host antenna gimballing commands by using the SOC commands. Further, the method comprises gimballing respectively each of the antenna(s) associated with each of the customer(s) by using the customer antenna gimballing commands, and gimballing respectively each of the antenna(s) associated with the host by using the host antenna gimballing commands.

Abstract: The present invention discloses a noise reduction touch light adjustment device including a light adjustment film, a capacitive touch panel, a noise reduction film, a glass substrate, a control circuit module, and an alternating current (AC) transformer. The noise reduction film is disposed between the light adjustment film and the capacitive touch panel to lower noise inputted from the AC transformer into the light adjustment film such that the capacitive touch panel is ensured to be operated precisely.

Abstract: The present invention relates compounds of Formula (A) as 113R antagonists, as well as their preparation and uses, and further relates pharmaceutical compositions comprising these compounds and their uses as modulators of Histamine 3 Receptor (H3R) functions. The present invention also relates to the uses of the compounds or pharmaceutical compositions in treating or preventing certain disorders and diseases which relate to H3R functions in humans.

Abstract: A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.

Abstract: An integrated circuit (IC) may include a plurality of functional blocks, and each functional block of the plurality of functional blocks may include hardware circuits, wherein the plurality of functional blocks may include a first functional block. In addition, the first functional block may include a first macro circuit that is positioned within a first sub-region of the first functional block, wherein among multiple sides of the first sub-region, a first side of the first sub-region is closest to a boundary of the first functional block. Additionally, a first intermediate sub-region of the first functional block is positioned between the first side of the first sub-region and the boundary of the first functional block, and there is no tap cell in the first intermediate sub-region of the first functional block.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: An integrated circuit includes a semiconductor substrate, devices, first tap regions, and second tap regions. The devices are over the semiconductor substrate. The first tap regions are over the semiconductor substrate along a first direction. The second tap regions are over the semiconductor substrate along the first direction. A first pitch between adjacent two of the first tap regions in the first direction is greater than a second pitch between adjacent two of the second tap regions in the first direction.

Abstract: A sound wave transducer is provided. The sound wave transducer includes a first board, a spacer layer and a second board over the first board and the spacer layer. The first board includes a carrier, a first substrate layer and a first metal layer. The carrier has a first opening formed in a central region. The first substrate layer is disposed on the carrier and over the first opening. The first metal layer is disposed on the first substrate layer. The spacer layer is disposed on the first board and surrounds the central region. The second board includes a second substrate layer, a second metal layer disposed on the spacer layer, and a plurality of second openings penetrating through the second substrate layer and the second metal layer.

Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.

Abstract: The present disclosure relates to a composition for printing a three-dimensional object. The composition comprises composite particles comprising a thermoplastic polymer and a colour-masking pigment. The colour-masking pigment is encapsulated by the thermoplastic polymer and is present in an amount of from about 1.5 to less than about 6 wt % of the total weight of the composite particles.

Abstract: A touch indicating cover includes a light-guide plastic piece, a printed circuit layer, an ink layer, a passivation layer, and a light-emitting component. The light-guide plastic piece has a first surface and a second surface opposite to each other, wherein the second surface of the light-guide plastic piece comprises a plurality of microstructures. The printed circuit layer is disposed on the first surface of the light-guide plastic piece. The ink layer is disposed on the printed circuit layer and the first surface of the light-guide plastic piece, wherein the ink layer comprises a light-emitting pattern region corresponding to the microstructures. The passivation film is disposed on the ink layer. The light-emitting component is embedded in the first surface of the light-guide plastic piece and connected to the printed circuit layer, wherein the light-emitting component is disposed adjacent the light-emitting pattern region.

Abstract: A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate. The method also includes forming an etchable covering channel layer on the isolation layer, forming a patterning protection layer on the covering channel layer, forming etching channels in the covering channel layer using a first etching process, and removing the corners of the isolation layer by etching the isolation layer using a second etching process. Following the second etching process the isolation layer covers the sidewall P-N junctions. The method can also include bonding the growth substrate to a carrier and separating the growth substrate from the light emitting diode (LED) structures using a laser lift off (LLO) process.

Abstract: Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

Abstract: Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

Abstract: Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: The present invention relates compounds of Formula (A) as H3R antagonists, as well as their preparation and uses, and further relates pharmaceutical compositions comprising these compounds and their uses as modulators of Histamine 3 Receptor (H3R) functions. The present invention also relates to the uses of the compounds or pharmaceutical compositions in treating or preventing certain disorders and diseases which relate to H3R functions in humans.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.